Method for embossing a component

Patent metadata

Field	Value
Publication number	US-11738500-B2
Application number	US-202016821989-A
Country	US
Kind code	B2
Filing date	Mar 17, 2020
Priority date	Mar 18, 2019
Publication date	Aug 29, 2023
Grant date	Aug 29, 2023

Abstract

The present disclosure concerns a method for embossing a component, a method for connecting a component to a second component via a substance-to-substance bond, and a device, e.g., a heat exchanger, having such a component. The method for embossing includes embossing a support groove into the component at least in some sections at a first surface portion of the component; embossing a functional groove into the component at the first surface portion; wherein the functional groove is arranged spaced apart from the support groove at least in some sections; and wherein the functional groove is formed for partially receiving a second component for a substance-to-substance bond.

First claim

The invention claimed is:

1. A method for embossing a component having at least a first surface portion and a second surface portion, the first surface portion and the second surface portion located opposite to one another and spaced apart from one another, the method comprising:
embossing a first support groove into the component at least in some sections at the first surface portion,
embossing a functional groove into the component at the first surface portion,
wherein the functional groove is arranged spaced apart from the first support groove at least in some sections, and the first support groove is embossed into the component at the first surface portion with a cross sectional shape different from that of the functional groove to reduce a flowing of a material portion of the component parallel to the first surface portion during the embossing of the functional groove, and
wherein embossing the functional groove includes forming the functional groove for partially receiving a second component for a substance-to-substance bond.

2. The method according to claim 1 , further comprising:
embossing a second support groove into the component at least in some sections at the first surface portion,
wherein the first support groove and the second support groove are arranged spaced apart from one another at least in some sections, and
wherein the functional groove is arranged between the first support groove and the second support groove at least in some sections and is arranged spaced apart from the first support groove and the second support groove.

3. The method according to claim 1 , wherein at least one of:
the functional groove is formed for partially receiving the second component for at least one of a soldering process and during a soldering process, and
the functional groove is formed for partially receiving the second component for at least one of an adhesive process and during an adhesive process.

4. The method according to claim 1 , wherein:
a second support groove is embossed into the component at the first surface portion with a cross sectional shape different from that of the functional groove, and
the second support groove reduces a flowing of a material portion of the component parallel to the first surface portion during the embossing of the functional groove.

5. The method according to claim 1 , wherein at least one of the embossing of the first support groove takes place via a first embossing tool portion, and a second support groove is embossed into the component at the first surface portion via a second embossing tool portion,
wherein the embossing of the functional groove takes place via a third embossing tool portion, and
wherein the first embossing tool portion and the second embossing tool portion reduce a flowing of a material portion of the component parallel to the first surface portion during the embossing of the functional groove.

6. The method according to claim 5 , wherein at least one of the first embossing tool portion is in the first support groove and the second embossing tool portion is in the second support groove during the embossing of the functional groove.

7. The method according to claim 1 , wherein the functional groove and at least one of the first support groove and a second support groove embossed into the component at the first surface portion are aligned essentially parallel to one another at least in some sections.

8. The method according to claim 1 , wherein the functional groove has a cross section provided by a first side wall and a second side wall, wherein the first side wall and the second side wall are arranged spaced apart from one another and are aligned essentially parallel to one another.

9. The method according to claim 1 , wherein the functional groove has a rectangular cross section.

10. The method according to claim 1 , wherein at least one of the first support groove and a second support groove embossed into the component at the first surface portion each have a trapezoidal cross section.

11. The method according to claim 1 , wherein the functional groove has a width that is larger than a distance between the functional groove and at least one of the first support groove and a second support groove embossed into the component at the first surface portion.

12. The method according to claim 1 , wherein at least one of the first support groove and a second support groove embossed into the component at the first surface portion have a respective width that is smaller than a width of the functional groove.

13. The method according to claim 1 , wherein the component has a wall thickness, and wherein a depth of the functional groove corresponds to up to 45% of the wall thickness.

14. The method according to claim 1 , wherein the functional groove has a width that corresponds to at least a wall thickness of the component.

15. The method according to claim 1 , wherein at least one of a beginning of the embossing of the first support groove and a beginning of embossing a second support groove into the component at the first surface portion is performed at a time before beginning the embossing of the functional groove.

16. The method according to claim 1 , wherein the second surface portion is free from embossment.

17. The method according to claim 1 , wherein:
at least one of the functional groove, the first support groove, and a second support groove provided at the first surface portion are respectively embossed into at least one of a planar component and a flat component, and
wherein the at least one of the planar component and the flat component is subsequently bent at least in some sections after the embossing.

18. A method for connecting a first component to a second component via a substance-to-substance bond, comprising:
embossing a first support groove into the first component at a first surface portion, the first component having a second surface portion disposed opposite to and spaced apart from the first surface portion,
forming a functional groove in the first component for partially receiving the second component, wherein the functional groove is formed at the first surface portion spaced apart from the first support groove, and the first support groove is embossed into the component at the first surface portion with a cross sectional shape different from that of the functional groove to reduce a flowing of a material portion of the component parallel to the first surface portion during the embossing of the functional groove,
inserting the second component at least partially into the functional groove such that at least one solder gap or at least one adhesive gap forms between the functional groove and the second component, and
introducing a soldering agent into the at least one solder gap or an adhesive into the at least one adhesive gap to solder or adhere the first component to the second component.

19. The method according to claim 1 , wherein the first support groove has a width that reduces in a direction towards the second surface portion.

20. The method according to claim 1 , further comprising:
inserting the second component at least partially into the functional groove such that at least one solder gap or at least one adhesive gap forms between the functional groove and the second component, and
introducing a soldering agent into the at least one solder gap or an adhesive into the at least one adhesive gap to solder or adhere the first component to the second component.

Assignees

• Mahle Int Gmbh

Inventors

• Hassdenteufel Klaus
• Schill Stefan
• Schleicher Daniel

Classifications

• B29C59/022 Primary

  characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor · CPC title

• B29C59/005

  characterised by the choice of material · CPC title

• B29L2031/18

  Heat-exchangers or parts thereof · CPC title

• B21D17/02 Primary

  by pressing (grooving or notching of bolts, studs, or the like B21K1/54) · CPC title

• B29C59/007 Primary

  Forming single grooves or ribs, e.g. tear lines, weak spots (by moulding B29C37/0057; folding lines B29C53/06; in metal articles B21D17/00; by cutting B26D3/08) · CPC title