Base tape and electronic component array

Patent metadata

Field	Value
Publication number	US-11737251-B2
Application number	US-202017078138-A
Country	US
Kind code	B2
Filing date	Oct 23, 2020
Priority date	Nov 12, 2019
Publication date	Aug 22, 2023
Grant date	Aug 22, 2023

Abstract

A base tape includes an accommodating section having a rectangular or substantially rectangular parallelepiped, and the base tape includes a surface layer including a carbon layer. The accommodating section includes a bottom surface portion, a side wall portion including a plurality of surfaces, and an opening portion. The side wall portion includes at at least one surface thereof an edge portion located between the bottom surface portion and the opening portion and an electrical discharge path portion inclined from the edge portion toward the opening portion. An electronic component array includes the base tape, an electronic component accommodated in the accommodating section of the base tape, and a cover tape that covers the accommodating section.

First claim

What is claimed is:

1. A base tape comprising:
an accommodating section having a rectangular or substantially rectangular parallelepiped shape; and
a surface layer including a carbon layer; wherein
the accommodating section includes a bottom surface portion, a side wall portion including a plurality of surfaces, and an opening portion; and
the side wall portion includes, at at least one surface thereof, a planar portion which is a surface extending from the bottom surface portion to an edge portion located between the bottom surface portion and the opening portion, and an electrical discharge path portion inclined from the edge portion toward the opening portion.

2. The base tape according to claim 1 , wherein
the base tape has a layered structure including a plurality of layers; and
a layer at which the base tape and an electronic component accommodated in the accommodating section contact each other is a first layer; and
an average thickness of the first layer of the electrical discharge path portion is larger than an average thickness of the first layer of the side wall portion.

3. The base tape according to claim 1 , wherein
the base tape has a layered structure including a plurality of layers;
a layer at which the base tape and an electronic component accommodated in the accommodating section contact each other is a first layer; and
a total peeled area of the first layer of the electrical discharge path portion is smaller than a total peeled area of the first layer of the side wall portion.

4. The base tape according to claim 1 , wherein
the base tape has a three-layer structure;
a layer at which the base tape and an electronic component accommodated in the accommodating section contact each other is a first layer;
a layer on a side of a back surface of the first layer is a second layer;
a layer on a side of a back surface of the second layer is a third layer; and
the first layer and the third layer are made of polystyrene and carbon and the second layer is made of polystyrene.

5. The base tape according to claim 1 , wherein the electrical discharge path portion is provided at the side wall portion located on a side of a shorter side of the opening portion of the accommodating section.

6. An electronic component array comprising:
the base tape according to claim 1 ;
an electronic component accommodated in the accommodating section of the base tape; and
a cover tape that covers the accommodating section.

7. The electronic component array according to claim 6 , wherein a direction orthogonal or substantially orthogonal to a shorter side of the opening portion of the accommodating section is identical or substantially identical to a longitudinal direction of the electronic component accommodated in the accommodating section.

8. The electronic component array according to claim 6 , further comprising an external electrode on opposite surfaces of the electronic component in a longitudinal direction of the electronic component.

9. The electronic component array according to claim 6 , wherein a length of the accommodating section from the bottom surface portion to the edge portion is shorter than a height of the electronic component accommodated in the accommodating section.

10. The electronic component array according to claim 6 , wherein
the base tape has a layered structure including a plurality of layers; and
a layer at which the base tape and an electronic component accommodated in the accommodating section contact each other is a first layer; and
an average thickness of the first layer of the electrical discharge path portion is larger than an average thickness of the first layer of the side wall portion.

11. The electronic component array according to claim 6 , wherein
the base tape has a layered structure including a plurality of layers;
a layer at which the base tape and an electronic component accommodated in the accommodating section contact each other is a first layer; and
a total peeled area of the first layer of the electrical discharge path portion is smaller than a total peeled area of the first layer of the side wall portion.

12. The electronic component array according to claim 6 , wherein
the base tape has a three-layer structure;
a layer at which the base tape and an electronic component accommodated in the accommodating section contact each other is a first layer;
a layer on a side of a back surface of the first layer is a second layer;
a layer on a side of a back surface of the second layer is a third layer; and
the first layer and the third layer are made of polystyrene and carbon and the second layer is made of polystyrene.

13. The electronic component array according to claim 6 , wherein the electrical discharge path portion is provided at the side wall portion located on a side of a shorter side of the opening portion of the accommodating section.

14. The base tape according to claim 1 , further comprising feeding holes aligned in a longitudinal direction of the base tape.

15. The base tape according to claim 2 , wherein the layer is made of at least one of polystyrene, polyethylene terephthalate, polycarbonate, or polypropylene.

16. The base tape according to claim 1 , wherein an angle between the electrical discharge path portion and the edge portion is about 95 degrees or more and about 175 degrees or less.

17. The electronic component array according to claim 6 , wherein the base tape includes feeding holes aligned in a longitudinal direction of the base tape.

18. The electronic component array according to claim 10 , wherein the layer is made of at least one of polystyrene, polyethylene terephthalate, polycarbonate, or polypropylene.

19. The electronic component array according to claim 6 , wherein an angle between the electrical discharge path portion and the edge portion is about 95 degrees or more and about 175 degrees or less.

20. The electronic component array according to claim 6 , wherein the electronic component is a multilayer ceramic capacitor.

Assignees

• Murata Manufacturing Co

Inventors

• Shimizu Yasuhiro

Classifications

• H05K9/0079 Primary

  Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges · CPC title

• H05K13/02

  Feeding of components · CPC title

• H01G2/065

  for surface mounting, e.g. chip capacitors · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H05K13/0419 Primary

  tape feeders · CPC title