Manufacturing method of micro LED display device

Patent metadata

Field	Value
Publication number	US-11705441-B2
Application number	US-202117359679-A
Country	US
Kind code	B2
Filing date	Jun 28, 2021
Priority date	Dec 5, 2018
Publication date	Jul 18, 2023
Grant date	Jul 18, 2023

Abstract

A micro LED display device including a display substrate, a plurality of conductive pad pairs and a plurality of micro light emitting elements is provided. The display substrate has a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and the second arranging area. The conductive pad pairs are disposed on the display substrate in an array with the same pitch. The micro light emitting elements are disposed on the display substrate and are electrically bonded to the conductive pad pairs. A manufacturing method of the micro LED display device is also provided.

First claim

What is claimed is:

1. A manufacturing method of a micro LED display device, comprising:
providing a display substrate comprising a plurality of conductive pad pairs arranged in an array;
providing a carrier configured with a plurality of micro light-emitting elements;
providing a transfer element; and
transferring the micro light-emitting elements from the carrier to the display substrate through the transfer element, and electrically bonding the micro light-emitting elements to the conductive pad pairs,
wherein in an nth transferring step, the transfer element is aligned with the carrier, and the transfer element generates a first pattern transfer area to transfer a part of the micro light-emitting elements in a region of the carrier to the display substrate according to the first pattern transfer area, and retain the other micro light-emitting elements in the region, and define a plurality of vacancy positions in a splicing area of the display substrate within a range corresponding to the region,
in another transferring step, the transfer element is aligned with the carrier, and the transfer element generates a second pattern transfer area to transfer the micro light-emitting elements to the display substrate according to the second pattern transfer area to fill the vacancy positions defined in the nth of transfer,
wherein n is a positive integer greater than or equal to 1,
wherein the display substrate has a first arranging area, a first sub-splicing area connected to the first arranging area, a second arranging area and a second sub-splicing area connected to the second arranging area, and the first sub-splicing area and the second sub-splicing area are overlapped with each other to form the splicing area located between the first arranging area and the second arranging area,
wherein the first pattern transfer area is corresponding to the first arranging area and the splicing area, and the second transfer area is corresponding to the second arranging area and the splicing area.

2. The manufacturing method of the micro LED display device as claimed in claim 1 , wherein each of the conductive pad pairs has a reference line perpendicular to the display substrate, a sidewall of each of the micro light-emitting elements transferred to the display substrate in the nth transferring step and the reference line of the corresponding conductive pad pair are spaced by a first distance, and a sidewall of each of the micro light-emitting elements transferred to the display substrate in another transferring step and the reference line of the corresponding conductive pad pair are spaced by a second distance, wherein the second distance is different to the first distance.

3. The manufacturing method of the micro LED display device as claimed in claim 1 , wherein the first pattern transfer area is matched with the second pattern transfer area.

Assignees

• Playnitride Display Co Ltd

Inventors

• Sun sheng-yuan
• Liu Ying-Tsang
• Chen Yi-Ching
• Chen Pei-Hsin
• Shih Yi-Chun
• Lin Tzu-Yang
• Lai Yu-Hung

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10H29/142

  Two-dimensional arrangements, e.g. asymmetric LED layout · CPC title

• H10H29/14

  comprising multiple light-emitting semiconductor components · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H01L25/0753 Primary

  Electricity · mapped topic