Resin component, and molding method and molding device for same

Patent metadata

Field	Value
Publication number	US-11701806-B2
Application number	US-201716337115-A
Country	US
Kind code	B2
Filing date	Sep 20, 2017
Priority date	Sep 30, 2016
Publication date	Jul 18, 2023
Grant date	Jul 18, 2023

Abstract

An instrument panel (10) includes a base material portion (20) made of a base material M1 and a different material portion (30) made of a different material M2 having a different thermal shrinkage from that of the base material M1, and in the instrument panel (10), the base material portion (20) and the different material portion (30) are connected in a state such that at least a part of the two materials do not overlap.

First claim

The invention claimed is:

1. A resin component comprising:
a first resin portion composed of a first resin material; and
a second resin portion composed of a second resin material having a different thermal shrinkage from a thermal shrinkage of the first resin material, the first resin portion and the second resin portion being connected in a state of at least partially not overlapping,
the resin component further comprising:
a discontinuous portion at a portion inward of a boundary location of the second resin portion with the first resin portion,
wherein the discontinuous portion is a cut having a V shape when seen from above, and a connecting point of two sides of a V shape of another through hole or bottomed hole is positioned within an area defined by three sides connecting three end points of the V shape.

2. The resin component according to claim 1 , wherein
the second resin portion is arranged so as to be at least partially surrounded by the first resin portion.

3. The resin component according to claim 1 , wherein
the discontinuous portion is arranged intermittently along the boundary location.

4. The resin component according to claim 1 , wherein
the discontinuous portion is opened on a surface opposite to a designed surface of the resin component.

5. A method for molding a resin component in which a first resin portion composed of a first resin material and a second resin portion composed of a second resin material having a different thermal shrinkage from a thermal shrinkage of the first resin material are connected in a state of at least partially not overlapping, the resin component further comprising a discontinuous portion at a portion inward of a boundary location of the second resin portion with the first resin portion, wherein the discontinuous portion is a cut having a V shape when seen from above, and a connecting point of two sides of a V shape of another through hole or bottomed hole is positioned within an area defined by three sides connecting three end points of the V shape,
the method comprising:
supplying the first resin material into a portion of a cavity configured to mold the first resin portion of the molded resin component; and
supplying the second resin material into a portion of the cavity configured to mold the second resin portion of the molded resin component, the cavity comprising a V-shaped projection disposed at a portion closer to the second resin portion than a boundary location between the first resin portion and the second resin portion of the molded resin component, to form the cut having the V shape.

Assignees

• Honda Motor Co Ltd

Inventors

• MORIIZUMI Taiki
• Kami Yuuki
• Hirano Noboru
• SAIMURA Toshihiro
• Miyamoto Hajime
• Yusa Atsushi
• Kawano Kazuhiro

Classifications

• B29C45/1639 Primary

  Removable partitions between adjacent mould cavity portions · CPC title

• B29C45/1657

  using means for adhering or bonding the layers or parts to each other (mechanical anchoring B29C37/0082) · CPC title

• B29C45/561

  Injection-compression moulding · CPC title

• B29K2105/02

  heat shrinkable {(B29K2995/0049 takes precedence)} · CPC title

• B29L2031/3008

  Instrument panels · CPC title