Ground detection system for ultrasonic cutting

US11717980B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11717980-B2
Application numberUS-202016737008-A
CountryUS
Kind codeB2
Filing dateJan 8, 2020
Priority dateJan 8, 2020
Publication dateAug 8, 2023
Grant dateAug 8, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In one embodiment, systems and methods include using an ultrasonic cutter in a ground detection system to prevent damage to a substrate. The method of detecting a substrate comprises attaching a workpiece clamp to the substrate. The method further comprises cutting a layer of coating disposed on the substrate with an ultrasonic cutter, wherein the ultrasonic cutter operates at a frequency of about 20 kHz to about 40 kHz, wherein the layer of coating is non-conductive. The method further comprises contacting the substrate with the ultrasonic cutter.

First claim

Opening claim text (preview).

What is claimed is: 1. A ground detection system, comprising: an ultrasonic cutter configured to remove a portion of a surface coating from a substrate; a power source; a workpiece clamp configured to form an electrical connection between the ultrasonic cutter, the substrate, and the ground detection system; and an electrical circuit comprising: a controller; a timer; and a switch; wherein the electrical circuit is configured to operate the switch to remove power from the ultrasonic cutter for an amount of time in response to the ultrasonic cutter contacting the substrate; and wherein the amount of time that the power is removed from the ultrasonic cutter is provided by the timer. 2. The ground detection system of claim 1 , wherein the ultrasonic cutter is electrically coupled to the power source via a first cable. 3. The ground detection system of claim 1 , wherein the workpiece clamp is electrically coupled to the power source via a cable. 4. The ground detection system of claim 1 , wherein the timer is configured to provide a time delay in a range of about 1 second to about 10 seconds. 5. A substrate detection system comprising: an ultrasonic cutter configured to remove a portion of a surface coating from a substrate; a workpiece clamp configured to form an electrical connection between the ultrasonic cutter, the substrate, and the substrate detection system; and an electrical circuit configured to: detect that the ultrasonic cutter has contacted the substrate; remove power from the ultrasonic cutter for an amount of time in response to the ultrasonic cutter contacting the substrate; and actuate an indicator to indicate that the ultrasonic cutter has contacted the substrate. 6. The substrate detection system of claim 5 , wherein the indicator is a light. 7. The substrate detection system of claim 5 , wherein the indicator is a sound source.

Assignees

Inventors

Classifications

  • B26D7/086Primary

    by vibrating, e.g. ultrasonically · CPC title

  • B26D7/025Primary

    acting upon planar surfaces (B26D7/04 takes precedence) · CPC title

  • Safety devices specially adapted for cutting machines (safety devices in general F16P) · CPC title

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Frequently asked questions

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What does patent US11717980B2 cover?
In one embodiment, systems and methods include using an ultrasonic cutter in a ground detection system to prevent damage to a substrate. The method of detecting a substrate comprises attaching a workpiece clamp to the substrate. The method further comprises cutting a layer of coating disposed on the substrate with an ultrasonic cutter, wherein the ultrasonic cutter operates at a frequency of ab…
Who is the assignee on this patent?
Lockheed Corp
What technology area does this patent fall under?
Primary CPC classification B26D7/086. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 08 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).