Laminated microchannel heat exchangers

US11732978B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11732978-B2
Application numberUS-201716072501-A
CountryUS
Kind codeB2
Filing dateApr 18, 2017
Priority dateApr 18, 2016
Publication dateAug 22, 2023
Grant dateAug 22, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In one general aspect, a microchannel heat exchanger is disclosed. It includes a cover, a base, and thermally conductive sheets between the cover and the base that each define a series of side-by-side lanes aligned with a flow direction. The lanes each include aligned slots that define microchannel segments and are separated by cross ribs. The sheets are stacked between the base and cover so as to cause at least some of the ribs to be offset from each other and allow the microchannel segments in the same lane in adjacent sheets to communicate with each other along the flow direction to define a plurality of microchannels in the heat exchanger.

First claim

Opening claim text (preview).

What is claimed is: 1. A microchannel heat exchanger, comprising: a cover with an input access channel and an output access channel, a thermally conductive base, a plurality of thermally conductive sheets between the cover and the base that each define a series of side-by-side lanes aligned with a flow direction, wherein the lanes each include a plurality of aligned slots that define microchannel segments and are separated by a plurality of cross ribs spaced along the lanes in the flow direction, and wherein the cross-ribs are significantly shorter than the slots in the flow direction, wherein the sheets further define common cut-out areas in communication with the lanes at either end of the lanes, wherein the thermally conductive sheets include a first plurality of sheets of a first type interleaved with a second plurality of sheets of a second type that are stacked between the base and cover so as to cause at least some of the cross ribs to be offset from each other and allow the microchannel segments in the same lane in adjacent sheets to communicate with each other along the flow direction to define a plurality of microchannels in the heat exchanger, wherein a distance along which the microchannel segments in the same lane in adjacent sheets communicate with each other is significantly longer along the flow direction than the length of the cross ribs between the segments along the flow direction, wherein the microchannels defined in the microchannel heat exchanger each has a cross-section with a smallest dimension of less than 1000 microns, wherein the sheets are stacked between the base and cover so that the common cut-out areas form at least one input manifold and at least one output manifold that are respectively aligned with the input channel and the output channel on the cover, wherein the thermally conductive sheets are bonded or fused to each other to form closed microchannels in the heat exchanger, wherein the heat exchanger is constructed for boiling or evaporating fluid service, and wherein the sheets define a more dense packing of cross ribs in the inlet end of each of the lanes of the heat exchanger to reduce the open cross-section at the inlet end of each of the lanes relative to a cross-section of all of a remaining portion of that lane between the more dense packing of cross ribs at the inlet end of that lane and the outlet end of that lane, to define flow restrictors at the inlet end of each of the lanes, and wherein the aspect ratio of the microchannels is above 4:1. 2. The apparatus of claim 1 wherein the thermally conductive sheets further define access channel openings at each end of the lanes, which when stacked create access channels for the microchannels. 3. The apparatus of claim 1 wherein the aspect ratio of the microchannels is above 8:1. 4. The apparatus of claim 1 further including thermally conductive separator sheets located between groups of the thermally conductive sheets to form a multilayer heat exchanger. 5. The apparatus of claim 1 wherein the sheets are made of at least one thermally conductive metal. 6. The apparatus of claim 1 wherein the sheets are made of sinterable thermally conductive ceramics. 7. The apparatus of claim 1 wherein the microchannels have a hydraulic diameter of below 500 microns. 8. The apparatus of claim 1 wherein the microchannels have a hydraulic diameter of below 200 microns. 9. The apparatus of claim 1 wherein the base is a base plate that is thicker than each of the sheets and the cover includes access channels in communication with the microchannels. 10. The apparatus of claim 1 wherein the base is thermally conductive yet electrically insulating. 11. The apparatus of claim 1 wherein the flow restrictors are formed by closing an input end of every other lane in each of the sheets with a cross-rib, with the closed-ended lanes of slots being staggered with respect to each other in adjacent sheets when the sheets are stacked and bonded together to form a checkerboard pattern across the inlets of the plurality of channels. 12. The apparatus of claim 11 wherein the checkerboard pattern closes off 50% of a cross-sectional area of the channels. 13. The apparatus of claim 12 wherein the cross-ribs that form flow restrictors are wider than the cross-ribs that are between the slots. 14. The apparatus of claim 11 wherein the cross-ribs that form flow restrictors are wider than the cross-ribs that are between the slots. 15. The apparatus of claim 1 wherein all of the thermally conductive sheets are bonded or fused to each other from the base through to the cover. 16. The apparatus of claim 1 wherein the thermally conductive sheets are bonded or fused to each other using diffusion bonding, brazing, soldering, welding, or sintering. 17. The apparatus of claim 1 wherein the thermally conductive sheets further include at least one unslotted thermally conductive sheet. 18. The apparatus of claim 1 wherein the thermally conductive sheets are bonded or fused to the base. 19. The apparatus of claim 1 further including a boiling coolant inside the heat exchanger. 20. The apparatus of claim 1 wherein the flow restrictors are formed by alternately closing an end of the first slot in a lane of slots with cross-ribs that are wider than the bulk of the cross-ribs between slots, wherein the alternating closed-ended lanes of slots are staggered with respect to the lanes of slots above or below, in alternating layers of slotted sheets, such that, when the sheets are stacked and bonded together, the cross-section of the parallel channels that are formed have a checkerboard pattern accross the inlets of the plurality of channels, which serve as integral flow restrictors covering substantially 50% of a cross-sectional area of the main channels.

Assignees

Inventors

Classifications

  • by flowing liquids, e.g. forced water cooling · CPC title

  • F28F3/086Primary

    having one or more openings therein forming tubular heat-exchange passages · CPC title

  • the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence) · CPC title

  • Blocks traversed by passages for heat-exchange media {(F28D7/0008 takes precedence)} · CPC title

  • by affecting the pattern of flow of the heat-exchange media {(F28F13/003 takes precedence; static flow control means in header boxes F28F9/026)} · CPC title

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Frequently asked questions

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What does patent US11732978B2 cover?
In one general aspect, a microchannel heat exchanger is disclosed. It includes a cover, a base, and thermally conductive sheets between the cover and the base that each define a series of side-by-side lanes aligned with a flow direction. The lanes each include aligned slots that define microchannel segments and are separated by cross ribs. The sheets are stacked between the base and cover so as…
Who is the assignee on this patent?
Univ Oregon State, Qcip Holdings Llc
What technology area does this patent fall under?
Primary CPC classification F28F3/086. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Aug 22 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).