Transfer substrate for component transferring and micro LEDs carrying substrate

Patent metadata

Field	Value
Publication number	US-11705349-B2
Application number	US-201916387395-A
Country	US
Kind code	B2
Filing date	Apr 17, 2019
Priority date	Apr 18, 2018
Publication date	Jul 18, 2023
Grant date	Jul 18, 2023

Abstract

A transfer substrate is configured to transfer a plurality of micro components from a first substrate to a second substrate. The transfer substrate comprises a base and a plurality of transfer heads. The base includes an upper surface. The plurality of transfer heads is disposed on the upper surface of the base, wherein each transfer head includes a first surface and a second surface opposite to each other and the transfer heads contact the base with the first surfaces thereof. A plurality of adhesion lumps is separated from each other, wherein each adhesion lump is disposed on the second surface of one of the transfer heads. A CTE of the base is different from CTEs of the transfer heads.

First claim

What is claimed is:

1. A transfer substrate, configured to transfer a plurality of micro components from a first substrate to a second substrate, comprising:
a base including an upper surface;
a plurality of transfer heads, disposed on the upper surface of the base, wherein each transfer head includes a first surface and a second surface opposite to each other and the transfer heads contact the base with the first surfaces thereof; and
a plurality of adhesion lumps, separated from each other, wherein each adhesion lump is disposed on the second surface of one of the transfer heads and contacts one of the micro components and said one of the transfer heads, and each adhesion lump adheres to one of the micro components, and each adhesion lump is located between one of the transfer heads and one of the micro components;
wherein the material of the plurality of adhesion lumps is organic polymer,
wherein a Coefficient of Thermal Expansion (CTE) of the base is different from CTEs of the transfer heads,
the base and the plurality of transfer heads are different materials, and
a width of each adhesion lump in a X direction is smaller than a width of the second surface of the respective transfer head in the X direction and is greater than a width of each of the plurality of micro components; and
the plurality of transfer heads and the plurality of adhesion lumps are different materials.

2. The transfer substrate according to claim 1 , wherein a thermal conductivity of each transfer head is larger than twice of a thermal conductivity of the base and is less than five times of the thermal conductivity of the base.

3. The transfer substrate for component transferring according to claim 1 , wherein the base is a sapphire substrate and the transfer heads comprise gallium nitride.

4. The transfer substrate according to claim 1 , wherein a difference between the CTE of each transfer head and the CTE of the base is not larger than 50 percent of the CTE of the base and is not less than 10 percent of the CTE of the base.

5. The transfer substrate according to claim 1 , wherein a difference between the CTE of any one of the transfer heads and a CTE of any one of the micro components is less than another difference between the CTE of the base and the CTE of any one of the transfer heads.

6. The transfer substrate according to claim 1 , wherein a cavity is formed at the second surface of each transfer head and each adhesion lump is located in the cavity of the respective transfer head.

7. A transfer substrate, configured to transfer a plurality of micro components from a first substrate to a second substrate, comprising:
a base including an upper surface;
a plurality of transfer heads, disposed on the upper surface of the base, wherein each transfer head includes a first surface and a second surface opposite to each other and the transfer heads contact the base with the first surfaces thereof; and
an adhesion layer, disposed on the transfer heads for covering the second surface of the transfer heads and the upper surface of the base and contacting the micro components and the transfer heads, wherein the adhesion layer adheres to the micro components, and the adhesion layer is located between the transfer heads and the micro components;
wherein the material of the adhesion layer is organic polymer and the adhesion layer adheres to one of the micro components,
wherein a Coefficient of Thermal Expansion (CTE) of the base is different from CTEs of the transfer heads, and
the base and the plurality of transfer heads are different materials, and
the plurality of transfer heads and the adhesion layer are different materials.

8. The transfer substrate according to claim 7 , wherein a thickness of a part of the adhesion layer on the upper surface is larger than a thickness of another part of the adhesion layer on each second surface.

9. The transfer substrate according to claim 7 , wherein the base is a sapphire substrate and the transfer heads comprise gallium nitride.

10. A micro LEDs carrying substrate, comprising:
a base including an upper surface;
a plurality of transfer heads, disposed on the upper surface of the base, wherein each transfer head includes a first surface and a second surface opposite to each other and the transfer heads contact the base with the first surfaces thereof;
an adhesion layer, disposed on the second surfaces of the transfer heads; and
a plurality of micro components disposed on the adhesion layer, wherein each micro component comprises an epitaxial layer and is fixed to a respective one of the transfer heads via the adhesion layer;
wherein the material of the adhesion layer is organic polymer,
wherein a Coefficient of Thermal Expansion (CTE) of the base is different from CTEs of the transfer heads, and
the base and the plurality of transfer heads are different materials, and
wherein the base is a sapphire substrate, the transfer heads comprise gallium nitride and the epitaxial layers of the micro components comprise gallium nitride, and
the plurality of transfer heads and the adhesion layer are different materials.

11. The micro LEDs carrying substrate according to claim 10 , wherein the difference between the CTE of each transfer head and the CTE of the base is not larger than 50 percent of the CTE of the base and is not less than 10 percent of the CTE of the base.

12. The micro LEDs carrying substrate according to claim 10 , wherein the adhesion layer comprises a plurality of adhesion lumps separated from each other, wherein each adhesion lump is disposed on the second surface of one of the transfer heads.

13. The micro LEDs carrying substrate according to claim 12 , wherein a cavity is formed at the second surface of each transfer head and each adhesion lump is located in the cavity of the second surface of the respective transfer head.

14. The micro LEDs carrying substrate according to claim 10 , wherein the adhesion layer covers the transfer heads and the upper surface of the base.

15. The micro LEDs carrying substrate according to claim 14 , wherein a thickness of a part of the adhesion layer on the upper surface is larger than a thickness of another part of the adhesion layer on each second surface.

16. The micro LEDs carrying substrate according to claim 10 , wherein a sum of a thickness of a part of the adhesion layer contacting the second surface of one of the transfer heads and a thickness of said one of the transfer heads is larger than a thickness of another part of the adhesion layer contacting the upper surface of the base.

Assignees

• Playnitride Inc

Inventors

• Lai Yu-Hung
• Lin Tzu-Yang
• Li Yun-Li

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/0711

  Apparatus therefor · CPC title

• H10W90/00

  Package configurations · CPC title