Wafer holder

Patent metadata

Field	Value
Publication number	US-11732359-B2
Application number	US-201816498853-A
Country	US
Kind code	B2
Filing date	Feb 8, 2018
Priority date	Mar 28, 2017
Publication date	Aug 22, 2023
Grant date	Aug 22, 2023

Abstract

A wafer holder comprising: a ceramic base having a wafer-mounting surface as an upper surface; and a conductive member embedded in the ceramic base, the conductive member including a circuit portion provided parallel to the wafer-mounting surface, a pull-out portion provided parallel to the wafer-mounting surface and spaced from the circuit portion in a direction opposite to a direction toward the wafer-mounting surface, and a connecting portion configured to electrically connect the circuit portion and the pull-out portion to each other.

First claim

The invention claimed is:

1. A wafer holder comprising:
a ceramic base having a wafer-mounting surface as an upper surface;
a first conductive member embedded in the ceramic base, the first conductive member including
a first circuit portion provided parallel to the wafer-mounting surface,
a first pull-out portion provided parallel to the wafer-mounting surface and spaced from the first circuit portion in a direction opposite to a direction toward the wafer-mounting surface, wherein the first pull-out portion is located in a first layer in a thickness direction of the ceramic base, and
a first plurality of connecting portions configured to electrically connect the first circuit portion and the first pull-out portion to each other;

a second conductive member embedded in the ceramic base, the second conductive member including
at least one second circuit portion provided parallel to the wafer-mounting surface,
at least one second pull-out portion provided parallel to the wafer-mounting surface and spaced from the at least one second circuit portion in the direction opposite to the direction toward the wafer-mounting surface, wherein the at least one second pull-out portion is located in a second layer in the thickness direction of the ceramic base, the second layer being spaced from the first layer in the thickness direction, and
a second plurality of connecting portions configured to electrically connect the at least one second circuit portion and the at least one second pull-out portion to each other;

a cylindrical support configured to support a lower surface of the ceramic base; and
an electrode terminal portion connected to the first pull-out portion, wherein
a portion of the electrode terminal portion protrudes from the lower surface of the ceramic base and is housed in the cylindrical support, and
the first plurality of connecting portions are arranged in a circumferential direction at an outer circumferential portion of the first pull-out portion.

2. The wafer holder according to claim 1 , wherein
the first conductive member constitutes an RF electrode.

3. The wafer holder according to claim 1 , wherein each of the first and second conductive members constitutes an RF electrode.

4. The wafer holder according to claim 1 , wherein
the ceramic base has a disk shape.

5. The wafer holder according to claim 1 , wherein
the cylindrical support has a circular cylindrical shape.

6. The wafer holder according to claim 1 , wherein the first circuit portion and the at least one second circuit portion are located in the same layer in the thickness direction of the ceramic base.

7. The wafer holding according to claim 1 , wherein the first plurality of connecting portions include a ceramic member covered with a metal layer.

8. The wafer holder according to claim 7 , wherein the ceramic member is made of a ceramic material selected from the group consisting of aluminum nitride, silicon nitride, silicon carbide, and aluminum oxide.

9. The wafer holder according to claim 7 , wherein the ceramic base is made of a first ceramic material, and the ceramic member is made of a second ceramic material having substantially the same coefficient of thermal expansion as the first ceramic material.

10. The wafer holder according to claim 7 , wherein the ceramic member is made of the same ceramic material as the ceramic base.

Assignees

• Sumitomo Electric Industries

Inventors

• Kimura Koichi
• Mikumo Akira
• Sakita Shigenobu
• Shimao Daisuke

Classifications

• H10P72/72 Primary

  using electrostatic chucks · CPC title

• H10P14/6336

  in the presence of a plasma [PECVD] · CPC title

• H10P72/0432 Primary

  mainly by conduction · CPC title

• C23C16/458 Primary

  characterised by the method used for supporting substrates in the reaction chamber · CPC title

• C23C14/50

  Substrate holders · CPC title