Electrospray devices and methods for fabricating electrospray devices

US11708182B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11708182-B2
Application numberUS-202017007890-A
CountryUS
Kind codeB2
Filing dateAug 31, 2020
Priority dateAug 31, 2020
Publication dateJul 25, 2023
Grant dateJul 25, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Electrospray devices and methods of fabricating electrospray devices are described.

First claim

Opening claim text (preview).

What is claimed is: 1. An electrospray device, comprising: a solid substrate; one or more emitters formed on a first surface of the solid substrate; and one or more capillary pores formed in the solid substrate, wherein the one or more capillary pores are configured to transport a source of ions from a reservoir to the first surface through the substrate, wherein the first surface is a uniformly and/or conformally texturized with a plurality of micropillars that extend from the first surface to facilitate wetting of the first surface and thus facilitate transport of the source of ions from the one or more capillary pores to the one or more emitters via the first surface. 2. The electrospray device of claim 1 , wherein the one or more capillary pores extend through the solid substrate from the first surface to a second opposing surface of the solid substrate. 3. The electrospray device of claim 1 , further comprising an extractor plate disposed downstream from the solid substrate. 4. The electrospray device of claim 1 , wherein a density of the one or more emitters on the solid substrate is at least 62,500/cm 2 . 5. The electrospray device of claim 1 , wherein a ratio of the one or more capillary pores capillary pores to one or more emitters is at least 1:1. 6. The electrospray device of claim 1 , further comprising an extractor plate proximate to the first surface of the solid substrate. 7. The electrospray device of claim 1 , wherein each of the one or more emitters comprises a plurality of micropillars formed on a respective surface of each of the one or more emitters. 8. The electrospray device of claim 7 , wherein the plurality of micropillars has an average length of less than or equal to 5 microns. 9. The electrospray device of claim 1 , wherein a pitch between each of the one or more emitters is less than or equal to 65 microns. 10. The electrospray device of claim 1 , wherein the solid substrate comprises silicon, black silicon, germanium, and/or silicon carbide. 11. The electrospray device of claim 1 , wherein a respective surface of each of the one or more emitters is uniformly and/or conformally texturized with a step-like texture. 12. The electrospray device of claim 11 , wherein the step-like texture comprises a gradient in a thickness of texturization. 13. The electrospray device of claim 1 , wherein the plurality of micropillars have an average length of less than or equal to 5 microns. 14. An electrospray device, comprising: a solid substrate; and one or more emitters formed on a first surface of the solid substrate, wherein a density of the one or more emitters on the solid substrate is at least 62,500/cm7, wherein the first surface is a uniformly and/or conformally texturized with a plurality of micropillars that that extend from the first surface to facilitate wetting of the first surface and thus facilitate transport of a source of ions along the first surface to the one or more emitters. 15. The electrospray device of claim 14 , further comprising one or more capillary pores in the solid substrate and wherein the one or more emitters is in fluidic communication with the one or more capillary pores. 16. The electrospray device of claim 15 , further comprising a reservoir and wherein the one or more capillary pores are configured to transport the source of ions disposed in the reservoir to the one or more emitters. 17. The electrospray device of claim 15 , wherein a ratio of the one or more capillary pores to the one or more emitters is at least 1:1. 18. The electrospray device of claim 15 , wherein the one or more capillary pores extend through the solid substrate from the first surface to a second opposing surface of the solid substrate. 19. The electrospray device of claim 14 , further comprising an extractor plate disposed downstream from the solid substrate. 20. The electrospray device of claim 14 , further comprising an extractor plate proximate to the first surface of the solid substrate. 21. The electrospray device of claim 14 , wherein a respective surface of each of the one or more emitters are also texturized by the plurality of micropillars. 22. The electrospray device of claim 21 , wherein the plurality of micropillars has an average length of less than or equal to 5 microns. 23. The electrospray device of claim 14 , wherein a pitch between each of the one or more emitters is less than or equal to 65 microns. 24. The electrospray device of claim 14 , wherein the solid substrate comprises silicon, black silicon, germanium, and/or silicon carbide. 25. The electrospray device of claim 14 , wherein a respective surface of each of the one or more emitters is uniformly and/or conformally texturized with a step-like texture. 26. The electrospray device of claim 25 , wherein the step-like texture comprises a gradient in a thickness of texturization.

Assignees

Inventors

Classifications

  • F03H1/0012Primary

    Means for supplying the propellant · CPC title

  • Ion or plasma engines · CPC title

  • B64G1/405Primary

    Operations & Transport · mapped topic

  • Electrospray ionisation · CPC title

  • using field emission, e.g. Field Emission Electric Propulsion [FEEP] · CPC title

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Frequently asked questions

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What does patent US11708182B2 cover?
Electrospray devices and methods of fabricating electrospray devices are described.
Who is the assignee on this patent?
Massachusetts Inst Technology
What technology area does this patent fall under?
Primary CPC classification F03H1/0012. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Jul 25 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).