Multi-layered diamond-like carbon coating for electronic components

Patent metadata

Field	Value
Publication number	US-11729909-B2
Application number	US-202117380443-A
Country	US
Kind code	B2
Filing date	Jul 20, 2021
Priority date	Jul 20, 2021
Publication date	Aug 15, 2023
Grant date	Aug 15, 2023

Abstract

A multi-layer coating on an outer surface of a substrate includes a first layer applied directly to the outer surface of the substrate. The first layer includes diamond-like carbon (DLC) configured to mitigate metal whisker formation. A second layer is applied on a top surface of the first layer. The second layer is a conformal coating that includes a second material configured to bind to the top surface of the first layer and fill any microfractures that may form in the first layer. Optionally, a third layer is applied on a top surface of the second layer and includes DLC configured to protect the second layer from oxidation and degradation.

First claim

Having thus described various embodiments of the invention, what is claimed as new and desired to be protected by Letters Patent includes the following:

1. A substrate having a multi-layer coating on an outer surface thereof, the multi-layer coating comprising:
a first layer applied directly to the outer surface of the substrate, wherein the first layer comprises diamond-like carbon (DLC) configured to mitigate metal whisker formation; and
a second layer applied on a top surface of the first layer,
wherein the second layer is a conformal coating comprising a second material configured to bind to the top surface of the first layer,
wherein the conformal coating is configured to fill any microfractures that may form in the first layer, and
wherein the first layer is doped with silicon to soften the first layer and substantially reduce formation of microfractures.

2. The substrate of claim 1 , further comprising a third layer applied on a top surface of the second layer, wherein the third layer comprises diamond-like carbon configured to protect the second layer from oxidation and degradation.

3. The substrate of claim 2 , wherein the third layer is thicker than the first layer.

4. The substrate of claim 2 ,
wherein the third layer is doped with silicon to soften the third layer and substantially reduce formation of microfractures.

5. The substrate of claim 1 , wherein the substrate is an electronic component comprising metal, plastic, silicon, or epoxy.

6. The substrate of claim 1 , wherein the substrate is a printed circuit board.

7. The substrate of claim 1 , wherein the first layer comprises true DLC material without dopants.

8. The substrate of claim 1 , wherein the first layer has a thickness that is less than about 5 microns.

9. The substrate of claim 1 , wherein the first layer has a thickness that is between about 0.1 micron to about 0.9 micron.

10. A method of forming a multi-layer coating on a substrate, comprising:
depositing a first layer directly on the substrate, said first layer comprising diamond-like carbon (DLC), wherein the first layer is configured to prevent metal whisker formation;
depositing a second layer on a top surface of the first layer, wherein the second layer comprises an organic polymer material, said second layer configured to fill microcracks in the first layer; and
before depositing the first layer, doping the diamond-like carbon with a dopant for softening the first layer.

11. The method of claim 10 , further comprising:
depositing a third layer on top of the second layer, said third layer comprising diamond-like carbon, wherein the third layer is configured to protect the second layer from oxidation and degradation.

12. The method of claim 11 , further comprising:
before depositing the third layer, doping the diamond-like carbon with a dopant for softening the third layer.

13. The method of claim 10 , further comprising:
treating a surface of the substrate prior to depositing the first layer.

14. The method of claim 10 , wherein depositing the first layer comprises depositing carbon atoms via plasma-enhanced chemical-vapor deposition.

15. The method of claim 10 , wherein depositing the first layer comprises ion beam deposition.

16. An electronic device comprising:
an electronic component having an outer surface;
a first layer on the outer surface of the electronic component, wherein the first layer comprises diamond-like carbon (DLC) configured to mitigate metal whisker formation,
wherein the first layer comprises silicon dopants to soften the first layer and substantially reduce formation of microfractures;
a second layer on a top surface of the first layer, wherein the second layer is a conformal coating comprising a second material configured to bind to the top surface of the first layer; and
a third layer on a top surface of the second layer, wherein the third layer comprises diamond-like carbon (DLC) configured to protect the second layer from oxidation and degradation.

17. The electronic device of claim 16 , wherein the first layer has a thickness that is less than about 5 microns.

18. The electronic device of claim 16 , wherein the third layer is thicker than the first layer.

19. The electronic device of claim 16 , wherein the electronic component is a printed circuit board.

20. The electronic device of claim 16 ,
wherein the third layer comprises silicon dopants to soften the third layer and substantially reduce formation of microfractures.

Assignees

• Honeywell Federal Mfg & Tech Llc

Inventors

• Selter Thomas Matthew
• Schlitzer Justin
• Du Surbhi Mahajan

Classifications

• H05K1/053 Primary

  the metal substrate being covered by an inorganic insulating layer · CPC title

• C23C14/0611

  Diamond · CPC title

• C23C14/16

  on metallic substrates or on substrates of boron or silicon · CPC title

• C23C14/221

  Ion beam deposition (C23C14/46, C23C14/48 take precedence) · CPC title

• C23C16/0272

  Deposition of sub-layers, e.g. to promote the adhesion of the main coating · CPC title