Apparatus for heat dissipation and use of such apparatus

US11737649B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11737649-B2
Application numberUS-202017010958-A
CountryUS
Kind codeB2
Filing dateSep 3, 2020
Priority dateSep 5, 2019
Publication dateAug 29, 2023
Grant dateAug 29, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An apparatus configured for heat dissipation that includes a heat source, a heat sink and a heat conducting element. The heat conducting element conducts heat energy from the heat source to the heat sink along a heat conducting path, and the heat conducting element is arranged in such a way on the heat source and the heat sink and is configured to physically change in such a way with increasing temperature of the heat conducting element that: a) a first cross-sectional area between the heat source and the heat conducting element and/or a second cross-sectional area between the heat conducting element of the heat sink increases, and/or b) a length of the heat conducting path shortens. Further, a video endoscope having such an apparatus and a use of such an apparatus is provided.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus adapted to dissipate heat comprising: a heat source, a heat sink, a heat conducting element, wherein the heat conducting element conducts heat energy from the heat source to the heat sink along a heat conducting path, and wherein the heat conducting element is arranged in such a way on the heat source and the heat sink and is configured to physically change in such a way with increasing temperature of the heat conducting element that at least one of: a) a first cross-sectional area between the heat source and the heat conducting element increases, b) a second cross-sectional area between the heat conducting element of the heat sink increases, and c) a length of the heat conducting path shortens, a control element that receives thermal energy from the heat source and exerts increasing pressure on the heat conducting element as the temperature rises, and a lever with a first lever arm and a second lever arm, the control element adapted to exert an increasing pressure on the first lever arm as the temperature rises, so that the second lever arm exerts a pressure on the heat conducting element via the heat sink. 2. An apparatus adapted to dissipate heat comprising: a heat source, a heat sink, a heat conducting element, wherein the heat conducting element conducts heat energy from the heat source to the heat sink along a heat conducting path, and wherein the heat conducting element is arranged in such a way on the heat source and the heat sink and is configured to physically change in such a way with increasing temperature of the heat conducting element that at least one of: a) a first cross-sectional area between the heat source and the heat conducting element increases, b) a second cross-sectional area between the heat conducting element of the heat sink increases, and c) a length of the heat conducting path shortens, and a control element that receives thermal energy from the heat source and exerts increasing pressure on the heat conducting element as the temperature rises and is configured as a first strip and has a counter element which is fixedly arranged as a second strip on the control element, the counter element being made of a material, which has a different coefficient of thermal expansion than the control element, wherein the control element is arranged with the counter element in such a way that the control element presses against the heat conducting element as the temperature rises with increasing pressure, wherein the heat conducting element comprises a first comb-like element and a second comb-like element configured complementary to each other and meshing with each other, wherein the first comb-like element is arranged on the control element and the second comb-like element is arranged on the heat sink, wherein the first comb-like element and the second comb-like element continue to slide into each other as the pressure through the control element increases.

Assignees

Inventors

Classifications

  • A61B1/0008Primary

    characterised by distal tip features · CPC title

  • characterised by internal passages or accessories therefor · CPC title

  • characterised by the image sensor, e.g. camera, being in the distal end portion · CPC title

  • provided with means for regulating temperature · CPC title

  • Arrangements for modifying heat-transfer, e.g. increasing, decreasing (F28F1/00 - F28F11/00 take precedence) · CPC title

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Frequently asked questions

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What does patent US11737649B2 cover?
An apparatus configured for heat dissipation that includes a heat source, a heat sink and a heat conducting element. The heat conducting element conducts heat energy from the heat source to the heat sink along a heat conducting path, and the heat conducting element is arranged in such a way on the heat source and the heat sink and is configured to physically change in such a way with increasing…
Who is the assignee on this patent?
Storz Karl Se & Co Kg
What technology area does this patent fall under?
Primary CPC classification A61B1/0008. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Aug 29 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).