Gene sequencing substrate and method for manufacturing the same, gene sequencing device and gene sequencing method

Patent metadata

Field	Value
Publication number	US-11708604-B2
Application number	US-201816486038-A
Country	US
Kind code	B2
Filing date	Dec 24, 2018
Priority date	Jan 3, 2018
Publication date	Jul 25, 2023
Grant date	Jul 25, 2023

Abstract

A gene sequencing substrate and a method for manufacturing the same, and a gene sequencing device are provided. It belongs to the technical field of gene sequencing, and can solve the problem of high cost of the high-throughput sequencing chip in the prior art. The gene sequencing substrate of the present disclosure comprises a plastic material with concave structures as base substrate, and the concave structures serve as reaction cells. Since the base substrate has plasticity, the concave structures can be formed by a simple process to reduce the cost of the gene sequencing substrate. Meanwhile, a first protective layer may be provided on the inner wall of the concave structures for preventing the inner wall of the concave structures from being corroded by the reaction liquid.

First claim

The invention claimed is:

1. A gene sequencing substrate comprising a plastic base substrate with a surface having concave structures, wherein the gene sequencing substrate further comprises a first protective layer disposed on the plastic base substrate which at least covers the concave structures, and the first protective layer has enough chemical resistance to a reagent for the gene sequencing and adhesivity with the plastic base substrate.

2. The gene sequencing substrate according to claim 1 , wherein the plastic base substrate comprises any one selected from a group consisting of poly(methyl methacrylate), polydimethylsiloxane, poly(ethylene terephthalate), polyimide, polyisoprene, and combinations thereof.

3. The gene sequencing substrate according to claim 1 , wherein the concave structures have a depth of 10 nm to 100 μm.

4. The gene sequencing substrate according to claim 1 , wherein the first protective layer comprises any transparent metal oxide selected from a group consisting of indium tin oxide, indium zinc oxide, tantalum oxide, hafnium oxide and combinations thereof.

5. A method for manufacturing the gene sequencing substrate according to claim 1 , comprising:
forming the concave structures on a surface of the plastic base substrate, and
forming a first protective layer on the plastic base substrate, wherein the first protective layer at least covers the concave structures.

6. The method for manufacturing the gene sequencing substrate according to claim 5 , wherein forming the concave structures on a surface of the plastic base substrate comprises:
softening the plastic base substrate by heating;
forming the concave structures on a surface of the plastic base substrate by a nanoimprinting process; and
cooling the plastic base substrate with the concave structures.

7. The method for manufacturing the gene sequencing substrate according to claim 5 , wherein forming the concave structures on a surface of the plastic base substrate comprises forming the concave structures by an exposure etching process.

8. A gene sequencing device, comprising a first substrate and a second substrate disposed opposite to each other, wherein the first substrate is the gene sequencing substrate according to claim 1 , and the second substrate is provided with an inlet and an outlet.

9. The gene sequencing device according to claim 8 , wherein the second substrate is provided with a micro flow channel which connects the concave structures with either the inlet or the outlet, and the inner wall of the micro flow channel is provided with a second protective layer formed of a metal oxide.

Assignees

• Beijing Boe Optoelectronics Tech Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Cai Peizhi
• Pang Fengchun
• Geng Yue
• Gu Le
• Che Chuncheng

Classifications

• C12Q1/6869 Primary

  Methods for sequencing · CPC title

• G03F7/0002

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• B01L3/502707 Primary

  characterised by the manufacture of the container or its components · CPC title

• B01J2219/00317

  Microwell devices, i.e. having large numbers of wells · CPC title

• B01L2300/0877

  Flow chambers · CPC title