Thermally-conductive material layer and internal structure for ultrasound imaging

Patent metadata

Field	Value
Publication number	US-11717271-B2
Application number	US-201917043692-A
Country	US
Kind code	B2
Filing date	Mar 22, 2019
Priority date	Mar 30, 2018
Publication date	Aug 8, 2023
Grant date	Aug 8, 2023

Abstract

An ultrasound imaging probe including a handle configured for handheld use; a support structure disposed within the handle and comprising a thermally-conductive material, the support structure further comprising a coupling surface and an external surface, the coupling surface disposed at a distal portion of the support structure; a continuous material layer coupled to the support structure, such that the continuous material layer is disposed on the coupling surface and the external surface, the continuous material layer thereby providing a heat transmission path between the coupling surface and the external surface; and an ultrasound sensor coupled to the support structure at the coupling surface and directly in contact with the continuous material layer at the coupling surface, such that heat from the ultrasound sensor is transmitted away to the support structure via the heat transmission path of the continuous material layer.

First claim

What is claimed is:

1. An ultrasound imaging probe, comprising:
a housing configured for handheld use;
a support structure different from the housing and disposed within the housing, the support structure comprising:
a thermally-conductive material;
a coupling surface disposed at a distal portion of the support structure; and
an outer surface different from the coupling surface;

a continuous thermally-conductive layer different from the thermally conductive material and coupled to the outer surface and the coupling surface of the support structure, the continuous thermally-conductive layer thereby providing a heat transmission path between the coupling surface and the outer surface; and
an ultrasound sensor coupled to the support structure at the coupling surface and directly in contact with the continuous thermally-conductive layer at the coupling surface, such that heat from the ultrasound sensor is transmitted away to the support structure via the heat transmission path of the continuous thermally-conductive layer.

2. The probe of claim 1 , wherein the coupling surface and the outer surface each comprise at least one planar surface of the support structure.

3. The probe of claim 1 ,
wherein the ultrasound sensor comprises an acoustic stack and an acoustic backing material adjacent to the acoustic stack,
wherein a surface of the ultrasound sensor that is directly in contact with the continuous thermally-conductive layer includes a surface of the acoustic backing material.

4. The probe of claim 1 ,
wherein the ultrasound sensor comprises:
an acoustic stack;
an acoustic backing material adjacent to the acoustic stack; and
a heat-conductive structure adjacent to the backing material,

wherein a surface of the ultrasound sensor that is directly in contact with the continuous thermally-conductive layer includes a surface of the heat-conductive structure.

5. The probe of claim 1 ,
wherein a second continuous thermally-conductive layer is disposed on an external surface of the ultrasound sensor, and
wherein a surface of the ultrasound sensor that is directly in contact with the continuous thermally-conductive layer includes a surface of the second continuous thermally-conductive layer.

6. The probe of claim 1 ,
wherein the support structure comprises a body and a protrusion extending from the body at the distal portion,
wherein a surface of the protrusion comprises the coupling surface and a surface of the body comprises the outer surface.

7. The probe of claim 1 , wherein the outer surface extends along a longitudinal axis of the support structure.

8. The probe of claim 1 , wherein the continuous thermally-conductive layer comprises a graphite sheet bonded to an adhesive.

9. The probe of claim 1 , further comprising a second continuous thermally-conductive layer disposed on one or more outer surfaces of the ultrasound sensor and the support structure, such that the second continuous thermally-conductive layer provides a second heat transmission path from the one or more outer surfaces of the ultrasound sensor to the one or more outer surfaces of the support structure, thereby also transmitting the heat away to the support structure.

10. The probe of claim 1 , further comprising a ferrule and a second continuous thermally-conductive layer disposed on one or more outer surfaces of the ultrasound sensor, the support structure, and the ferrule, such that the second continuous thermally-conductive layer provides a second heat transmission path from the one or more outer surfaces of the ultrasound sensor to the one or more outer surfaces of the support structure and the ferrule, thereby also transmitting the heat away to the support structure and the ferrule.

11. The probe of claim 1 ,
further comprising a ferrule,
wherein the ferrule is disposed at a proximal portion of the support structure,
wherein the continuous thermally-conductive layer is disposed on an outer surface of the ultrasound sensor and an outer surface of the ferrule such that the heat transmission path is from the ultrasound sensor to the support structure and the ferrule, and
wherein the ultrasound sensor is directly in contact with the continuous thermally-conductive layer disposed on the outer surface of the ultrasound sensor, such that heat from the ultrasound sensor is transmitted away to the support structure and the ferrule via the heat transmission path of the continuous thermally-conductive layer.

12. The probe of claim 11 , further comprising a communication cable disposed within the ferrule and in direct contact with an internal surface of the ferrule.

13. The probe of claim 12 , wherein the communication cable is thermally coupled to the ferrule such that the heat is also transmitted away from the ultrasound sensor to the communication cable via the heat transmission path of the continuous thermally conductive layer.

14. The probe of claim 11 ,
wherein the support structure comprises a body, and
wherein the ferrule is coupled to the body at a proximal portion of the support structure.

15. The probe of claim 11 ,
further comprising a second continuous thermally-conductive layer disposed on the coupling surface and the outer surface of the support structure,
wherein the ultrasound sensor is coupled to the support structure at the coupling surface and directly in contact with the second continuous thermally-conductive layer, such that the second continuous thermally-conductive layer provides a second heat transmission path between the coupling surface and the external outer surface, thereby also transmitting the heat away to the support structure.

Assignees

• Koninklijke Philips Nv

Inventors

• Song Junho
• Chan Edward
• Tavoletti Steven Michael
• Hejazi Dehaghani Mehdi

Classifications

• A61B8/546 Primary

  involving monitoring or regulation of device temperature · CPC title

• A61B8/4236

  characterised by adhesive patches · CPC title

• A61B8/4254

  using sensors mounted on the probe · CPC title

• A61B8/4455

  Features of the external shape of the probe, e.g. ergonomic aspects · CPC title

• A61B8/4494

  characterised by the arrangement of the transducer elements · CPC title