Integrated fan and heat sink for head-mountable device

Patent metadata

Field	Value
Publication number	US-11716829-B1
Application number	US-202117165763-A
Country	US
Kind code	B1
Filing date	Feb 2, 2021
Priority date	Mar 17, 2020
Publication date	Aug 1, 2023
Grant date	Aug 1, 2023

Abstract

A head-mountable device can provide a cooling module that effectively manages heat while also minimizing noise, vibration, leakage, power consumption, size, and weight. To dissipate heat, the cooling module with a fan can be operated to move air through a chamber within the head-mountable device. An integrated heat sink can provide heat dissipation properties by drawing heat away from heat-generating components and into the chamber. The integrated heat sink can include a base plate that defines at least a portion of the chamber in which the blades of the fan are positioned. The integrated heat sink can further include fins between the chamber and an outlet. The fins can be integrated with the base plate to maximize heat dissipation and reduce the number of interfaces between separate parts.

First claim

What is claimed is:

1. A head-mountable device comprising:
a frame defining an inlet and an outlet;
a circuit component; and
a cooling module comprising:
a cover for receiving air from the inlet;
a back plate positioned opposite the cover and thermally connected to the circuit component;
a fan within a chamber between the cover and the back plate, the fan being operable to direct air from the inlet to the outlet; and
fins being positioned between the chamber and the outlet, extending between the back plate and the cover, and being monolithically formed with the back plate,
wherein the cover forms an exhaust duct extending from the fins to the back plate with the fins positioned between the exhaust duct and the chamber, wherein an entirety of the chamber is enclosed by the cover and the back plate, wherein the cover and the back plate form a single continuous seal there between that extends to the exhaust duct.

2. The head-mountable device of claim 1 , further comprising:
a thermal interface between the circuit component and the back plate; and
a circuit board, wherein the circuit component is operably connected to the circuit board, wherein the circuit board and the thermal interface are mounted to the frame.

3. The head-mountable device of claim 1 , wherein the back plate spans an entire side of the chamber.

4. The head-mountable device of claim 1 , wherein the back plate is substantially planar across a length of the chamber.

5. The head-mountable device of claim 1 , wherein the back plate comprises a first portion and a second portion between the first portion and the fins, the second portion being thicker than the first portion, the second portion being thermally connected to the circuit component.

6. The head-mountable device of claim 1 , wherein the fan comprises an impeller having blades and configured to rotate about an axis that extends through the inlet.

7. The head-mountable device of claim 1 , wherein the fins are at least partially within a plane of rotation of the fan.

8. The head-mountable device of claim 1 , wherein the cover extends over the fins to form an exhaust duct on an outlet side of the fins that is opposite the chamber, the exhaust duct being connected to the back plate on the outlet side.

9. A head-mountable device comprising:
a circuit component; and
a cooling module comprising:
a cover;
a planar back plate coupled to the cover at a first end of the cover, the planar back plate being thermally connected to the circuit component;
a fan between the cover and the planar back plate; and
fins being positioned extending from the planar back plate to the cover, the fins being coupled to the cover on a second end of the cover, opposite the first end, the planar back plate and the fins forming a continuous piece of material extending from the first end of the cover to the second end of the cover, wherein the second end of the cover forms an exhaust duct extending from the fins to the planar back plate to surround an outlet.

10. The head-mountable device of claim 9 , wherein the planar back plate comprises a first portion and a second portion between the first portion and the fins, the second portion being thicker than the first portion, the second portion being thermally connected to the circuit component.

11. The head-mountable device of claim 9 , wherein the planar back plate and the fins form a unitary monolith.

12. The head-mountable device of claim 9 , wherein an entire chamber containing the fan is enclosed by the cover and the planar back plate, wherein the cover and the planar back plate form a single continuous seal there between.

13. The head-mountable device of claim 12 , wherein the second end of the cover forms the exhaust duct on an outlet side of the fins that is opposite the chamber, the exhaust duct being connected to the planar back plate on the outlet side.

14. The head-mountable device of claim 9 , wherein:
the fan comprises an impeller having blades and configured to rotate within a plane of rotation; and
the fins are at least partially within the plane of rotation of the fan.

15. A head-mountable device comprising:
a circuit component; and
a cooling module comprising:
fins;
a fan operable to direct air to the fins;
a cover on a first side of the fan; and
a monolithic back plate on a second side of the fan and comprising a first portion and a second portion, the second portion being between the first portion and the fins, being thicker than the first portion, overlapping with an entirety of the circuit component, and overlapping with at least a portion of the fan.

16. The head-mountable device of claim 15 , wherein the first portion, the second portion, and the fins form a unitary monolith.

17. The head-mountable device of claim 15 , wherein an entire chamber containing the fan is enclosed by the cover and the back plate, wherein the cover and the back plate form a single continuous seal there between.

18. The head-mountable device of claim 17 , wherein the cover extends over the fins to form an exhaust duct on an outlet side of the fins that is opposite the chamber, the exhaust duct being connected to the back plate on the outlet side.

19. The head-mountable device of claim 15 , wherein:
the fan comprises an impeller having blades and configured to rotate within a plane of rotation; and
the fins are at least partially within the plane of rotation of the fan.

Assignees

• Apple Inc

Inventors

• Tan Cheng P
• Selvakumar Sivesh
• Dybenko Jesse T
• Mylabathula Enoch
• Sauers Jason C
• Hobson Phil M
• Campo Laura M
• Moroianu Dragos

Classifications

• G06F1/163 Primary

  Wearable computers, e.g. on a belt · CPC title

• G06F1/203

  for portable computers, e.g. for laptops · CPC title

• G06F1/206

  comprising thermal management · CPC title

• H05K7/20136 Primary

  Forced ventilation, e.g. by fans (H05K7/202 takes precedence) · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title