Shoe manufacturing

US11701852B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11701852-B2
Application numberUS-201815733882-A
CountryUS
Kind codeB2
Filing dateJul 20, 2018
Priority dateJul 20, 2018
Publication dateJul 18, 2023
Grant dateJul 18, 2023

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Example shoe manufacturing methods and related computer readable medium for implementing a portion of said manufacturing methods are disclosed herein. In some examples, the method includes producing a lower portion of a last based on data relating to a foot of a user. In addition, the method includes placing an upper member about the last such that a lasting of the upper member extends over the lower portion of the last. Further, the method includes producing a midsole element based on the data relating to the foot of the user, and attaching the midsole element to the upper member such that the lasting is disposed between the lower portion of the last and the midsole element.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing a shoe, the method comprising: producing a lower portion of a last based on data relating to a foot of a user; placing an upper member about the last, wherein the upper member includes a lasting extending over the lower portion of the last; producing a midsole element based on the data relating to the foot of the user; attaching the midsole element to the upper member such that the lasting is disposed between the lower portion of the last and the midsole element; engaging corresponding alignment members on the lower portion of the last and the midsole element while attaching the midsole element to the upper member; removing the last from the upper member after attaching the midsole element to the upper member; and fracturing the alignment members from the midsole element while removing the last from the upper member. 2. The method of claim 1 , wherein producing the midsole element comprises producing the midsole element based on either or both of: a three dimensional (3D) scan of the foot; and a pressure readings associated with the foot. 3. The method of claim 1 , wherein producing the last comprises: producing the lower portion of the last with a three dimensional (3D) printing process; and attaching the lower portion of the last to an upper portion of the last. 4. The method of claim 3 , wherein producing the midsole element comprises producing the midsole element with the 3D printing process. 5. The method of claim 1 , further comprising: molding an moldable material to the midsole element; and removing the last from the upper member after the molding. 6. The method of claim 1 , wherein attaching the midsole element to the upper member comprises attaching the midsole element to the upper member with an adhesive. 7. The method of claim 1 , wherein producing the last comprises producing the lower portion of the last based on either or both of: a three dimensional (3D) scan of the foot; and pressure associated with the foot. 8. The method of claim 5 , wherein the moldable material comprises an elastomer.

Assignees

Inventors

Classifications

  • B29D35/06Primary

    having soles or heels formed and joined on to preformed uppers using a moulding technique, e.g. by injection moulding, pressing and vulcanising · CPC title

  • Data acquisition or data processing for additive manufacturing · CPC title

  • B33Y10/00Primary

    Processes of additive manufacturing · CPC title

  • Products made by additive manufacturing · CPC title

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Frequently asked questions

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What does patent US11701852B2 cover?
Example shoe manufacturing methods and related computer readable medium for implementing a portion of said manufacturing methods are disclosed herein. In some examples, the method includes producing a lower portion of a last based on data relating to a foot of a user. In addition, the method includes placing an upper member about the last such that a lasting of the upper member extends over the…
Who is the assignee on this patent?
Hewlett Packard Development Co
What technology area does this patent fall under?
Primary CPC classification B29D35/06. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 18 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).