Semiconductor laser and method of production for optoelectronic semiconductor parts

Patent metadata

Field	Value
Publication number	US-11735887-B2
Application number	US-201816754723-A
Country	US
Kind code	B2
Filing date	Oct 8, 2018
Priority date	Oct 12, 2017
Publication date	Aug 22, 2023
Grant date	Aug 22, 2023

Abstract

In one embodiment the semiconductor laser (1) comprises a carrier (2) and an edge-emitting laser diode (3) which is mounted on the carrier (2) and which comprises an active zone (33) for generating a laser radiation (L) and a facet (30) with a radiation exit region (31). The semiconductor laser (1) further comprises a protective cover (4), preferably a lens for collimation of the laser radiation (L). The protective cover (4) is fastened to the facet (30) and to a side surface (20) of the carrier (2) by means of an adhesive (5). A mean distance between a light entrance side (41) of the protective cover (4) and the facet (30) is at most 60 μm. The semiconductor laser (1) is configured to be operated in a normal atmosphere without additional gas-tight encapsulation.

First claim

The invention claimed is:

1. A semiconductor laser comprising
a carrier,
an edge-emitting laser diode which is mounted on the carrier and which has an active zone for generating laser radiation and has a facet with a radiation exit region,
a protective cover, and
an adhesive, by means of which the protective cover is fastened to the facet and to a side surface of the carrier, wherein
an average distance between a light entrance side of the protective cover and the facet is at most 15 μm,
the semiconductor laser is configured to be operated in a normal atmosphere without additional gas-tight encapsulation,
the protective cover is a lens for collimation of the laser radiation and has a minimum distance from the facet of 0.1 μm, wherein a cavity is formed in the region of the active zone on the facet, said cavity is surrounded all around by the adhesive as seen in plan view of the facet, such that the radiation exit region, from which the laser radiation leaves the laser diode, is free of the adhesive, and
the cavity is evacuated or filled with at least one protective gas, wherein the cavity, seen in plan view of the facet, has an average diameter of between 3 μm and 100 μm inclusive, and a thickness of the cavity is between 0.5 μm and 20 μm inclusive, and wherein as seen in plan view of the facet, a width of the adhesive around the cavity is at least 150% of the average diameter of the cavity and also at least 30 μm.

2. The semiconductor laser according to claim 1 , in which the cavity has side walls which are curved towards the adhesive such that the cavity has a biconvex shape in the radiation exit region when seen in cross-section perpendicular to the facet, wherein the laser radiation runs at a distance from the adhesive towards the light entrance side.

3. The semiconductor laser according to claim 1 , in which the adhesive directly covers the light entrance side, the side surface and the entire radiation exit region, and the protective cover is a lens for collimation of the laser radiation, wherein the average distance between the light entrance side and the facet is between 0.2 μm and 15 μm inclusive.

4. The semiconductor laser according to claim 1 , in which the protective cover has at least one of the following materials or consists of at least one of these materials: sapphire or SiC, wherein a wavelength of maximum intensity of the laser radiation is between 365 nm and 530 nm inclusive.

5. The semiconductor laser according to claim 1 , wherein the adhesive is inorganic and comprises or consists of at least one metal and/or at least one glass.

6. The semiconductor laser according to claim 1 , in which the adhesive comprises or consists of a low-organic silicone, silazane and/or siloxane.

7. The semiconductor laser according to claim 1 , in which the light entrance side is provided with a roughening such that the light entrance side is configured to diffuse reflected laser radiation and the reflected laser radiation does not pass or passes only attenuated to the radiation exit region and/or such that a resonator of the laser diode remains undisturbed by the reflected laser radiation.

8. The semiconductor laser according to claim 1 , in which the planar shaped light entrance side is oriented inclined relative to the facet so that laser radiation reflected at the light entrance side is kept away from the radiation exit region and/or such that a resonator of the laser diode remains undisturbed by the reflected laser radiation, wherein an angle (α) between the light entrance side and the facet is between 5° and 25° inclusive.

9. The semiconductor laser according to claim 1 , in which the protective cover is formed as a biconvex lens, wherein a maximum bulge of the light entrance side towards the facet lies outside an optical axis of the laser radiation such that laser radiation reflected at the light entrance side is kept away from the radiation exit region and/or such that a resonator of the laser diode remains undisturbed by the reflected laser radiation.

10. The semiconductor laser according to claim 1 , in which at least the light entrance side is provided with an anti-reflection coating for the laser radiation such that the light entrance side has a reflectivity of at most 0.5% for the laser radiation and/or such that a resonator of the laser diode remains undisturbed by the reflected laser radiation.

11. The semiconductor laser according to claim 1 , in which at least one light exit side of the protective cover facing away from the facet is provided with a photocatalytic coating, wherein the photocatalytic coating is configured to remove and/or decompose deposits on the light exit side on the basis of the laser radiation.

12. The semiconductor laser according to claim 1 , in which at least one light exit side of the protective cover facing away from the facet is provided with an anti-adhesive coating, wherein the anti-adhesive coating is configured to prevent deposits on an outside of the protective cover.

13. The semiconductor laser according to claim 1 , in which the active zone is located on a side of the laser diode facing the carrier, wherein the facet projects beyond the carrier along a running direction of the laser radiation.

14. The semiconductor laser according to claim 1 , further comprising a luminescent element for partially converting the laser radiation such that the semiconductor laser emits white mixed light during operation, wherein the luminescent element is located directly on the light exit side.

Assignees

• Osram Oled Gmbh

Inventors

• Sorg Jörg Erich
• König Harald
• Lell Alfred
• Peskoller Florian
• Auen Karsten
• Schulz Roland
• Brunner Herbert
• Singer Frank
• Hüttinger Roland

Classifications

• H01S5/0267

  Integrated focusing lens (H01S5/18388 takes precedence) · CPC title

• H01S5/02326

  Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses · CPC title

• H01S5/005

  Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping (H01S5/026, H01S5/18388 take precedence) · CPC title

• H01S5/028 Primary

  Coatings {; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers} · CPC title

• H01S5/02253

  using lenses · CPC title