Radio frequency filter fin pack design in consumer electronics

US11726529B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11726529-B2
Application numberUS-202117503631-A
CountryUS
Kind codeB2
Filing dateOct 18, 2021
Priority dateNov 2, 2018
Publication dateAug 15, 2023
Grant dateAug 15, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A thermal management device with electromagnetic (EM) shielding includes a fin pack with a plurality of channels. The fin pack has an upper and lower surface. The fin pack has a pack length, pack height, and pack width. The fin pack has fins are oriented connecting the upper surface to the lower surface. The plurality of channels extends from a first end toward a second end. A first channel of the plurality of channels is adjacent the upper surface, and a second channel of the plurality of channels is adjacent the lower surface.

First claim

Opening claim text (preview).

What is claimed is: 1. A computing device, comprising: a housing having an aperture; a heat source located inside an electromagnetic shield, wherein the electromagnetic shield has an aperture, the aperture in the electromagnetic shield aligned with the aperture in the housing; one or more electromagnetic radiation emitting electronic components within the housing but outside the electromagnetic shield; and a fin pack located in the electromagnetic shield aperture and thermally connected to the heat source. 2. The computing device of claim 1 , wherein the fin pack provides fluid communication through the electromagnetic shield. 3. The computing device of claim 2 , wherein the fluid communication is through the fin pack. 4. The computing device of claim 2 , wherein the fluid communication is from a shielded side to an unshielded side of the electromagnetic shield. 5. The computing device of claim 1 , further comprising a heat transfer element located between the heat source and the fin pack. 6. The computing device of claim 1 , the electromagnetic shield defining a shielded side and an unshielded side with the aperture therethrough from the shielded side to the unshielded side. 7. The computing device of claim 1 , the fin pack attenuating electromagnetic radiation in an attenuation range by at least 30 decibels. 8. The computing device of claim 7 , the attenuation range being between 2.2 Gigahertz (GHz) and 2.6 GHz. 9. The computing device of claim 7 , the attenuation range being between 1.8 GHz and 2.0 GHz. 10. The computing device of claim 7 , the attenuation range being between 800 Megahertz (MHz) and 900 MHz. 11. The computing device of claim 1 , the aperture having an area of at least 2 square centimeters (cm 2 ). 12. The computing device of claim 1 , the heat source including a heat transfer element configured to transfer heat from a processor toward the aperture. 13. The computing device of claim 1 , the fin pack having a thermal conductivity of at least 100 Watts per meter-Kelvin (W/m·K). 14. The computing device of claim 1 , the fins having at least one rail connected thereto, the rail being positioned to contact more at least two of the fins. 15. A computing device, comprising: a housing; an antenna; a heat source; an electromagnetic shield defining a shielded side and an unshielded side with an aperture therethrough from the shielded side to the unshielded side, wherein the antenna is positioned on the shielded side, the electromagnetic shield enclosing the heat source on at least a portion of a bottom side and on at least a portion of a lateral side; a fin pack positioned in the aperture and in thermal communication with the heat source; and one or more electromagnetic radiation emitting electronic components within the housing but outside the electromagnetic shield. 16. The computing device of claim 15 , the fin being pack adjacent the antenna without any added electromagnetic shielding between the fin pack and the antenna. 17. The computing device of claim 15 , the fin pack having at least one channel therethrough, the channel providing fluid communication through the fin pack from the shielded side to the unshielded side. 18. A computing device, comprising: an antenna; a heat source; a fin pack in thermal communication with the heat source, the fin pack adjacent the antenna, the fin pack having at least one channel therethrough, the fin pack attenuating electromagnetic radiation in an attenuation range by at least 30 decibels, the attenuation range being between 2.2 Gigahertz (GHz) and 2.6 GHz, the fins having at least one rail connected thereto, the rail being positioned to contact more at least two of the fins; and an electromagnetic shield defining a shielded side and an unshielded side with an aperture therethrough from the shielded side to the unshielded side, the fin pack positioned in the aperture, wherein the antenna is positioned on the shielded side, wherein the fin pack provides fluid communication through the electromagnetic shield. 19. The computing device of claim 18 , the aperture having an area of at least 2 square centimeters (cm 2 ). 20. The computing device of claim 18 , the channel providing fluid communication through the fin pack from the shielded side to the unshielded side.

Assignees

Inventors

Classifications

  • G06F1/1656Primary

    Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title

  • the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone (details of antennas disposed inside a computer H01Q1/2266) · CPC title

  • for portable computers, e.g. for laptops · CPC title

  • Computer-aided design [CAD] · CPC title

  • Shield cases mounted on a PCB, e.g. cans or caps or conformal shields · CPC title

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Frequently asked questions

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What does patent US11726529B2 cover?
A thermal management device with electromagnetic (EM) shielding includes a fin pack with a plurality of channels. The fin pack has an upper and lower surface. The fin pack has a pack length, pack height, and pack width. The fin pack has fins are oriented connecting the upper surface to the lower surface. The plurality of channels extends from a first end toward a second end. A first channel of …
Who is the assignee on this patent?
Microsoft Technology Licensing Llc
What technology area does this patent fall under?
Primary CPC classification G06F1/1656. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 15 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).