Overmold proximity sensor and associated methods
US-10147834-B2 · Dec 4, 2018 · US
US11733355B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11733355-B2 |
| Application number | US-201716326755-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 24, 2017 |
| Priority date | Sep 1, 2016 |
| Publication date | Aug 22, 2023 |
| Grant date | Aug 22, 2023 |
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An optical sensor module for time-of-flight measurement comprises an optical emitter, a main detector and a reference detector which are arranged in or on a carrier. An opaque housing of the optical sensor module has a first chamber and a second chamber which are separated by a light barrier. The housing has a cover section and is arranged on the carrier such that the optical emitter is located inside the first chamber, the main detector is located inside the second chamber and the reference detector is located outside the first chamber. Furthermore, a main surface of the cover section is positioned opposite the carrier. The optical emitter is arranged and configured to emit light through a first aperture in the cover section, and the main detector is arranged and configured to detect light entering the second chamber through a second aperture in the cover section. A reference path is established between the optical emitter and the reference detector inside the optical sensor module, and confined by the main surface of the cover section and the carrier. Additionally, a method for manufacturing an optical sensor module for time-of-flight measurement is presented.
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The invention claimed is: 1. An optical sensor module for time-of-flight measurement, having an optical emitter, a main detector and a reference detector arranged in or on a carrier, further comprising: an opaque housing with a first chamber and a second chamber, separated by a light barrier and having a cover section; wherein the housing is arranged on the carrier such that the optical emitter is located inside the first chamber, the main detector is located inside the second chamber, the reference detector is located outside the first chamber, and a main surface of the cover section is positioned opposite the carrier; and wherein the optical emitter is arranged and configured to emit light through a first aperture in the cover section, and the main detector is arranged and configured to detect light entering the second chamber through a second aperture in the cover section, a reference path is established between the optical emitter and the reference detector inside the optical sensor module, and confined by the main surface of the cover section and the carrier, and the first chamber and the second chamber each are laterally delimited by the opaque housing. 2. The optical sensor module according to claim 1 , wherein the housing, the optical emitter and the reference detector are arranged such that at least a fraction of light to be emitted by the optical emitter along the reference path reaches the reference detector. 3. The optical sensor module according to claim 1 , wherein the main detector and/or the reference detector comprise a single-photon avalanche diode, SPAD, or an array of SPADs, and/or the optical emitter comprise a vertical-cavity surface-emitting laser, VCSEL, or a vertical-external-cavity surface-emitting-laser, VECSEL, configured to emit light. 4. The optical sensor module according to claim 1 , wherein the reference detector and the main detector are combined into a single detector, or the reference detector and the main detector are implemented as separate detectors. 5. The optical sensor module according to claim 1 , wherein a front side of the optical emitter faces the main surface of the cover section and a backside of the optical emitter faces the carrier, the reference detector is arranged below the backside of the optical emitter, and a fraction of light emitted by the optical emitter is emitted via the backside of the optical emitter. 6. The optical sensor module according to claim 1 , wherein the reference path at least partially runs inside the carrier such that light emitted by the optical emitter along the reference path travels through the carrier towards the reference detector. 7. The optical sensor module according to claim 6 , wherein the carrier comprises a guiding structure to direct light along the reference path inside the carrier. 8. The optical sensor module according to claim 1 , wherein the reference path at least partially runs through a waveguide arranged between the cover section and the carrier. 9. The optical sensor module according to claim 1 , wherein the light barrier is designed as an optical power limiter which confines the reference path such that light emitted by the optical emitter along the reference path and towards the reference detector is attenuated when running past the light barrier. 10. The optical sensor module according to claim 9 , wherein the light barrier comprises a gap as optical power limiter and confines the gap between the cover section and the carrier, and/or the light barrier comprises a meander structure as optical power limiter, having a set of interdigitated fingers, wherein the set of interdigitated fingers comprises at least one finger connected to the housing and at least one finger connected to the carrier. 11. The optical sensor module according to claim 1 , wherein a cover plate is arranged on the main surface of the cover section leaving a gap between the cover plate and the cover section, an additional reference path is established between the optical emitter and the reference detector running via the gap between the cover plate and the cover section. 12. The optical sensor module according to claim 1 , wherein the housing comprises a frame body laterally confining the first and second chambers, and the cover section, frame body, and the light barrier are comprised by a continuous piece of material. 13. The optical sensor module according to claim 1 , further comprising a measurement unit, wherein the main detector is configured to generate a measurement signal in response to light detected by the main detector, the reference detector is configured to generate a reference signal in response to light detected by the reference detector, and the measurement unit is configured to compute a time-of-flight value depending on the measurement signal and the reference signal. 14. The optical sensor module according to claim 13 , wherein the measurement unit the main detector and the reference detector are integrated into a single semiconductor die. 15. The optical sensor module according to claim 1 , wherein the reference detector and the main detector are arranged inside the second chamber of the opaque housing. 16. A method for manufacturing an optical sensor module for time-of-flight measurement, the method comprising the steps of: arranging an optical emitter, a main detector and a reference detector in or on a carrier, providing an opaque housing having a cover section, and a first chamber and a second chamber, wherein the first chamber and the second chamber each are laterally delimited by the opaque housing, separating the first chamber and a second chamber by means of a light barrier, arrange the housing on the carrier such that the optical emitter is located inside the first chamber, the main detector is located inside the second chamber, and the reference detector is located outside the first chamber, and such that a main surface of the cover section is opposite the carrier; and wherein the optical emitter is arranged and configured to emit light through a first aperture in the cover section, and the main detector is arranged and configured to detect light entering the second chamber through a second aperture in the cover section, and a reference path is established between the optical emitter and the reference detector inside the optical sensor module, and confined by the main surface of the cover section and by the carrier.
Housing arrangements · CPC title
Evaluating distance, position or velocity data · CPC title
Means for monitoring or calibrating · CPC title
for measuring distance only (indirect measurement G01S17/46; active triangulation systems G01S17/48) · CPC title
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