Mold die, method of manufacturing mold die, injection molding apparatus, and method of manufacturing mold product

Patent metadata

Field	Value
Publication number	US-11712828-B2
Application number	US-201916772467-A
Country	US
Kind code	B2
Filing date	Oct 31, 2019
Priority date	Feb 20, 2019
Publication date	Aug 1, 2023
Grant date	Aug 1, 2023

Abstract

A mold cavity which is a mold die includes a die body and a plating layer provided on the surface of a mold surface. In this case, the mold surface has a leather-grain transfer surface for forming a grain pattern. The leather-grain transfer surface includes a first uneven-shape part and a second uneven-shape part formed at the surface of the first uneven-shape part and smaller in an uneven-shape width than the first uneven-shape part. The uneven-shape width falls within a range of 10 μm or more and less than 500 μm. The plating layer is an electroless-plating layer. A thickness of at least part of the plating layer falls within a range of 0.1 μm or more and less than 10 μm.

First claim

The invention claimed is:

1. A mold die comprising:
a die body including a mold surface having a shape corresponding to sculpturing of a mold product; and
a plating layer provided on a surface of the mold surface, wherein
the mold surface has a leather-grain transfer surface for forming, at a surface of the mold product, a grain pattern formed of a plurality of uneven shapes,
the leather-grain transfer surface includes at least a first uneven-shape part and a second uneven-shape part formed at a surface of the first uneven-shape part and smaller in an uneven-shape width than the first uneven-shape part, the uneven-shape width in the first uneven-shape part falling within a first range of 30 μm or more and less than 500 μm and the uneven-shape width in the second uneven-shape part falling within a second range of 10 μm or more and less than 30 μm,
the plating layer is an electroless-plating layer, and
a thickness of at least part of the plating layer falls within a range of 0.1 μm or more and less than 10 μm.

2. The mold die according to claim 1 , wherein
a thickness of the whole plating layer falls within a range of 0.1 μm or more and less than 10 μm.

3. The mold die according to claim 2 , wherein the plating layer contains Ni as a main component.

4. The mold die according to claim 1 , wherein the plating layer contains Ni as a main component.

5. An injection molding apparatus comprising the mold die according to claim 2 .

6. A method of manufacturing a mold product comprising applying the mold die according to claim 2 to at least one of a mold cavity and a mold core, to manufacture a mold product.

7. An injection molding apparatus comprising the mold die according to claim 3 .

8. A method of manufacturing a mold product comprising applying the mold die according to claim 4 to at least one of a mold cavity and a mold core, to manufacture a mold product.

9. An injection molding apparatus comprising the mold die according to claim 1 .

10. A method of manufacturing a mold product comprising applying the mold die according to claim 1 to at least one of a mold cavity and a mold core, to manufacture a mold product.

11. A method of manufacturing a mold die, comprising
performing electroless plating on a die body including a mold surface having a shape corresponding to sculpturing of a mold product, to form a plating layer on a surface of the mold surface, wherein
the mold surface has a leather-grain transfer surface for forming a grain pattern formed of a plurality of uneven shapes on the surface of the mold product,
the leather-grain transfer surface includes a first uneven-shape part and a second uneven-shape part formed at a surface of the first uneven-shape part and smaller in an uneven-shape width than the first uneven-shape part, the uneven-shape width in the first uneven-shape part falling within a first range of 30 μm or more and less than 500 μm and the uneven-shape width in the second uneven-shape part falling within a second range of 10 μm or more and less than 30 μm,
the forming the plating layer is performed so that a thickness of at least part of the plating layer falls within a range of 0.1 μm or more and less than 10 μm.

12. The method of manufacturing a mold die according to claim 4 , wherein the forming the plating layer is performed so that a thickness of the entire plating layer falls within a range of 0.1 μm or more and less than 10 μm.

13. The method of manufacturing a mold die according to claim 12 , further comprising
prior to the forming the plating layer, forming the leather-grain transfer surface at the mold surface, wherein
the forming the leather-grain transfer surface includes at least
a first step of performing etching on the surface of the mold surface, to form the first uneven-shape part, and
a second step of performing etching on the surface of the mold surface having undergone the first step, to form the second uneven-shape part.

14. The method of manufacturing a mold die according to claim 11 , further comprising
prior to the forming the plating layer, forming the leather-grain transfer surface at the mold surface, wherein
the forming the leather-grain transfer surface includes at least
a first step of performing etching on the surface of the mold surface, to form the first uneven-shape part, and
a second step of performing etching on the surface of the mold surface having undergone the first step, to form the second uneven-shape part.

Assignees

• Kasai Kogyo Kk
• Kasai Kogyo Cg Ltd

Inventors

• Onishi Tatsumi
• Mitsui Yusuke

Classifications

• B29C45/26 Primary

  Moulds · CPC title

• B29C33/3842

  Manufacturing moulds, e.g. shaping the mould surface by machining · CPC title

• B29C33/42

  characterised by the shape of the moulding surface, e.g. ribs or grooves · CPC title

• C23C18/1827

  only one step pretreatment · CPC title

• C23C18/32

  Coating with nickel, cobalt or mixtures thereof with phosphorus or boron (C23C18/50 takes precedence) · CPC title