Electromagnetic wave attenuator, electronic device, film formation apparatus, and film formation method

Patent metadata

Field	Value
Publication number	US-11710707-B2
Application number	US-202117205098-A
Country	US
Kind code	B2
Filing date	Mar 18, 2021
Priority date	Mar 26, 2020
Publication date	Jul 25, 2023
Grant date	Jul 25, 2023

Abstract

According to one embodiment, an electromagnetic wave attenuator includes a first structure body. The first structure body includes a first member, a second member, and a third member. The first member includes a first magnetic layer and a first nonmagnetic layer alternately provided in a first direction. The first nonmagnetic layer is conductive. The first direction is a stacking direction. The second member includes a second magnetic layer and a second nonmagnetic layer alternately provided in the first direction. The second nonmagnetic layer is conductive. The third member includes a third nonmagnetic layer. The third nonmagnetic layer is conductive. A direction from the third member toward the first member is along the first direction. A direction from the third member toward the second member is along the first direction. A first magnetic layer thickness is greater than a second magnetic layer thickness.

First claim

What is claimed is:

1. An electromagnetic wave attenuator, comprising:
a first structure body including
a first member including a plurality of first magnetic layers and a plurality of first nonmagnetic layers, the plurality of first magnetic layers and the plurality of first nonmagnetic layers being alternately provided in a first direction, the plurality of first nonmagnetic layers being conductive, the first direction being a stacking direction,
a second member including a plurality of second magnetic layers and a plurality of second nonmagnetic layers, the plurality of second magnetic layers and the plurality of second nonmagnetic layers being alternately provided in the first direction, the plurality of second nonmagnetic layers being conductive, and
a third member including a plurality of third nonmagnetic layers, the plurality of third nonmagnetic layers being conductive,

a direction from the third member toward the first member being along the first direction,
a direction from the third member toward the second member being along the first direction,
a first magnetic layer thickness being greater than a second magnetic layer thickness,
the first magnetic layer thickness being a thickness along the first direction of each of the plurality of first magnetic layers,
the second magnetic layer thickness being a thickness along the first direction of each of the plurality of second magnetic layers.

2. The attenuator according to claim 1 , wherein
a crystallinity of at least a portion of the plurality of first magnetic layers is greater than a crystallinity of at least a portion of the plurality of second magnetic layers.

3. The attenuator according to claim 2 , wherein
the at least a portion of the plurality of first magnetic layers is a crystal, and the at least a portion of the plurality of second magnetic layers is amorphous.

4. The attenuator according to claim 1 , wherein
the first magnetic layer thickness is not less than 80 nm and not more than 400 nm, and
the second magnetic layer thickness is not less than 10 nm but less than 80 nm.

5. The attenuator according to claim 4 , wherein
a thickness of each of the plurality of first nonmagnetic layers is not more than 10 nm, and
a thickness of each of the plurality of second nonmagnetic layers is not more than 10 nm.

6. The attenuator according to claim 1 , wherein
at least one of the plurality of first nonmagnetic layers or the plurality of second nonmagnetic layers includes at least one selected from the group consisting of Ta, Cr, and Ti.

7. The attenuator according to claim 1 , wherein
at least one of the plurality of first magnetic layers or the plurality of second magnetic layers includes Ni, Fe, Cu, and Mo.

8. The attenuator according to claim 7 , wherein
a composition ratio of Ni in the plurality of first magnetic layers is not less than 0.9 times and not more than 1.1 times a composition ratio of Ni in the plurality of second magnetic layers, and
a composition ratio of Fe in the plurality of first magnetic layers is not less than 0.9 times and not more than 1.1 times a composition ratio of Fe in the plurality of second magnetic layers.

9. The attenuator according to claim 1 , wherein
a composition of the plurality of first magnetic layers is substantially the same as a composition of the plurality of second magnetic layers.

10. The attenuator according to claim 1 , wherein
the plurality of third nonmagnetic layers includes Cu.

11. The attenuator according to claim 1 , wherein
the third member further includes a plurality of third magnetic layers, and
a direction from each of the plurality of third magnetic layers toward each of the plurality of third nonmagnetic layers is along the first direction.

12. The attenuator according to claim 1 , further comprising:
a second structure body,
a direction from the second structure body toward the first structure body being along the first direction,
the second structure body including Fe and at least one of Cr or Ni.

13. The attenuator according to claim 12 , further comprising:
a third structure body,
the first structure body being between the second structure body and the third structure body in the first direction,
the third structure body including Fe and at least one of Cr or Ni.

14. An electronic device, comprising:
the electromagnetic wave attenuator according to claim 1 ; and
an electronic element.

Assignees

• Shibaura Mechatronics Corp

Inventors

• Nishigaki Hisashi
• Fujita Atsushi
• Tanabe Shohei
• Kamo Yoshinao
• Matsunaka Shigeki

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W42/287

  materials for magnetic shielding, e.g. ferromagnetic materials · CPC title

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W42/20 Primary

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title