Polyamide moulding composition for extrusion blow moulding

US11718012B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11718012-B2
Application numberUS-201916719284-A
CountryUS
Kind codeB2
Filing dateDec 18, 2019
Priority dateDec 19, 2018
Publication dateAug 8, 2023
Grant dateAug 8, 2023

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Thermoplastic moulding composition consisting of(A) 51 to 69.9 wt % of polyamide elastomer;(B) 15 to 38 wt % of ethylene-α-olefin copolymer;(C) 3 to 25 wt % of polyamide selected from the group consisting of: PA6, PA66, PA6/66, PA610, PA612, PA614, PA616, PA6/610, PA66/610 or mixtures thereof;(D) 0.1 to 2.0 wt % of heat stabilizers based on copper and/or iodide, organic stabilizers or a mixture thereof;(E) 0 to 5.0 wt % of additives, different from (A) to (D);where the sum of (A) to (E) makes 100 wt % of the total moulding composition, and with the proviso that the sum of (B) and (C) is in the range from 30 to 48 wt % based on the total moulding composition.

First claim

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The invention claimed is: 1. A thermoplastic moulding composition consisting of: (A) 52-67.8 wt % of at least one polyamide elastomer, selected from the group consisting of: polyetheramide and polyetheresteramide, having hard segments selected from the group consisting of: PA6, PA66, PA6/66, PA610, PA612, and a combination thereof, and having soft segments in the form of OH- or NH 2 -functionalized polyether segments; (B) 18-36 wt % of at least one ethylene-α-olefin copolymer, where the α-olefin is selected from the group consisting of: but-1-ene, pent-1-ene, hex-1-ene, kept-1-ene and oct-1-ene and a combination thereof, and the ethylene-α-olefin copolymer is grafted with at least one system selected from the group consisting of: acrylic acid, methacrylic acid, and maleic anhydride, where the degree of grafting is 0.9 to 2.0 wt % based on the grafted ethylene-α-olefin copolymer; (C) 5-22 wt % of at least one polyamide selected from the group consisting of: PA6, PA66, PA6/66, PA610, and PA612; wherein the polyamide of component (C) has a relative viscosity of 3.4-4.2, measured according to ISO 307 (2013), in sulfuric acid, 1.0 wt %, 20° C.; (D) 0.1 to2.0 wt % of at least one of a heat stabilizer based on copper and/or iodide, lanthanoid compounds, or organic stabilizers; (E) 0 to 5.0 wt % of additives, different from (A) to (D); where the sum of (A) to (E) makes 100 wt % of the total moulding composition, and with the proviso that the sum of (B) and (C) is in the range from 32-45 wt % based on the total moulding composition. 2. The moulding composition according to claim 1 , wherein the soft segments of the polyamide elastomer of component (A) are selected from the group consisting of: polypropylene glycol (PPG), polytetrahydrofuran (PTHF), and a combination thereof; and/or wherein the hard segments of the polyamide elastomer of component (A) are selected from the group consisting of: PA6, PA66, PA6/66 and a combination thereof; and/or wherein the polyamide elastomer of component (A) or the mixture of polyamide elastomers of component (A) has a melting point, measured according to ISO 11357-3 (2013) at a heating rate of 20° C./min, in the range of 180-250° C., and/or a relative viscosity, measured according to ISO 307 (2013) at a concentration of 0.5 g of polymer in 100 ml of m-cresol and a temperature of 20° C., in the range from 1.40 to 2.40; and/or wherein the number-average molar mass of the soft segments is 200 to 5000 g/mol. 3. The moulding composition according to claim 1 , wherein the total ethylene-α-olefin copolymer of component (B) is grafted exclusively with maleic anhydride; and/or wherein component (B) consists exclusively of an ethylene-1-butene copolymer which is grafted with maleic anhydride with a degree of grafting in the range of 1.1-1.3 wt %, based on the grafted ethylene-1-butene copolymer; and/or wherein the ethylene-α-olefin copolymer of component (B) or the mixture of the ethylene-α-olefin copolymers of component (B) has a melting point in the range of 40-80° C., and/or a glass transition point of less than −20° C., and/or a melt flow index (MFR) in the range of 0.5-5.0 g/10 min or 0.8-2.0 g/10 min, at 230° C. and 2.16 kg as measured according to ASTM D 1238. 4. The moulding composition according to claim 1 , wherein the fraction of component (D) in the total moulding composition is in the range of 0.2-2.0 wt %. 