Composite material

Patent metadata

Field	Value
Publication number	US-11739284-B2
Application number	US-202017764269-A
Country	US
Kind code	B2
Filing date	Sep 23, 2020
Priority date	Sep 30, 2019
Publication date	Aug 29, 2023
Grant date	Aug 29, 2023

Abstract

A composite material comprising a plurality of polymer chains fixed to a base and swelled with a mixture which contains a salt and a hydrogen bond-donating compound and has a melting point maintained at 100° C. or less.

First claim

The invention claimed is:

1. A composite material comprising a plurality of polymer chains fixed to a substrate and swelled with a mixture which contains a salt and a hydrogen bond-donating compound and has a melting point maintained at 100° C. or less, wherein the mixture has a melting point lower than that of the salt as a constituent of the mixture and that of the hydrogen bond-donating compound as a constituent of the mixture.

2. The composite material according to claim 1 , wherein the melting point of the mixture is maintained at 100° C. or less by mixing the salt and the hydrogen bond-donating compound to provide lowering of a eutectic melting point.

3. The composite material according to claim 1 , wherein the mixture further contains a third component having compatibility with the salt and the hydrogen bond-donating compound.

4. The composite material according to claim 1 , wherein the salt contained in the mixture is solid at normal temperature (25° C.) and the hydrogen bond-donating compound contained therein is solid at normal temperature (25° C.).

5. The composite material according to claim 1 , wherein the salt and the hydrogen bond-donating compound constitute the mixture in a molar ratio of “salt:hydrogen bond-donating compound” of 1:0.5 to 1:12.

6. The composite material according to claim 1 , wherein the salt in the mixture is a compound represented by General Formula (1) or (2):

(where in General Formulae (1) and (2), R 1 to R 8 each independently represent a C 1 to C 12 alkyl group, a C 6 to C 12 aryl group, a group represented by —(CH 2 ) m —OR 9 (where R 9 is a C 1 to C 4 alkyl group, and m is 1 to 4), a group represented by —(CH 2 ) n —OH (where n is an integer of 1 to 4), a group represented by —(CH 2 ) p —OC(═O)R 10 (where R 10 is a C 1 to C 4 alkyl group, and p is 1 to 4), or —(CH 2 ) q —Y 1 (where Y 1 is a halogen element, and q is 1 to 4), and X − is a monovalent anion).

7. The composite material according to claim 1 , wherein the plurality of polymer chains is covalently fixed onto the substrate.

8. The composite material according to claim 7 , wherein the plurality of polymer chains has a molecular weight distribution (Mw/Mn) of 1.5 or less.

9. The composite material according to claim 7 , wherein the area coverage of the plurality of polymer chains is 10% or more of the area of the substrate surface.

10. The composite material according to claim 1 , wherein a layer containing the plurality of polymer chains and the mixture is formed on the substrate, the layer having a thickness of 500 nm or more.

11. The composite material according to claim 1 , wherein the plurality of polymer chains are polymer graft chains branched from a main polymer chain.

12. The composite material according to claim 1 , wherein the plurality of polymer chains forms a cross-linked structure.

13. The composite material according to claim 1 , wherein the plurality of polymer chains each have an ionically dissociable group.

14. The composite material according to claim 1 , wherein the hydrogen bond-donating compound is at least one selected from the group consisting of aliphatic polyhydric alcohols, urea compounds, and imidazole compounds.

15. A composite material comprising a plurality of polymer chains fixed to a substrate and swelled with a mixture which contains a salt and a hydrogen bond-donating compound and has a melting point maintained at 100° C. or less, wherein the melting point of the mixture is maintained at 100° C. or less by mixing the salt and the hydrogen bond-donating compound to provide lowering of a eutectic melting point.

Assignees

• Nisshinbo Holdings Inc
• National Institute Of Tech

Inventors

• Kubota Satoshi
• Masuda Gen
• Sato Takaya
• Arafune Hiroyuki

Classifications

• C10M169/04 Primary

  Mixtures of base-materials and additives · CPC title

• C10M107/50

  containing silicon · CPC title

• C10M125/18

  Compounds containing halogen · CPC title

• C10M129/08

  containing at least 2 hydroxy groups · CPC title

• C10M133/06

  having amino groups bound to acyclic or cycloaliphatic carbon atoms · CPC title