Integrated magnetometer arrays for magnetoencephalography (meg) detection systems and methods
US-2020309873-A1 · Oct 1, 2020 · US
US11719765B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11719765-B2 |
| Application number | US-202217739066-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 6, 2022 |
| Priority date | Jun 4, 2021 |
| Publication date | Aug 8, 2023 |
| Grant date | Aug 8, 2023 |
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An embodiment of the invention relates to a sensor comprising a sensor element (10) for measuring a magnetic field, the sensor element (10) comprising a set of at least two first input ports (I1), a set of at least two exit ports (E) each of which is connected to one of the first input ports (I1) via a corresponding first beam path (B1), a set of at least two second input ports (I2) each of which is connected to a second beam path (B2), wherein the first beam paths (B1) extend through a common plane (CP) located inside the sensor element (10), said plane (CP) comprising a plurality of magneto-optically responsive defect centers, wherein the second beam paths (B2) also extend through said common plane (CP), but are angled with respect to the first beam paths (B1) such that a plurality of intersections between the first and second beam paths (B2) is defined, and wherein each intersection forms a sensor pixel (P) located at at least one of said magneto-optically responsive defect centers.
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The invention claimed is: 1. Sensor comprising a sensor element ( 10 ) for measuring a magnetic field, the sensor element ( 10 ) comprising a set of at least two first input ports (I 1 ), a set of at least two exit ports (E) each of which is connected to one of the first input ports (I 1 ) via a corresponding first beam path (B 1 ), a set of at least two second input ports (I 2 ) each of which is connected to a second beam path (B 2 ), wherein the first beam paths (B 1 ) extend through a common plane (CP) located inside the sensor element ( 10 ), said plane (CP) comprising a plurality of magneto-optically responsive defect centers, wherein the second beam paths (B 2 ) also extend through said common plane (CP), but are angled with respect to the first beam paths (B 1 ) such that a plurality of intersections between the first and second beam paths (B 2 ) is defined, and wherein each intersection forms a sensor pixel (P) located at at least one of said magneto-optically responsive defect centers. 2. Sensor of claim 1 wherein the first beam paths (B 1 ) are parallel, the second beam paths (B 2 ) are parallel, and the first beam paths (B 1 ) are perpendicular to the second beam paths (B 2 ) such that the intersections form a two-dimensional array of sensor pixels (P). 3. Sensor of claim 1 further comprising a set of detectors ( 20 ) each of which is individually assigned to one of said exit ports, an evaluation unit ( 30 ) connected to said set of detectors ( 20 ) and configured to evaluate detection signals (DS) of the detectors ( 20 ) in order to generate one or more measurement values (M), a first emitter unit ( 40 ) which is capable of generating a first radiation (R 1 ) and activating at least one of the first beam paths (B 1 ) by injecting the first radiation (R 1 ), a second emitter unit ( 50 ) which is capable of generating a second radiation (R 2 ) and activating at least one of the second beam paths (B 2 ) by injecting the second radiation (R 2 ), a control unit ( 60 ) configured to control the first and second emitter unit ( 40 , 50 ), and a microwave generator ( 70 ) capable of generating a microwave field at the intersection points of the beam paths (B 1 , B 2 ). 4. Sensor of claim 3 wherein the control unit ( 60 ) is configured to control the second emitter unit ( 50 ) such that maximally one of the second beam paths (B 2 ) is provided with the second radiation (R 2 ) in each moment of time. 5. Sensor of claim 3 wherein the control unit ( 60 ) is configured to control the first emitter unit ( 40 ) to input the first radiation (R 1 ) into all of the first beam paths (B 1 ) simultaneously, and the evaluation unit ( 30 ) is configured to evaluate the detection signals (DS) of the detectors ( 20 ) simultaneously in order to generate simultaneously measurement values (M) for all first beam paths (B 1 ). 6. Sensor of claim 3 further comprising a printed circuit board ( 100 ) located on top of the sensor element ( 10 ) or below the sensor element ( 10 ) and providing at least one coil ( 71 ), wherein the microwave generator ( 70 ) is configured to provide a microwave signal to said at least one coil ( 71 ) to generate a microwave field in the sensor element ( 10 ). 7. Sensor of claim 6 wherein said printed circuit board ( 100 ) comprises a plurality of coils ( 71 ) each of which is assigned to one of the intersections, and each of the intersections is provided with a microwave field generated by the individually assigned coil ( 71 ). 8. Sensor of claim 1 further comprising a carrier ( 100 ) on which the sensor element ( 10 ) is mounted, wherein the carrier ( 100 ) provides at least one groove that carries a fiber ( 120 ), and wherein said fiber ( 120 ) connects one of the input ports (I 1 , I 2 ) with the first or second emitter unit ( 40 , 50 ), or connects one of the exit ports (E) with one of the detectors ( 20 ). 9. Sensor of claim 1 further comprising a carrier ( 100 ) on which the sensor element ( 10 ) is mounted, wherein at least one of the first and second emitter units ( 40 , 50 ) comprises an emitter element that is mounted on the carrier ( 100 ) and individually assigned to one of the input ports, and/or wherein at least one of the detectors ( 20 ) is mounted on the carrier ( 100 ). 10. Sensor of claim 8 wherein at least one lens ( 130 ) is mounted on the carrier ( 100 ) between one of the input ports (I 1 , I 2 ) and the respective fiber ( 120 ), between one of the emitter elements ( 40 , 50 ) and the respective input port (I 1 , I 2 ), or between one of the exit ports (E) and the respective detector ( 20 ). 11. Sensor of claim 1 wherein at least one of the first or second beam paths (B 2 ) is provided with a waveguide that is integrated in the sensor element ( 10 ) and guides the radiation through said common plane (CP). 12. Sensor of claim 1 wherein reflection zones may be provided that allow the radiation to pass the beams paths at least twice. 13. Sensor of claim 1 wherein the sensor comprises a pixel position control unit capable of varying the positions and/or directions of the beam paths and therefore vary the positions of the intersections. 14. Method of measuring a magnetic field using a sensor according to claim 1 , the method comprising the steps of injecting a first radiation (R 1 ) into at least one of the first beam paths (B 1 ), injecting a second radiation (R 2 ) into at least one of the second beam paths (B 2 ), generating a microwave field at least at the intersection point where the at least one of the first beam paths (B 1 ) and at the least one of the second beam paths (B 2 ) intersect, detecting the first radiation (R 1 ), and evaluating the detected radiation and generating one or more measurement values (M) that describe the magnetic field at the intersection or intersections where the first and second radiation (R 2 ) intercept. 15. Method of claim 14 wherein the first radiation (R 1 ) is simultaneously injected into all of the first beam paths (B 1 ), and the second radiation (R 2 ) is injected into a single one of the second beam paths (B 2 ), and measurement values (M) are generated for each of the sensor pixels (P) that belong to the activated second beam path (B 2 ). 16. Method of claim 14 wherein evaluating the detected radiation and generating one or more measurement values (M) includes measuring the absorption of the first radiation (R 1 ). 17. Method of claim 15 wherein evaluating the detected radiation and generating one or more measurement values (M) includes measuring the absorption of the first radiation (R 1 ).
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