Light emitting apparatus and method for producing the same

Patent metadata

Field	Value
Publication number	US-11735699-B2
Application number	US-202217574474-A
Country	US
Kind code	B2
Filing date	Jan 12, 2022
Priority date	Nov 29, 2007
Publication date	Aug 22, 2023
Grant date	Aug 22, 2023

Abstract

A light emitting apparatus includes: a mount substrate; at least one light emitting device mounted on the mount substrate; a light transparent member, wherein a lower surface of the light transparent member is attached to an upper surface of the at least one light emitting device via at least one adhesive material layer, wherein the light transparent member has a plate shape and is positioned to receive incident light emitted from the light emitting devices, and wherein a lateral surface of the light transparent member is located laterally inward of a lateral surface of the at least one light emitting device; and a covering member that contains a light reflective material and covers at least the lateral surface of the light transparent member.

First claim

The inevention claimed is:

1. A method for producing a plurality of light emitting apparatuses, the method comprising:
mounting a plurality of light emitting devices on a collective wiring substrate such that the plurality of light emitting devices are electrically connected to the collective wiring substrate, wherein each light emitting device has a mount surface at which the light emitting device is mounted to the collective wiring substrate, and a light outgoing surface opposite the mount surface;
attaching a plurality of light transparent members to the light outgoing surfaces of the light emitting devices such that each light transparent member is attached to the light outgoing surfaces of one or more of the light emitting devices;
forming a collective covering member that covers at least lateral surfaces of the light transparent members and lateral surfaces of the plurality of light emitting devices such that a light emission surface of each light transparent member is exposed from the collective covering member, wherein the collective covering member comprises a resin and a light reflective material; and
cutting the collective covering member and the collective wiring substrate without cutting the light transparent members so as to form the plurality of light emitting apparatuses, each comprising a wiring substrate formed from the collective wiring substrate, said one or more of the light emitting devices mounted on the wiring substrate, one of the light transparent members that receives incident light emitted from said one or more of the light emitting devices, and a covering member formed from the collective covering member.

2. The method according to claim 1 , wherein, in the step of mounting the plurality of light emitting devices, the plurality of light emitting devices are mounted on the collective wiring substrate in a flip-chip manner.

3. The method according to claim 1 , wherein, in the step of forming the collective covering member, an upper surface of the collective covering member is made flush with upper surfaces of the light transparent members.

4. The method according to claim 1 , wherein, in the step of attaching the plurality of light transparent members to the light outgoing surfaces of the light emitting devices, a lateral surface of each the light transparent member is located outward of a lateral surface of each of said one or more of the light emitting devices.

5. The method according to claim 1 , wherein, in the step of forming the collective covering member, the collective covering member is formed under a part of each light transparent member.

6. The method according to claim 1 , wherein, in each of the formed plurality of light-emitting apparatuses, a width between inner surfaces of a portion of the covering member that covers the lateral surfaces of the light transparent member is greater than a width between inner surfaces of a portion of the covering member that covers the lateral surface of said one or more of the light emitting devices.

7. The method according to claim 1 , wherein the light reflective material comprises at least one of an oxide of Ti, an oxide of Zr, an oxide of Nb, an oxide of Al, an oxide of Si, AlN, or MgF.

8. The method according to claim 1 , wherein the light reflective material comprises at least one of TiO 2 , ZrO 2 , Nb 2 O 5 , Al 2 O 3 , MgF, AlN or SiO 2 .

9. The method according to claim 1 , wherein each of the light transparent members is made of an inorganic material.

10. The method according to claim 1 , wherein, in the step of attaching the plurality of light transparent members to the light outgoing surfaces of the light emitting devices, the plurality of light transparent members are attached to the light outgoing surfaces of the light emitting devices with a light transparent adhesive material.

11. The method according to claim 1 , wherein, in the step of cutting the collective covering member and the collective wiring substrate, the covering member is cut such that a first width from a first outermost surface of each covering member to a corresponding first outermost surface of the respective light transparent member is longer than a second width from a second outermost surface of each covering member to a corresponding second outermost surface of the respective light transparent member.

12. The method according to claim 1 , wherein, in the step of forming the collective covering member, the collective covering member covers a part of a bottom surface each light emitting device.

13. The method according to claim 1 , wherein each light transparent member has a plate shape.

14. The method according to claim 1 , wherein, in the step of forming the collective covering member, the collective covering member is formed to directly contact the lateral surfaces of the light transparent members and the lateral surfaces of the plurality of light emitting devices.

15. The method according to claim 1 , wherein the resin is silicone resin.

16. The method according to claim 1 , wherein said one or more of the light emitting devices comprise two or more of the light emitting devices.

17. A method for producing a plurality of light emitting apparatuses, the method comprising:
mounting a plurality of light emitting devices on a collective wiring substrate such that the plurality of light emitting devices are electrically connected to the collective wiring substrate, wherein each light emitting device has a mount surface at which the light emitting device is mounted to the collective wiring substrate, and a light outgoing surface opposite the mount surface;
attaching a plurality of light transparent members to the light outgoing surfaces of the light emitting devices such that each light transparent member is attached to the light outgoing surfaces of one or more of the light emitting devices;
forming a collective covering member that covers at least lateral surfaces of the light transparent members and lateral surfaces of the plurality of light emitting devices such that a light emission surface of each light transparent member is exposed from the collective covering member, wherein the collective covering member comprises a resin and a light reflective material; and
cutting the collective covering member and the collective wiring substrate without cutting the light transparent members so as to form the plurality of light emitting apparatuses, each comprising a wiring substrate formed from the collective wiring substrate, said one or more of the light emitting devices mounted on the wiring substrate, one of the light transparent members that receives incident light emitted from said one or more of the light emitting devices, and a covering member formed from the collective covering member,
wherein, in the step of mounting the plurality of light emitting devices, the plurality of light emitting devices are mounted on the collective wiring substrate in a flip-chip manner,
wherein, in the step of attaching the plurality of light transparent members to the light outgoing surfaces of the light emitting devices, a lateral surface of each the light transparent member is located outward of a lateral surface of each of said one or more of the light emitting devices, and
wherein, in the step of forming the collective covering member, the collective covering member is formed under a part of each light transparent member.

18. The method according to claim 17 , wherein the light reflective material comprises at least one of an oxide of Ti, an oxide of Zr, an oxide of Nb, an oxide of Al, an oxide of Si, AlN, or MgF.

Assignees

• Nichia Corp

Inventors

• Minato Shunsuke
• Sano Masahiko

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/923

  Bond pads having multiple stacked layers · CPC title