Method of ultra-fine critical dimension patterning for magnetic head devices

Patent metadata

Field	Value
Publication number	US-11715491-B2
Application number	US-202117364300-A
Country	US
Kind code	B2
Filing date	Jun 30, 2021
Priority date	Jun 30, 2021
Publication date	Aug 1, 2023
Grant date	Aug 1, 2023

Abstract

Methods of critical dimension (CD) uniformity control for magnetic head devices are disclosed. In some embodiments, a method can include providing a film stack, the film stack including a substrate, a magnetoresistive (MR) sensor layer, and a hard mask layer, patterning the hard mask layer using a first mask that defines critical shape patterns other than the CD, forming a mandrel pattern using a second mask that defines the CD, and forming a sidewall spacer pattern on sidewalls of the mandrel pattern, and removing the mandrel pattern.

First claim

We claim:

1. A method for controlling a critical dimension (CD) uniformity of a magnetic head device, the method comprising:
providing a film stack, the film stack including a substrate, a magnetoresistive (MR) sensor layer, and a hard mask layer;
patterning the hard mask layer using a first mask that defines critical shape patterns other than the CD;
forming a mandrel pattern on the hard mask layer using a second mask that defines the CD; and
forming a sidewall spacer pattern on sidewalls of the mandrel pattern, and removing the mandrel pattern.

2. The method of claim 1 , wherein the patterning the hard mask layer includes applying a photoresist layer over the hard mask layer.

3. The method of claim 2 , wherein the patterning the hard mask layer includes exposing the photoresist layer to a light source through the first mask.

4. The method of claim 3 , wherein the patterning the hard mask layer includes developing the photoresist layer to form a resist pattern.

5. The method of claim 4 , wherein the patterning the hard mask layer includes removing any remaining portions of the photoresist layer.

6. The method of claim 1 , wherein the forming the mandrel pattern includes depositing a mandrel material layer.

7. The method of claim 6 , wherein the forming the mandrel pattern includes forming a resist pattern using the second mask.

8. The method of claim 7 , wherein the forming the mandrel pattern includes etching the mandrel material layer using the resist pattern as an etch mask, thereby forming the mandrel pattern.

9. The method of claim 1 , wherein the forming the sidewall spacer pattern on sidewalls of the mandrel pattern includes depositing a conformal layer of spacer material by atomic layer deposition (ALD) on the mandrel pattern.

10. The method of claim 9 , wherein the forming the sidewall spacer pattern on sidewalls of the mandrel pattern includes etching the conformal layer of spacer material, thereby forming the sidewall spacer pattern.

11. The method of claim 9 , wherein depositing the conformal layer of spacer material is by a low-temperature ALD.

12. The method of claim 9 , wherein depositing the conformal layer of spacer material is by a high-temperature ALD.

13. The method of claim 1 , wherein the hard mask layer includes an outermost component layer, a middle component layer, and an innermost layer.

14. The method of claim 13 , wherein hard mask component layers are chosen to permit etching of the outermost component layer without etching through the middle component layer, and to allow selective etching of the middle component layer without etching through the innermost component layer.

15. The method of claim 13 , wherein patterning the hard mask layer includes patterning the outermost component layer.

16. The method of claim 15 , further comprising transferring a pattern on the outermost component layer resulting from the patterning the hard mask layer, the forming the mandrel pattern, and the forming of the sidewall spacer pattern, to the middle component layer and innermost component layer by a selective etching.

17. The method of claim 15 , wherein transferring the pattern on the outermost component layer to the middle component layer and innermost component layer includes transferring the pattern on the middle component layer to the innermost component layer by selective etching that stops on the on the MR sensor layer.

Assignees

• Headway Tech Inc

Inventors

• Zhong Tom
• Omine Hiroshi
• Zhou Jianing
• Zhang Kunliang
• Ding Ruhang
• Li Min

Classifications

• G11B5/484 Primary

  Integrated arm assemblies, e.g. formed by material deposition or by etching from single piece of metal or by lamination of materials forming a single arm/suspension/head unit · CPC title

• G11B5/3163 Primary

  Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers · CPC title