Wireless controllable lighting device

Patent metadata

Field	Value
Publication number	US-11725809-B2
Application number	US-202217726031-A
Country	US
Kind code	B2
Filing date	Apr 21, 2022
Priority date	Apr 3, 2019
Publication date	Aug 15, 2023
Grant date	Aug 15, 2023

Abstract

A lighting device (e.g., a controllable light-emitting diode illumination device) may have a light-generation module that may be assembled and calibrated prior to the light-generation module being installed in a finished good. The light-generation module may include an emitter module having at least one emitter mounted to a substrate and configured to emit light. The light-generation module may include a first printed circuit board on which the emitter module may be mounted and a second printed circuit board on which those circuits that are essential for powering the emitter module may be mounted. The light-generation module may include a heat sink located between the first printed circuit board and the second printed circuit board. The emitter module may be thermally-coupled to the heat sink through the substrate and the first printed circuit board.

First claim

What is claimed is:

1. A lighting device comprising:
an emitter mounted to a substrate and configured to emit light;
a first printed circuit board to which the substrate is mounted;
a first heat sink located adjacent to the first printed circuit board, the first heat sink defining a front surface and at least one sidewall extending from a periphery of the front surface, wherein the emitter is thermally-coupled to the front surface of the first heat sink through the substrate and the first printed circuit board; and
a second heat sink defining a cavity in which the first printed circuit board and the first heat sink are located, the first heat sink thermally coupled to the second heat sink;
wherein the first heat sink is configured to radiate heat generated by the emitter radially out through the at least one sidewall to the second heat sink.

2. The lighting device of claim 1 , wherein the sidewall of the first heat sink is thermally coupled to the second heat sink.

3. The lighting device of claim 2 , wherein the front surface of the first heat sink defines a planar front surface having a circular periphery.

4. The lighting device of claim 2 , wherein the first heat sink is smaller in volume than the second heat sink, and the first heat sink is made from a material that is more thermally conductive than a material of the second heat sink.

5. The lighting device of claim 1 , further comprising:
a second printed circuit board to which a drive circuit for the emitter, a control circuit for controlling the drive circuit, and a wireless communication circuit configured to communicate wireless control signals are mounted, wherein the second printed circuit board is located within the cavity of the second heat sink;
wherein the first heat sink is located between the first printed circuit board and the second printed circuit board.

6. The lighting device of claim 5 , wherein the second printed circuit board is arranged in a plane that is parallel to a plane of the first printed circuit board.

7. A lighting device comprising:
an emitter mounted to a substrate and configured to emit light;
a first printed circuit board to which the substrate is mounted; and
a heat sink located adjacent to the first printed circuit board, the heat sink defining a front surface and at least one sidewall extending from a periphery of the front surface, wherein the emitter is thermally-coupled to the front surface of the heat sink through the substrate and the first printed circuit board,
wherein the substrate comprises:
a plurality of electrical pads located on a bottom surface of the substrate and grouped together in sets of multiple pads, the electrical pads coupled to corresponding electrical pads on a top side of the first printed circuit board; and
one or more heat sink pads located on the bottom surface of the substrate, the heat sink pads comprising a central pad and four corner pads located in respective corners of the substrate.

8. The lighting device of claim 7 , further comprising:
a second printed circuit board to which a drive circuit for the emitter, a control circuit for controlling the drive circuit, and a wireless communication circuit configured to communicate wireless control signals are mounted,
wherein the heat sink is located between the first printed circuit board and the second printed circuit board.

9. The lighting device of claim 8 , wherein the second printed circuit board is arranged in a plane that is parallel to a plane of the first printed circuit board.

10. The lighting device of claim 7 , further comprising:
a spacer located between the first printed circuit board and the front surface of the heat sink, the spacer defining a void in which a thermally-conductive substance is located.

11. The lighting device of claim 10 , wherein the spacer is integral to the heat sink.

12. The lighting device of claim 7 , wherein the heat sink comprises a recess in the front surface, the recess filled with a thermally-conductive substance.

13. The lighting device of claim 7 , wherein at least one of the sets of electrical pads on the bottom surface of the substrate is surrounded by an electrostatic discharge trace that is connected to a ground plane of the first printed circuit board.

14. The lighting device of claim 7 , wherein at least one of the sets of electrical pads on the top side of the first printed circuit board is surrounded by an electrostatic discharge trace that is connected to a ground plane of the first printed circuit board.

15. The lighting device of claim 7 , wherein the corner pads of the heat sink pads are connected to the central pad by respective arms.

Assignees

• Lutron Tech Co Llc

Inventors

• Bocock Ryan M
• Bollinger Jr Robert
• Camden Richard S
• Gascho Kevin L
• Newman Jr Robert C
• Ogden Jr Peter W

Classifications

• H05B47/19 Primary

  via wireless transmission · CPC title

• F21Y2113/13

  comprising an assembly of point-like light sources · CPC title

• F21V29/713 Primary

  in direct thermal and mechanical contact of each other to form a single system · CPC title

• F21V7/06

  with parabolic curvature · CPC title

• H05K1/0204

  using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence) · CPC title