Spherical particles comprising nanoclay-filled-polymer and methods of production and uses thereof

US11732106B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11732106-B2
Application numberUS-202117388861-A
CountryUS
Kind codeB2
Filing dateJul 29, 2021
Priority dateJul 29, 2021
Publication dateAug 22, 2023
Grant dateAug 22, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Methods for producing highly spherical particles that comprise: mixing a mixture comprising: (a) nanoclay-filled-polymer composite comprising a nanoclay dispersed in a thermoplastic polymer, (b) a carrier fluid that is immiscible with the thermoplastic polymer of the nanoclay-filled-polymer composite, optionally (c) a thermoplastic polymer not filled with a nanoclay, and optionally (d) an emulsion stabilizer at a temperature at or greater than a melting point or softening temperature of the thermoplastic polymer of the nanoclay-filled-polymer and the thermoplastic polymer, when included, to disperse the nanoclay-filled-polymer composite in the carrier fluid; cooling the mixture to below the melting point or softening temperature to form nanoclay-filled-polymer particles; and separating the nanoclay-filled-polymer particles from the carrier fluid.

First claim

Opening claim text (preview).

What is claimed is: 1. A method comprising: providing a mixture comprising: (a) a nanoclay-filled-polymer composite comprising a nanoclay dispersed in a thermoplastic polymer, (b) a carrier fluid that is immiscible with the thermoplastic polymer of the nanoclay-filled-polymer composite, (c) optionally, a thermoplastic polymer not filled with a nanoclay, and (d) optionally, an emulsion stabilizer; shearing the mixture at a temperature at or greater than a melting point or softening temperature of the thermoplastic polymer of the nanoclay-filled-polymer composite and the thermoplastic polymer not filled with the nanoclay, when included, to disperse the nanoclay-filled-polymer composite as droplets in the carrier fluid; cooling the mixture to below the melting point or softening temperature to form nanoclay-filled-polymer particles containing exfoliated clay platelets dispersed in the thermoplastic polymer; and separating the nanoclay-filled-polymer particles from the carrier fluid. 2. The method of claim 1 , wherein at least 90 wt % of the nanoclay is dispersed in the thermoplastic polymer as the exfoliated clay platelets. 3. The method of claim 1 , wherein the nanoclay comprises a quaternary ammonium compound. 4. The method of claim 1 , wherein the nanoclay-filled-polymer composite is formed by melt mixing the nanoclay with the thermoplastic polymer for about 5 minutes to about 1 hour at about 125° C. to about 250° C. 5. The method of claim 1 , wherein the nanoclay-filled-polymer composite comprises about 80 wt % to about 99.9 wt % of the thermoplastic polymer, and about 0.05 wt % to about 20 wt % of the nanoclay, based on the total weight of the nanoclay-filled-polymer composite. 6. The method of claim 1 , wherein the emulsion stabilizer is present and comprises a plurality of nanoparticles, the plurality of nanoparticles comprising a plurality of oxide nanoparticles. 7. The method of claim 6 , wherein the plurality of oxide nanoparticles comprises silica nanoparticles. 8. The method of claim 7 , wherein the silica nanoparticles are present at a silica nanoparticle content ranging from about 0.01 wt % to about 10 wt %, based on a total weight of the nanoclay-filled-polymer composite. 9. The method of claim 1 , wherein the carrier fluid is present at a weight ratio with respect to the nanoclay-filled-polymer composite ranging from 50:50 to 90:10. 10. The method of claim 1 , wherein the carrier fluid is polydimethylsiloxane. 11. The method of claim 1 , wherein the nanoclay-filled-polymer composite has an elongation at break ranging from about 200% to about 600%. 12. The method of claim 1 , wherein the nanoclay-filled-polymer composite has a tensile strength ranging from about 10 MPa to about 30 MPa. 13. The method of claim 1 , wherein the nanoclay-filled-polymer composite has a molecular weight ranging from about 20 kD to about 500 kD. 14. The method of claim 1 , wherein the nanoclay-filled-polymer particles have a D50 ranging from about 20 μm to about 80 μm with a diameter span of about 2 or less. 15. The method of claim 1 , wherein the thermoplastic polymer of the nanoclay-filled-polymer composite comprises a polyamide, a polyolefin, and/or a polyurethane. 16. The method of claim 15 , wherein the thermoplastic polymer not filled with the nanoclay comprises a polyamide, a polyolefin, and/or a polyurethane.

Assignees

Inventors

Classifications

  • C08K3/346Primary

    Clay · CPC title

  • by moulding the material, i.e. treating it in the molten state · CPC title

  • using layers of powder being selectively joined, e.g. by selective laser sintering or melting · CPC title

  • Preparation · CPC title

  • Processes of additive manufacturing · CPC title

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What does patent US11732106B2 cover?
Methods for producing highly spherical particles that comprise: mixing a mixture comprising: (a) nanoclay-filled-polymer composite comprising a nanoclay dispersed in a thermoplastic polymer, (b) a carrier fluid that is immiscible with the thermoplastic polymer of the nanoclay-filled-polymer composite, optionally (c) a thermoplastic polymer not filled with a nanoclay, and optionally (d) an emuls…
Who is the assignee on this patent?
Xerox Corp
What technology area does this patent fall under?
Primary CPC classification C08K3/346. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 22 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).