Microwave-induced localized heating of CNT filled polymer composites for enhanced inter-bead diffusive bonding of fused filament fabricated part

US11712822B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11712822-B2
Application numberUS-201916517419-A
CountryUS
Kind codeB2
Filing dateJul 19, 2019
Priority dateDec 26, 2013
Publication dateAug 1, 2023
Grant dateAug 1, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A microwave-induced heating of CNT filled (or coated) polymer composites for enhancing inter-bead diffusive bonding of fused filament fabricated parts. The technique incorporates microwave absorbing nanomaterials (carbon nanotubes (CNTs)) onto the surface or throughout the volume of 3D printer polymer filament to increase the inter-bead bond strength following a post microwave irradiation treatment and/or in-situ focused microwave beam during printing. The overall strength of the final 3D printed part will be dramatically increased and the isotropic mechanical properties of fused filament part will approach or exceed conventionally manufactured counterparts.

First claim

Opening claim text (preview).

What is claimed is: 1. A polymer composite comprising polymer filaments each having an outer layer in which the polymer filaments are arranged such that there are filament-filament interfaces between the outer layers of the polymer filaments, wherein (a) the outer layer of each of the polymer filaments comprises an electrically conductive percolated network of an electrically conductive nanomaterial, (b) the electrically conductive nanomaterial comprises carbon nanotubes that are mixed with polylactic acid (PLA) in the outer layer, (c) the outer layer of each of the polymer filaments has a thickness between 0.005% and 30% of a diameter of the polymer filament, and (d) the electrically conductive nanomaterial is heat-able by an electromagnetic field to generate a temperature profile in the polymer filaments that forms a weld at each of the filament-filament interfaces between the outer layers of the polymer filaments. 2. The polymer composite of claim 1 , wherein the polymer filament comprises at least one polymer selected from a group consisting of styrene (ABS), polycarbonate (PC), polylactic acid (PLA), polyethylene (PE), polycarbonate(PC)/styrene(ABS), polyphenylsulfone (PPSU), polyamide (nylon), polystyrene (PS), polyetherimide, polyether ether ketone (PEEK), polytetrafluoroethylene (PTFE), and combinations thereof. 3. The polymer composite of claim 1 , wherein the carbon nanotubes are multi-walled carbon nanotubes. 4. The polymer composite of claim 1 , wherein the outer layer comprises between 1 wt % and 50 wt % of carbon nanotubes. 5. The polymer composite of claim 1 , wherein the outer layer has a wt % of carbon nanotubes sufficient to form the electrically conductive percolated network of the electrically conductive material. 6. The polymer composite of claim 1 , wherein the polymer filament has a volume and the electrically conductive nanomaterial is present throughout the volume. 7. A polymer composite comprising polymer filaments each having an outer layer in which the polymer filaments are arranged such that there are filament-filament interfaces between the outer layers of the polymer filaments, wherein (a) the outer layer of each of the polymer filaments comprises an electrically conductive nanomaterial, (b) the electrically conductive nanomaterial comprises carbon nanotubes that are mixed with polylactic acid (PLA) in the outer layer, (c) the outer layer of each of the polymer filaments has a thickness between 0.005% and 30% of a diameter of the polymer filament, and ( d ) the electrically conductive nanomaterial is heat-able by an electromagnetic wave, the electrically conductive nanomaterial provided at a concentration sufficient to provide a threshold dielectric loss tangent of the polymer filaments that provides fusing at each of the filament-filament interfaces between the outer layers of the polymer filaments upon the electrically conductive nanomaterial absorbing an electromagnetic wave selected to produce a predetermined temperature profile in the outer layer. 8. The polymer composite of claim 7 , wherein the threshold dielectric loss tangent maximizes an electric current induced in the electrically conductive nanomaterial by the electromagnetic wave. 9. The polymer composite of claim 7 , wherein the concentration of the electrically conductive nanomaterial is adjusted such that the outer layer exhibits a desired bond strength at the interface. 10. The polymer composite of claim 7 , wherein the outer layer comprises polymer chains that inter-diffuse across the interface upon fusing. 11. The polymer composite of claim 7 , wherein the polymer filament comprises at least one polymer selected from a group consisting of styrene (ABS), polycarbonate (PC), polylactic acid (PLA), polyethylene (PE), polycarbonate(PC)/styrene(ABS), polyphenylsulfone (PPSU), polyamide (nylon), polystyrene (PS), polyetherimide, polyether ether ketone (PEEK), polytetrafluoroethylene (PTFE), and combinations thereof. 12. The polymer composite of claim 7 , wherein the outer layer has a wt % of carbon nanotubes sufficient to form an electrically conductive percolated network of the electrically conductive material. 13. The polymer composite of claim 7 , wherein the polymer filament has a volume and the electrically conductive nanomaterial is present throughout the volume. 14. A three-dimensional object comprising a plurality of polymer filaments arranged in successive layers, wherein (a) the polymer filaments each comprise a coating comprising an electrically conductive percolated network of an electrically conductive nanomaterial, (b) the electrically conductive nanomaterial comprises carbon nanotubes that are mixed with polylactic acid (PLA) in the coating, (c) the coating of each of the polymer filaments is an outer layer which has a thickness between 0.005% and 30% of a diameter of the polymer filament, and (d) the electrically conductive material is heat-able by an electromagnetic wave to generate a temperature profile in the polymer filament that fuses the coating of the polymer filaments together at a filament-filament interface between the outer layers of the polymer filaments in each of the successive layers. 15. The three-dimensional object of claim 14 , wherein the polymer filaments comprise at least one polymer selected from a group consisting of styrene (ABS), polycarbonate (PC), polylactic acid (PLA), polyethylene (PE), polycarbonate(PC)/styrene(ABS), polyphenylsulfone (PPSU), polyamide (nylon), polystyrene (PS), polyetherimide, polyether ether ketone (PEEK), polytetrafluoroethylene (PTFE), and combinations thereof. 16. The three-dimensional object of claim 14 , wherein the outer layer has a wt % of carbon nanotubes sufficient to form the electrically conductive percolated network of the electrically conductive material. 17. The three-dimensional object of claim 14 , wherein the polymer filament has a volume and the electrically conductive nanomaterial is present throughout the volume.

Assignees

Inventors

Classifications

  • using electromagnetic radiation · CPC title

  • of filaments or wires · CPC title

  • B29C64/106Primary

    using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material · CPC title

  • using filamentary material being melted, e.g. fused deposition modelling [FDM] · CPC title

  • using layers of liquid which are selectively solidified · CPC title

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What does patent US11712822B2 cover?
A microwave-induced heating of CNT filled (or coated) polymer composites for enhancing inter-bead diffusive bonding of fused filament fabricated parts. The technique incorporates microwave absorbing nanomaterials (carbon nanotubes (CNTs)) onto the surface or throughout the volume of 3D printer polymer filament to increase the inter-bead bond strength following a post microwave irradiation treat…
Who is the assignee on this patent?
Univ Texas Tech System
What technology area does this patent fall under?
Primary CPC classification B29C35/0805. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 01 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).