Metal/resin composite structure and manufacturing method of metal/resin composite structure

US11701864B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11701864-B2
Application numberUS-201816758475-A
CountryUS
Kind codeB2
Filing dateOct 25, 2018
Priority dateOct 27, 2017
Publication dateJul 18, 2023
Grant dateJul 18, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A metal/resin composite structure includes: a metal member (M) having a fine uneven surface; and a polyamide-based resin member (A) bonded to the metal member (M), and the polyamide-based resin member (A) satisfies the following condition [A1] and condition [A2]:[A1] a glass transition temperature (Tg) observed by a differential scanning calorimeter (DSC) is equal to or higher than 85° C. and equal to or lower than 140° C.; and[A2] a crystallization temperature (Tc) observed by a differential scanning calorimeter (DSC) is equal to or higher than 250° C. and equal to or lower than 292° C.

First claim

Opening claim text (preview).

The invention claimed is: 1. A metal/resin composite structure comprising: a metal member (M) having a fine uneven surface comprising a plurality of protrusions; and a polyamide-based resin member (A) bonded to the fine uneven surface of the metal member (M), wherein the polyamide-based resin member (A) is formed from a polyamide resin which comprises at least one semi-aromatic polyamide selected from the group consisting of polyhexamethylene isophthalamide (polyamide 6I), polyhexamethylene adipamide/polyhexamethylene isophthalamide copolymer (polyamide 66/6I), polyhexamethylene isophthalamide/polycaproamide copolymer (polyamide 6I/6), polyhexamethylene adipamide/polyhexamethylene terephthalamide/polyhexamethylene isophthalamide copolymer (polyamide 66/6T/6I), polyhexamethylene adipamide/polycaproamide/-polyhexamethylene isophthalamide copolymer (polyamide 66/6/6I), polyhexamethylene isophthalamide/polyhexamethylene terephthalamide copolymer (polyamide 6116T), and poly(2-methylpentamethylene terephthalamide)/poly(2-methylpentamethylene isophthalamide) copolymer (polyamide M5T/M5I); and at least one polyamide selected from the group consisting of polyhexamethylene terephthalamide (polyamide 6T), polyhexamethylene adipamide/polyhexamethylene terephthalamide copolymer (polyamide 66/6T), and polyhexamethylene terephthalamide/polyhexamethylene isophthalamide copolymer (polyamide 6T/6I), wherein the polyamide-based resin member (A) satisfies the following condition [A1] and condition [A2]: [A1] a glass transition temperature (Tg) observed by a differential scanning calorimeter (DSC) equal to or higher than 85° C. and equal to or lower than 140° C.; and [A2] a crystallization temperature (Tc) observed by a DSC is equal to or higher than 250° C. and equal to or lower than 292° C., and wherein the polyamide-based resin member (A) includes a metal soap, wherein the metal soap includes montanic acid soap and 12-hydroxystearic acid soap, and the content of the montanic acid soap relative to 100% by mass of the metal soap is more than 20% by mass and less than 100% by mass. 2. The metal/resin composite structure according to claim 1 , wherein the polyamide-based resin member (A) further satisfies at least one of the following condition [A3] and condition [A4]: [A3] a semi-crystallization time T 1/2 is 70 seconds or longer, wherein the semi-crystallization time T 1/2 is measured by increasing the temperature from 30° C. to 350° C. at a set rate of 500° C./min, and holding the temperature for 5 minutes, and instantly decreasing the temperature to 297° C. at a set rate of a rate of temperature fall of 500° C./min, and measuring the crystallization peak under the isothermal condition, then calculating the time from the point when the crystallization has started to the point when the crystallization has been accelerated half way (point when the area becomes 1/2 with respect to the entire crystallization peak area) by using the measured crystallization peak; and [A4] a crystallization degree (xc) obtained from an enthalpy of fusion at the measurement of a differential scanning calorimeter (DSC) is equal to or less than 27%. 3. The metal/resin composite structure according to claim 1 , wherein the polyamide-based resin member (A) further satisfies the following condition [A1′]: [A1] the glass transition temperature (Tg) measured by a differential scanning calorimeter (DSC) is equal to or higher than 115° C. and equal to or lower than 140° C. 4. The metal/resin composite structure according to claim 1 , wherein the polyamide-based resin member (A) includes an inorganic filler. 5. The metal/resin composite structure according to claim 4 , wherein a content of the inorganic filler in the polyamide-based resin member (A) is greater than 0% by mass and equal to or less than 80% by mass, where the entire content of the polyamide-based resin member (A) is 100% by mass. 6. The metal/resin composite structure according to claim 1 , wherein a content of the metal soap in the polyamide-based resin member (A) is greater than 0.0% by mass and equal to or less than 10% by mass, where the entire content of the polyamide-based resin member (A) is 100% by mass. 7. The metal/resin composite structure according to claim 1 , wherein a tensile shear strength of the bonded surface between the metal member (M) and the polyamide-based resin member (A), which is measured under the conditions of 23° C., a distance between chucks of 60 mm, and a tensile rate of 10 mm/min by using a tensile tester, is equal to or greater than 40 MPa and equal to or smaller than 70 MPa. 8. The metal/resin composite structure according to claim 7 , wherein a fracture surface after the test of the tensile shear strength has a base material breakdown. 9. The metal/resin composite structure according to claim 1 , wherein the metal member (M) includes one kind or two or more kinds selected from iron, high tensile steel, stainless steel, aluminum, aluminum alloy, magnesium, magnesium alloy, copper, copper alloy, titanium, and a titanium alloy. 10. The metal/resin composite structure according to claim 1 , wherein the protrusions have an interval period of equal to or greater than 5 nm and equal to or smaller than 500 μm. 11. An engine mount member comprising the metal/resin composite structure according to claim 1 . 12. A manufacturing method of the metal/resin composite structure according to claim 1 , the method comprising: a step (i) of inserting the metal member (M) having a fine uneven surface to an injection molding die; and a step (ii) of injecting a polyamide-based resin composition (a) including the polyamide resin and the metal soap to a surface of the inserted metal member (M), and bonding the polyamide-based resin member (A) which is a molded body of the polyamide-based resin composition (a) to the surface of the metal member (M), by causing the injected polyamide-based resin composition (a) to permeate fine recesses and protrusions of the fine uneven surface and solidifying the polyamide-based resin composition. 13. The manufacturing method of the metal/resin composite structure according to claim 12 , wherein a temperature of the injection molding die in the step (ii) is 100° C. to 250° C.

Assignees

Inventors

Classifications

  • B32B15/088Primary

    comprising polyamides · CPC title

  • B29C45/14Primary

    incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles {(B29C45/1671 takes precedence)} · CPC title

  • characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)} · CPC title

  • comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title

  • using fillers, pigments, thixotroping agents · CPC title

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What does patent US11701864B2 cover?
A metal/resin composite structure includes: a metal member (M) having a fine uneven surface; and a polyamide-based resin member (A) bonded to the metal member (M), and the polyamide-based resin member (A) satisfies the following condition [A1] and condition [A2]:[A1] a glass transition temperature (Tg) observed by a differential scanning calorimeter (DSC) is equal to or higher than 85° C. and e…
Who is the assignee on this patent?
Mitsui Chemicals Inc
What technology area does this patent fall under?
Primary CPC classification B32B15/088. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 18 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).