5. The moulding composition according to claim 1 , wherein the heat stabilizers of component (D) comprise systems or consist of systems selected from the group consisting of: copper(I) iodide, potassium iodide, organic stabilizers, and a mixture thereof; and/or wherein the heat stabilizers of component (D) comprise or are exclusively formed by a mixture of copper(I) iodide, and potassium iodide; and/or wherein the heat stabilizers of component (D) comprise or are exclusively formed by a mixture of pentaerythritol tetrakis(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate) and tetrakismethylene(3,5-di-t-butyl-4-hydroxyhydrocinnamato)methane; and/or wherein the heat stabilizers of component (D) comprise systems or consist of systems selected from the group consisting of: copper(I) iodide, potassium iodide, lanthanum acetate, lanthanum hydroxide, lanthanum oxide, cerium acetate, cerium tetrahydroxide, cerium oxide, and mixtures thereof. 6. The moulding composition according to claim 1 , wherein the fraction of component (E) in the total moulding composition is in the range of 0-4.0 wt %; and/or wherein the additives of component (E) comprise systems selected from the following group or consist of these systems: crystallization accelerators or retardants, flow aids, lubricants, demoulding agents, pigments, dye and marking substances, processing aids, antistatic agents, carbon nanotubes, residues from polymerization processes, antioxidants, antiozonants, light stabilizers, UV stabilizers, UV absorbers or UV blockers, IR absorbers, NIR absorbers, antiblocking agents, nucleating agents, chain transfer agents, defoamers, chain-extending additives, conductivity additives, release agents, organic pigments, carbon black, graphite, graphene, photochromic agents, demoulding agents, optical brighteners, and also mixtures and combinations thereof. 7. The moulding composition according to claim 1 , wherein the moulding composition has a melt strength in the range of 30-70 seconds; and/or wherein the moulding composition has a tensile elasticity modulus of at most 800 MPa measured according to ISO 527 (2012), dry state; and/or wherein the moulding composition exhibits no delamination under dynamic-mechanical stressing after at least 1.3 million cycles with alternating compressive and tensile loading at 150° C. 8. A process for producing a moulding composition according to claim 1 , wherein components (A)-(E) in unison in melted or unmolten form are metered into a mixing apparatus. 9. The process for producing according to claim 8 , wherein components (A)-(E) in unison in melted form are metered into a mixing apparatus, in the form of an extrusion apparatus having one, two or more screws. 10. A method of using a moulding composition according to claim 1 comprising, applying the molding composition in a blow moulding process an injection moulding process, an extrusion process or a coextrusion process. 11. The method of use according to claim 10 , comprising use in a blow moulding process, selected from an extrusion blow moulding process, a stretch blow moulding process, 3D blow moulding, coextrusion blow moulding, coextrusion 3D blow moulding, sequential coextrusion, coextrusion suction blow moulding, or sequential blow moulding. 12. A moulding made from a moulding composition according to claim 1 . 13. The moulding composition according to claim 1 , wherein the fraction of component (A) in the total moulding composition is in the range of 53-64.6 wt %. 14. The moulding composition according to claim 1 , wherein the fraction of component (A) in the total moulding composition is in the range of 56-63.5 wt %. 15. The moulding composition according to claim 1 , wherein the hard segments of the polyamide elastomer of component (A) are formed exclusively by PA6; and/or wherein the polyamide elastomer of component (A) or the mixture of polyamide elastomers of component (A) has a melting point, measured according to ISO 11357-3 (2013) at a heating rate of 20° C./min, in the range of 200-220° C., and/or a relative viscosity, measured according to ISO 307 (2013) at a concentration of 0.5 g of polymer in 100 ml of m-cresol and a temperature of 20° C., in the range from 1.50-2.20

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Classifications

  • for heating or cooling · CPC title

  • for keeping constant thickness · CPC title

  • characterised by the material · CPC title

  • characterised by the choice of material · CPC title

  • Extrusion blow-moulding · CPC title

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What does patent US11718012B2 cover?
Thermoplastic moulding composition consisting of(A) 51 to 69.9 wt % of polyamide elastomer;(B) 15 to 38 wt % of ethylene-α-olefin copolymer;(C) 3 to 25 wt % of polyamide selected from the group consisting of: PA6, PA66, PA6/66, PA610, PA612, PA614, PA616, PA6/610, PA66/610 or mixtures thereof;(D) 0.1 to 2.0 wt % of heat stabilizers based on copper and/or iodide, organic stabilizers or a mixture…
Who is the assignee on this patent?
Ems Patent Ag
What technology area does this patent fall under?
Primary CPC classification B29C49/0006. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 08 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).