Dies including strain gauge sensors and temperature sensors

US11712887B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11712887-B2
Application numberUS-202017105195-A
CountryUS
Kind codeB2
Filing dateNov 25, 2020
Priority dateJul 18, 2017
Publication dateAug 1, 2023
Grant dateAug 1, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A die may include a plurality of fluid pumps, at least one strain gauge sensor to sense a strain in the die, and at least one temperature sensor to sense the temperature of the die to compensate for a temperature component of the sensed strain.

First claim

Opening claim text (preview).

The invention claimed is: 1. A die comprising: a plurality of fluid pumps; at least one strain gauge sensor to sense a strain in the die; and at least one temperature sensor to sense the temperature of the die to compensate for a temperature component of the sensed strain. 2. The die of claim 1 further comprising a plurality of fluid ejection nozzle openings corresponding to the plurality of fluid pumps. 3. The die of claim 2 , wherein the at least one strain gauge sensor comprises a plurality of spaced strain gauge sensors extending in a column and wherein the at least one temperature sensor comprises a plurality of spaced temperature sensors extending in the column. 4. The die of claim 3 , wherein the strain gauge sensors and the temperature sensors alternate along the column. 5. The die of claim 3 , wherein the column extends from a first longitudinal end of the die to a second longitudinal end of the die. 6. The die of claim 3 further comprising a first slot and a second slot, wherein the column extends between the first slot and the second slot. 7. The die of claim 3 , wherein the at least one strain gauge sensor comprises a second plurality of spaced strain gauge sensors extending in a second column and wherein the at least one temperature sensor comprises a second plurality of spaced temperature sensors extending in the second column. 8. The die of claim 7 further comprising a slot extending between the column and the second column. 9. The die of claim 8 , wherein the at least one strain gauge sensor and the at least one temperature sensor comprise an array of strain gauge sensors surrounding an end of the slot on three sides of the slot and at least one temperature sensor adjacent the array. 10. The die of claim 3 further comprising bond pads on a first end and a second end of the die, wherein the column extends from the first end to the second end of the die. 11. The die of claim 3 , wherein the plurality of strain gauge sensors outnumbers the plurality of temperature sensors in the column. 12. The die of claim 3 , wherein one of the strain gauge sensors is co-located with one of the temperature sensors. 13. A system comprising: a fluidic die comprising fluid pumps, a plurality of strain gauge sensors to sense strain within the fluidic die, and a plurality of temperature sensors to sense temperature within the fluidic die; and a controller to receive the sensed strain from each strain gauge sensor and the sensed temperature from each temperature sensor and provide a temperature compensated strain for each sensed strain based on the sensed temperatures. 14. The system of claim 13 further comprising a plurality of fluid ejection nozzle openings corresponding to the plurality of fluid pumps. 15. The system of claim 13 , wherein the plurality of strain gauge sensors extend in a column and wherein the plurality of temperature sensors extend in the column. 16. The system of claim 15 further comprising a fluid delivery slot, wherein the column extends parallel to the slot. 17. The system of claim 15 further comprising bond pads on a first end and a second end of the die, wherein the column extends from the first end to the second end of the die. 18. The system of claim 15 further comprising a second plurality of spaced strain gauge sensors extending in a second column and a second plurality of spaced temperature sensors extending in the second column. 19. The system of claim 13 further comprising a fluid delivery slot, wherein the plurality of strain gauge sensors form an array of strain gauge sensors surrounding an end of the slot and wherein one of the plurality of temperature sensors is adjacent to the array of strain gauge sensors. 20. The system of claim 13 further comprising a fluid delivery slot, wherein the plurality of strain gauge sensors form an array of strain gauge sensor surrounding an end of the slot and wherein the plurality of temperature sensors form an array of temperature sensors surrounding the end of the slot.

Assignees

Inventors

Classifications

  • detecting head temperature; Ink temperature · CPC title

  • aiming at correcting other parameters · CPC title

  • controlling heads of a type not covered by groups B41J2/04575 - B41J2/04585, or of an undefined type · CPC title

  • Structures including a sensor · CPC title

  • Devices for controlling or analysing the entire machine {; Controlling or analysing mechanical parameters involving printing of test patterns} · CPC title

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Frequently asked questions

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What does patent US11712887B2 cover?
A die may include a plurality of fluid pumps, at least one strain gauge sensor to sense a strain in the die, and at least one temperature sensor to sense the temperature of the die to compensate for a temperature component of the sensed strain.
Who is the assignee on this patent?
Hewlett Packard Development Co
What technology area does this patent fall under?
Primary CPC classification B41J2/04563. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 01 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).