Method for the inspection of bonding patterns of packages for products

US11724463B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11724463-B2
Application numberUS-202217901934-A
CountryUS
Kind codeB2
Filing dateSep 2, 2022
Priority dateSep 7, 2021
Publication dateAug 15, 2023
Grant dateAug 15, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A non-destructive, non-invasive method for inspection of bonding patterns of packages for products, such as patches or medicated patches, involves thermally probing the packages and the bonding patterns and retrieving a thermal response thereof. The inspection is based in the analysis of the thermal response.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for inspection of bonding patterns of packages for products, the method comprising: feeding a first web material, providing a first heated pattern on the first web material, feeding a second web material, providing a second heated pattern on the second web material, routing the first web material and the second web material to a bonding location with the first heated pattern and the second heated pattern facing one another, bonding the first web material to the second web material by compression of the first heated pattern against the second heated pattern, thereby defining a bonding pattern at overlapping areas of the first heated pattern and the second heated pattern, thermally probing the bonding pattern and the package and detecting a thermal response thereof, the thermal response peaking at the first and second heated patterns as compared to the package, and comparing an offset between subsequent peaking locations of the thermal response of the bonding pattern with a reference offset. 2. The method of claim 1 , wherein said reference offset is proportional to a distance between subsequent fully overlapping first and second heated patterns in the bonding pattern. 3. The method of claim 1 , wherein the first heated pattern is identical to the second heating pattern. 4. The method of claim 1 , wherein said thermally probing comprises thermally probing the bonding pattern and the package on one side thereof only. 5. The method of any of claim 1 , wherein said thermally probing comprises thermally probing the bonding pattern and the package on opposite sides thereof only. 6. The method of claim 1 , wherein said thermally probing comprises thermally probing by means of an infrared camera. 7. The method of any of claim 1 , wherein said thermally probing comprises thermally probing by means of a pyrometer. 8. The method of claim 1 , wherein thermally probing the bonding pattern and the package is performed while the package moves out of the bonding location. 9. The method of claim 1 , wherein the bonding pattern has a closed perimeter, and wherein the reference offset is a distance between opposite sides of the closed perimeter with fully overlapping first and second heated patterns. 10. The method of claim 1 , wherein said providing a first heated pattern on the first web material comprises feeding the first web material through a first pair of heated patterned rollers, and wherein said providing a second heated pattern on the second web material comprises feeding the second web material through a second pair of heated patterned rollers. 11. The method of claim 10 , wherein said bonding location comprises a third pair of bonding rollers. 12. The method of claim 1 , wherein at least one of the first and second web materials is coated with an adhesive layer, and wherein the heated pattern is provided at the adhesive layer. 13. The method of claim 1 , wherein said thermally probing has a sampling time of 1 ms or less. 14. The method of claim 1 , further comprising feeding a product at the bonding location prior to bonding the first web material to the second web material. 15. The method of claim 14 , comprising bonding the first web material to the second web material so that the product remains enclosed within the bonding pattern.

Assignees

Inventors

Classifications

  • Single lap to lap joints, i.e. overlap joints (B29C66/45, B29C66/472, B29C66/52272 take precedence) · CPC title

  • Non woven mats, e.g. felt · CPC title

  • B29C65/18Primary

    using heated tools · CPC title

  • of continuously moving sheets or webs · CPC title

  • cooperating rollers, cylinders or drums · CPC title

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Frequently asked questions

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What does patent US11724463B2 cover?
A non-destructive, non-invasive method for inspection of bonding patterns of packages for products, such as patches or medicated patches, involves thermally probing the packages and the bonding patterns and retrieving a thermal response thereof. The inspection is based in the analysis of the thermal response.
Who is the assignee on this patent?
Fameccanica Data Spa
What technology area does this patent fall under?
Primary CPC classification B29C66/1122. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 15 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).