Vehicle vision system with forward viewing camera
US-2015327398-A1 · Nov 12, 2015 · US
US11722758B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11722758-B2 |
| Application number | US-202217663223-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 13, 2022 |
| Priority date | Nov 12, 2018 |
| Publication date | Aug 8, 2023 |
| Grant date | Aug 8, 2023 |
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A vehicular camera includes a camera housing having a first portion and a second portion joined to the first portion. The first portion of the camera housing accommodates a lens and has an attaching portion having a first coefficient of thermal expansion (CTE). A circuit board includes circuitry disposed at a circuit board substrate that has a second CTE that is different from the first CTE. The circuitry includes an imager. The circuit board substrate is attached at the attaching portion of the first portion of the camera housing. When the vehicular camera is operated at an operating temperature greater than 50 degrees C., the attaching portion expands a greater degree than the circuit board substrate. When the vehicular camera is operated at an operating temperature below −20 degrees C., the attaching portion contracts a greater degree than the circuit board substrate.
Opening claim text (preview).
The invention claimed is: 1. A vehicular camera, the vehicular camera comprising: a camera housing comprising a first portion and a second portion joined to the first portion; wherein the first portion of the camera housing accommodates a lens, and wherein the first portion of the camera housing comprises an attaching portion having a first coefficient of thermal expansion (CTE); a circuit board comprising circuitry disposed at a circuit board substrate having a first side and a second side opposite the first side and separated from the first side by a thickness of the circuit board substrate, the circuit board substrate having a second CTE that is different from the first CTE; wherein the circuitry comprises an imager disposed at the first side of the circuit board substrate, and wherein the imager comprises an imaging array having at least one million photosensors arranged in rows and columns; wherein the circuit board substrate is attached at the attaching portion of the first portion of the camera housing; wherein, when the vehicular camera is operated at an operating temperature greater than 50 degrees C., the attaching portion expands a greater degree than the circuit board substrate; and wherein, when the vehicular camera is operated at an operating temperature below −20 degrees C., the attaching portion contracts a greater degree than the circuit board substrate. 2. The vehicular camera of claim 1 , wherein the lens is accommodated by a lens barrel of the first portion of the camera housing. 3. The vehicular camera of claim 1 , wherein the circuit board substrate is attached at the attaching portion of the first portion of the camera housing via at least one fastener. 4. The vehicular camera of claim 3 , wherein the at least one fastener threadedly engages the attaching portion to attach the circuit board substrate to the attaching portion. 5. The vehicular camera of claim 1 , wherein the circuit board substrate is attached at the attaching portion of the first portion of the camera housing via a plurality of fasteners. 6. The vehicular camera of claim 1 , wherein the second CTE of the circuit board substrate is less than the first CTE of the attaching portion of the first portion of the camera housing. 7. The vehicular camera of claim 1 , wherein the attaching portion comprises part of an attaching element that is threadedly attached at the first portion of the camera housing. 8. The vehicular camera of claim 7 , wherein the attaching element is threadedly adjusted at the first portion of the camera housing to adjust the circuit board substrate and the imager relative to the lens along a longitudinal axis of the lens. 9. The vehicular camera of claim 1 , wherein the first portion of the camera housing comprises metal. 10. The vehicular camera of claim 1 , wherein the attaching portion comprises a polymeric structure. 11. The vehicular camera of claim 1 , wherein the attaching portion is configured to join the first portion of the camera housing with the second portion of the camera housing. 12. The vehicular camera of claim 1 , wherein the attaching portion comprises a plurality of posts extending parallel to a longitudinal axis of the lens, and wherein the posts are spaced apart around the longitudinal axis of the lens. 13. The vehicular camera of claim 12 , wherein the posts are separate from and inward from exterior walls of the first portion of the camera housing. 14. The vehicular camera of claim 12 , wherein flexing of the posts in a radial direction accommodates temperature-induced expansion or contraction of the first portion of the camera housing relative to the circuit board substrate without flexing the circuit board substrate. 15. The vehicular camera of claim 14 , wherein each post of the plurality of posts is configured to not flex in a direction normal to the radial direction. 16. The vehicular camera of claim 12 , wherein the plurality of posts comprises at least two posts at opposite portions of the circuit board substrate. 17. The vehicular camera of claim 12 , wherein the plurality of posts comprises at least four posts spaced circumferentially around the circuit board substrate. 18. The vehicular camera of claim 1 , wherein the vehicular camera captures image data for a surround view display of a vehicle equipped with the vehicular camera. 19. A vehicular camera, the vehicular camera comprising: a camera housing comprising a first portion and a second portion joined to the first portion; wherein the first portion of the camera housing includes a lens barrel that accommodates a lens, and wherein the first portion of the camera housing comprises an attaching portion having a first coefficient of thermal expansion (CTE); wherein the first portion of the camera housing comprises metal; a circuit board comprising circuitry disposed at a circuit board substrate having a first side and a second side opposite the first side and separated from the first side by a thickness of the circuit board substrate, the circuit board substrate having a second CTE that is different from the first CTE; wherein the circuitry comprises an imager disposed at the first side of the circuit board substrate, and wherein the imager comprises an imaging array having at least one million photosensors arranged in rows and columns; wherein the circuit board substrate is attached at the attaching portion of the first portion of the camera housing; wherein, when the vehicular camera is operated at an operating temperature greater than 50 degrees C., the attaching portion expands a greater degree than the circuit board substrate; and wherein, when the vehicular camera is operated at an operating temperature below −20 degrees C., the attaching portion contracts a greater degree than the circuit board substrate. 20. The vehicular camera of claim 19 , wherein the circuit board substrate is attached at the attaching portion of the first portion of the camera housing via at least one fastener. 21. The vehicular camera of claim 19 , wherein the second CTE of the circuit board substrate is less than the first CTE of the attaching portion of the first portion of the camera housing. 22. The vehicular camera of claim 19 , wherein the attaching portion is configured to join the first portion of the camera housing with the second portion of the camera housing. 23. A vehicular camera, the vehicular camera comprising: a camera housing comprising a first portion and a second portion joined to the first portion; wherein the first portion of the camera housing includes a lens barrel that accommodates a lens, and wherein the first portion of the camera housing comprises an attaching portion having a first coefficient of thermal expansion (CTE); a circuit board comprising circuitry disposed at a circuit board substrate having a first side and a second side opposite the first side and separated from the first side by a thickness of the circuit board substrate, the circuit board substrate having a second CTE; wherein the second CTE of the circuit board substrate is less than the first CTE of the attaching portion of the first portion of the camera housing; wherein the circuitry comprises an imager disposed at the first side of the circuit board substrate, and wherein the imager comprises an imaging array having at least one million photosensors arranged in rows and columns; wherein the circuit board substrate is attached at the attaching portion of the first portion of t
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