Stretchable thermal radiation modulation system via mechanically tunable surface emissivity

US11718078B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11718078-B2
Application numberUS-202117149333-A
CountryUS
Kind codeB2
Filing dateJan 14, 2021
Priority dateJan 15, 2020
Publication dateAug 8, 2023
Grant dateAug 8, 2023

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

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Disclosed herein is a thermal radiation modulation system comprising a first low emissivity layer comprising a plurality of distributed, strain-dependent cracks, the first low emissivity layer comprising a first polymer composite layer and a first mirror-like metal layer with low emissivity covering a surface of the first polymer composite layer; a first elastomer layer bonded to the first low emissivity layer opposite to the mirror-like metal layer; and optionally a first stretchable heater, the first stretchable heater is attached to the first elastomer layer opposite to the first low emissivity layer, wherein a top surface of the first low emissivity layer comprising the mirror-like metal layer has a lower emissivity relative to the first elastomer layer. Methods of making and use of the system are further described.

First claim

Opening claim text (preview).

What is claimed is: 1. A thermal radiation modulation system, comprising: a low emissivity layer comprising a plurality of distributed, strain-dependent cracks, the low emissivity layer comprising a polymer composite layer and a mirror-like metal layer with low emissivity covering a surface of the polymer composite layer; an elastomer layer bonded to the low emissivity layer opposite to the mirror-like metal layer; and optionally a stretchable heater, the stretchable heater is attached to the elastomer layer opposite to the low emissivity layer, wherein a top surface of the low emissivity layer comprising the mirror-like metal layer has a lower emissivity relative to the elastomer layer. 2. The thermal radiation modulation system of claim 1 , comprising the stretchable heater. 3. The thermal radiation modulation system of claim 1 , further comprising an adhesive layer, an additional polymer composite layer, an additional low emissivity mirror-like metal layer, an additional elastomer layer, or a combination thereof. 4. The thermal radiation modulation system of claim 1 , wherein the polymer composite layer comprises a polymer and an inorganic material. 5. The thermal radiation modulation system of claim 4 , wherein the polymer composite layer comprises a 5:0.5 to 1:20 mass ratio of inorganic material:polymer. 6. The thermal radiation modulation system of claim 4 , wherein the polymer is polyvinylalcohol, polyvinyl butyral, polycarbonate, a polyacrylate, poly(ethyl acrylate), poly(methyl acrylate), poly(methyl methacrylate), polystyrene sulfonate, polyacrylic acid, polyethylenimine, polypropylene carbonate, polyvinylpyrrolidone, any non-crosslinked polymer, or a combination thereof. 7. The thermal radiation modulation system of claim 4 , wherein the polymer is polyvinylalcohol. 8. The thermal radiation modulation system of claim 4 , wherein the inorganic material is titanium dioxide; laponite; aluminum oxide; magnesium oxide; zinc oxide; silicon oxide; Palygorskite (attapulgite); iron oxide; calcium oxide; copper oxide; tungsten oxide; montmorillonite; halloysite; kaolinite; Au; Pd; Ag; Al; or a combination thereof. 9. The thermal radiation modulation system of claim 1 , wherein the elastomer layer comprises polyurethane rubber, polyacrylate rubber, acrylic rubber, natural rubber, fluoroelastomer, ethylene-propylene rubber (EPR), ethylene-butene rubber, ethylene-propylene-diene monomer rubber (EPDM), epichlorohydrin rubber, acrylate rubbers, hydrogenated nitrile rubber (HNBR), silicone elastomers, polyether block amides, ethylene vinyl acetate, styrene-butadiene-styrene (SBS), styrene-butadiene rubber (SBR), styrene-(ethylene-butene)-styrene (SEBS), acrylonitrile-butadiene-styrene (ABS), acrylonitrile-ethylene-propylene-diene-styrene (AES), styrene-isoprene-styrene (SIS), styrene-(ethylene-propylene)-styrene (SEPS), methyl methacrylate-butadiene-styrene (MBS), high rubber graft (HRG), polydimethylsiloxane (PDMS), or a combination thereof. 10. The thermal radiation modulation system of claim 1 , wherein the elastomer layer comprises a silicone elastomer. 11. The thermal radiation modulation system of claim 1 , wherein the elastomer layer has a thickness of about 0.05 to about 5 millimeters thick; the low emissivity layer has a thickness of about 10 nanometers to 350 micrometer; and the polymer composite layer has a thickness of about 5 nanometer to about 300 micrometer; and the mirror-like metal layer has a thickness of about 1 nanometers to about 5 micrometer. 12. The thermal radiation modulation system of claim 1 , wherein the thermal radiation modulation system can be used with an external heat source. 13. An article comprising the thermal radiation modulation system of claim 1 , wherein the article is a motion detection device, a thermal encryption device, a dynamic display, or thermal camouflage. 14. A method of using a thermal radiation modulation system, comprising: providing a thermal radiation modulation system of claim 1 ; applying a tensile strain of greater than 0% to less than 200% to the system, wherein the thermal radiation modulation system undergoes a reversible and tunable change in surface thermal radiation level. 15. The method of claim 14 , wherein the application of a strain is conducted in-plane uniaxial strain or out-of-plane bulging strain. 16. A method of making a thermal radiation modulation system, comprising: providing a polymer composite layer on a substrate, the polymer composite layer comprising a polymer and an inorganic material; applying a layer of elastomer on a top surface of the polymer composite layer and curing the elastomer to form a composite-elastomer assembly on the substrate; removing the composite-elastomer assembly from the substrate; applying a mirror-like metal layer on a surface of first polymer composite layer opposite to the elastomer layer; optionally attaching a stretchable heater to a surface of the elastomer layer opposite to the polymer composite layer; and forming a plurality of cracks in the polymer composite layer and mirror-like metal layer to result in a thermal radiation modulation system, wherein the mirror-like metal layer exhibits low emissivity relative to the elastomer layer. 17. The method of claim 16 , wherein the forming a plurality of cracks comprises pre-stretching the composite-elastomer assembly under strain and releasing the stretch to 0% strain. 18. The method of claim 17 , wherein the pre-stretching is conducted with in-plane uniaxial strain, in-plane biaxial strain, or a two-step in-plane uniaxial strain where the axes are perpendicular to one another. 19. The method of claim 17 , wherein the pre-stretching comprises applying a 50% to 250% uniaxial tensile pre-stretch to the composite-elastomer assembly; and releasing the pre-stretch to 0% strain.

Assignees

Inventors

Classifications

  • B32B27/306Primary

    comprising vinyl acetate or vinyl alcohol (co)polymers · CPC title

  • B32B7/023Primary

    Optical properties · CPC title

  • permitting easy separation · CPC title

  • using interposed adhesives or interposed materials with bonding properties · CPC title

  • comprising vinyl resins; comprising acrylic resins · CPC title

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What does patent US11718078B2 cover?
Disclosed herein is a thermal radiation modulation system comprising a first low emissivity layer comprising a plurality of distributed, strain-dependent cracks, the first low emissivity layer comprising a first polymer composite layer and a first mirror-like metal layer with low emissivity covering a surface of the first polymer composite layer; a first elastomer layer bonded to the first low …
Who is the assignee on this patent?
Univ Connecticut
What technology area does this patent fall under?
Primary CPC classification B32B27/306. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 08 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).