Plate spring member

US11719299B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11719299-B2
Application numberUS-201917041011-A
CountryUS
Kind codeB2
Filing dateMar 28, 2019
Priority dateMar 28, 2018
Publication dateAug 8, 2023
Grant dateAug 8, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A plate spring member having a compressive residual stress distribution in which a compressive residual stress of at least part of a portion having a depth from a surface within 50 μm is 500 MPa or more, and the compressive residual stress of a portion having a depth from the surface exceeding 50 μm is less than 500 MPa.

First claim

Opening claim text (preview).

The invention claimed is: 1. A plate spring member comprising: a compressive residual stress distribution in which a compressive residual stress of at least part of a portion having a depth from a surface within 50 μm is 500 MPa or more, and the compressive residual stress of all portions having a depth from the surface exceeding 50 μm is less than 500 MPa, wherein when a difference in compressive residual stress between two points having a depth from the surface of 0 μm and 30 μm is defined as Δσ, and a difference in depth from the surface between the two points is defined as Δz, a value of a residual stress gradient I defined by I=Δσ÷Δz is −40 to −3 MPa/μm. 2. The plate spring member according to claim 1 , wherein the plate spring member includes a compressive residual stress distribution in which the compressive residual stress of at least part of a portion having a depth from the surface within 30 μm is 500 MPa or more, and the compressive residual stress of a portion having a depth from the surface exceeding 30 μm is less than 500 MPa. 3. The plate spring member according to claim 1 , wherein the plate spring member is a disc spring formed in an annular shape, the disc spring has an inner peripheral surface facing an inner side in a radial direction, an outer peripheral surface facing an outer side in the radial direction, an inner peripheral edge which is an end surface on the inner side in the radial direction, and an outer peripheral edge which is an end surface on the outer side in the radial direction, the compressive residual stress distribution being imparted to the inner peripheral surface, and the compressive residual stress distribution not being imparted to the outer peripheral surface. 4. The plate spring member according to claim 1 , wherein the plate spring member is a wavy spring in which a plurality of peak parts and a plurality of valley parts are alternately connected in a circumferential direction and formed in an annular shape centered on a central axis, and the compressive residual stress distribution is imparted to a surface of the peak part closer to the valley part in an axial direction along the central axis, and a surface of the valley part closer to the peak part in the axial direction, and no compressive residual stress distribution is imparted to a surface of the peak part farther from the valley part in the axial direction, and a surface of the valley part farther from the peak part in the axial direction. 5. A plate spring member comprising: a compressive residual stress distribution in which a compressive residual stress of at least part of a portion having a depth from a surface within 50 μm is 500 MPa or more, and the compressive residual stress of a portion having a depth from the surface exceeding 50 μm is less than 500 MPa, and wherein when a difference in compressive residual stress between two points having a depth from the surface of 0 μm and 30 μm is defined as Δσ, and a difference in depth from the surface between the two points is defined as Δz, a value of a residual stress gradient I defined by I=Δσ÷Δz is −40 to −3 MPa/μm, the compressive residual stress of a first point of the two points having the depth from the surface of 0 μm is 500 MPa or more, and the compressive residual stress of a second point of the two points having the depth from the surface of 30 μm is less than 500 MPa, and a value of the compressive residual stress between the two points gradually decreases as the depth from the surface increases from 0 μm. 6. A plate spring member comprising: a compressive residual stress distribution in which a compressive residual stress of at least part of a portion having a depth from a surface within 30 μm is 500 MPa or more, and the compressive residual stress of a portion having a depth from the surface exceeding 30 μm is less than 500 MPa, and wherein when a difference in compressive residual stress between two points having a depth from the surface of 0 μm and 30 μm is defined as Δσ, and a difference in depth from the surface between the two points is defined as Δz, a value of a residual stress gradient I defined by I=Δσ÷Δz is −40 to −3 MPa/μm, the compressive residual stress of a first point of the two points having the depth from the surface of 0 μm is 500 MPa or more, and the compressive residual stress of a second point of the two points having the depth from the surface of 30 μm is less than 500 MPa, and a value of the compressive residual stress between the two points gradually decreases as the depth from the surface increases from 0 μm.

Assignees

Inventors

Classifications

  • F16F1/32Primary

    Belleville-type springs (friction-clutch diaphragm springs F16D13/583) · CPC title

  • Surface treatments · CPC title

  • pre-stressed · CPC title

  • leaf-like, e.g. of thin, planar-like metal · CPC title

  • conical · CPC title

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What does patent US11719299B2 cover?
A plate spring member having a compressive residual stress distribution in which a compressive residual stress of at least part of a portion having a depth from a surface within 50 μm is 500 MPa or more, and the compressive residual stress of a portion having a depth from the surface exceeding 50 μm is less than 500 MPa.
Who is the assignee on this patent?
Nhk Spring Co Ltd
What technology area does this patent fall under?
Primary CPC classification F16F1/32. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Aug 08 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).