Image forming apparatus
US-2016297212-A1 · Oct 13, 2016 · US
US11731303B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11731303-B2 |
| Application number | US-202117493050-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 4, 2021 |
| Priority date | Mar 31, 2015 |
| Publication date | Aug 22, 2023 |
| Grant date | Aug 22, 2023 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A precut module with one or more profiling heads and/or circular saws may be provided upstream of a saw module. The precut module may be used to implement a portion of a cut that would otherwise be made by the saw module, thereby reducing the depth of cut required at the saw module. In some embodiments, profiling heads may be used to profile a block that is wider than a desired side board. The block may be cut from the workpiece and sent to the edger. This may provide the same or better wood volume recovery and/or throughput speed than profiling the side board or cutting the side board from a flitch. In some embodiments, cut patterns for the precut module and other machine centers may be calculated and/or selected based on a desired depth of cut at the saw module, desired throughput speed, wood volume recovery, and/or other parameters.
Opening claim text (preview).
What is claimed is: 1. A method of processing a workpiece along a processing line to obtain a desired cut product, wherein the workpiece is a log or a cant and the desired cut product is a board, and wherein the processing line includes a profiler module, a first saw module downstream of the profiler module, and an edger module downstream of the first saw module along a path of flow, the method comprising: determining a first group of cut patterns for implementation by at least the profiler module and the first saw module to form the longitudinal sides of the board along a first side of the workpiece and to cut the board from the workpiece, respectively; determining a second group of cut patterns for implementation by at least the profiler module, the first saw module, and the edger to form the longitudinal sides of a block along the first side of the workpiece, to cut the block from the workpiece, and to cut the block into the board and at least a first waste piece, respectively, wherein the first waste piece includes at least a portion of one of the longitudinal sides of the block; determining a value of each of said groups of cut patterns based at least on one or more parameters, wherein the one or more parameters includes a wood volume recovery parameter or a throughput speed parameter, and wherein each of said groups of cut patterns defines a through- cut to be made through the workpiece along a cutting plane by at least the profiler module and the first saw module; selecting one of the groups of cut patterns for implementation based at least on a comparison of the determined values; and causing the profiler module to cut the workpiece according to a corresponding one of cut patterns of the selected group such that the profiler module makes a first portion of the through- cut through the workpiece along the cutting plane. 2. The method of claim 1 , further including causing the first saw module to cut the workpiece according to another corresponding one of the cut patterns of the selected group such that the first saw module makes a second portion of the through-cut through the workpiece along the cutting plane. 3. The method of claim 1 , wherein the processing line further includes a second saw module with one or more circular saws disposed between the profiler module and the first saw module, and the method further includes causing the second saw module to make a third portion of the through-cut along the cutting plane such that the first saw completes the through-cut. 4. The method of claim 1 , wherein the one or more parameters includes the throughput speed parameter, and the throughput speed parameter is a predicted effect on throughput speed through the first saw module. 5. The method of claim 4 , wherein the one or more parameters includes the wood volume recovery parameter, and the wood volume recovery parameter is a predicted wood volume recovery from the workpiece or from a portion thereof. 6. The method of claim 1 , wherein the one or more parameters includes the throughput speed parameter, and the throughput speed parameter is a predicted effect on throughput speed through the edger. 7. The method of claim 1 , wherein the one or more parameters further includes a monetary value of the desired cut product or other products to be cut from the workpiece, a length of time required to reposition a cutting member to cut a subsequent or preceding workpiece, a maximum or predicted or current throughput speed of a machine center along the processing line, a predicted or actual backlog along the processing line, or a cut solution or cut pattern of a preceding or subsequent workpiece along the processing line. 8. The method of claim 1 , wherein the one or more parameters includes a current or predicted backlog along the processing line between the saw module and the edger. 9. The method of claim 1 , wherein the second group of cut patterns is determined based at least in part on a desired cut depth for the first saw module, and the second portion of the through-cut is less than or equal to the desired cut depth. 10. The method of claim 1 , wherein the first group and the second group of cut patterns are determined based at least in part on a cut solution for the workpiece, wherein the cut solution defines the desired cut product and the through-cut through the workpiece. 11. The method of claim 10 , wherein the second group of cut patterns is determined based at least in part on a desired cut depth for the first saw module, and the second portion of the through-cut is less than or equal to the desired cut depth. 12. The method of claim 1 , wherein determining a value of each of said groups of cut patterns includes determining an increase in wood volume recovery from the workpiece, or from a portion thereof, and a decrease in throughput speed through the first saw module for the second cut pattern relative to the first cut pattern. 13. The method of claim 12 , wherein determining a value of each of said groups of cut patterns further includes determining a decrease in throughput speed through the edger for the second cut pattern relative to the first cut pattern. 14. A non-transitory computer-readable medium storing instructions that are operable, upon execution by one or more processors of a computer system, to cause the computer system to perform the method of claim 1 . 15. A system for processing a workpiece as the workpiece is moved along a flow path to obtain a desired cut product, wherein the workpiece is a log or a cant and the desired cut product is a board, the system comprising: a profiler module disposed along the flow path and having one or more profiling heads; a first saw module disposed downstream of the profiler module along the flow path; an edger disposed downstream of the first saw module along the flow path; and a computer system operatively coupled with the profiler module, wherein the computer system is programmed with instructions operable, upon execution by one or more processors of the computer system, to cause the computer system to: determine a value of a first group of cut patterns, wherein the first group of cut patterns is configured for implementation by at least the profiler module and the first saw module to form the longitudinal sides of the board along a first side of the workpiece and to cut the board from the workpiece, respectively; determine a value of a second group of cut patterns, wherein the second group of cut patterns is configured for implementation by at least the profiler module, the first saw module, and the edger to form the longitudinal sides of a block along the first side of the workpiece, to cut the block from the workpiece, and to cut the block into the board and at least a first waste piece, respectively, wherein the first waste piece includes at least a portion of one of the longitudinal sides of the block, and wherein each of said groups of cut patterns defines a through-cut to be made through the workpiece along a cutting plane by at least the profiler module and the first saw module; select one of the groups of cut patterns for implementation based at least in part on a comparison of the determined values; and in response to selecting said one of the groups of cut patterns, send one or more instructions to the profiler module to thereby cause the profiler module to cut the workpiece according to a corresponding cut pattern of the selected group of cut patterns such that the profiler module makes a first portion of the through-cut through the workpiece along the cutting plane. 16. The system of claim 15 , further including a second saw
Computer numerical control means · CPC title
Control means comprising cameras, vision or image processing systems · CPC title
Combinations of several similar cutting apparatus · CPC title
by cross-cutting (saw benches with non-feedable circular saw blades for cross-cutting laterally fed workpieces B27B5/228; cross-cutting reciprocating saws with power drive B27B11/00) · CPC title
characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.