Enthalpy-driven self-hardening process at the polymeric/metal layer interface with an interdiffusion process

US11701802B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11701802-B2
Application numberUS-201916674036-A
CountryUS
Kind codeB2
Filing dateNov 5, 2019
Priority dateNov 5, 2019
Publication dateJul 18, 2023
Grant dateJul 18, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of creating an interface includes: a) adding organometallic compounds to a polymeric material to create an interfacial layer; b) placing the polymeric material having the interfacial layer in a mold; c) heating a deposit material until the deposit material has a predetermined-minimized volumetric density; and d) depositing the deposit material on the interfacial layer. The latent heat of the molten metallic material transfers to the interfacial layer to create chemical bonds and physical interlocks between the interfacial layer and the metallic material. The deposit material cools to form solidified layer on the interfacial layer.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of creating an interface, comprising: adding a plurality of organometallic compounds to a polymeric material to create an interfacial layer; placing the interfacial layer in a mold; heating a deposit material until the deposit material has a predetermined-minimized volumetric density, wherein the deposit material is a ceramic material, and the deposit material is melted after heating the deposit material; depositing the deposit material on the interfacial layer; wherein the deposit material cools to form a solidified deposit layer on the interfacial layer; and wherein a volumetric density of the deposit material linearly decreases as a temperature of the deposit material increases, and the latent heat of the deposit material transfers to the interfacial layer as a result of the predetermined-minimized volumetric density of the deposit material; and wherein depositing the deposit material includes 3D printing the deposit material directly onto the interfacial layer. 2. The method of claim 1 , wherein adding the plurality of organometallic compounds to the polymeric material includes at least one chosen from adding the plurality of organometallic compounds to a surface of the polymeric material and compounding the polymeric material with the plurality of organometallic compounds. 3. The method of claim 1 , wherein the organometallic compounds include at least one chosen from silicon, phosphorus, and sulfur. 4. The method of claim 1 , wherein the deposit material includes a graphite-based composite. 5. The method of claim 1 , wherein depositing the deposit material on the interfacial layer causes a physical diffusion between the deposit material and the interfacial layer.

Assignees

Inventors

Classifications

  • In-mould coating, e.g. by introducing the coating material into the mould after forming the article · CPC title

  • Materials specially adapted for additive manufacturing · CPC title

  • Pretreatment of the material to be coated, e.g. for coating on selected surface areas · CPC title

  • Metallic material · CPC title

  • Processes of additive manufacturing · CPC title

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What does patent US11701802B2 cover?
A method of creating an interface includes: a) adding organometallic compounds to a polymeric material to create an interfacial layer; b) placing the polymeric material having the interfacial layer in a mold; c) heating a deposit material until the deposit material has a predetermined-minimized volumetric density; and d) depositing the deposit material on the interfacial layer. The latent heat …
Who is the assignee on this patent?
Gm Global Tech Operations Llc
What technology area does this patent fall under?
Primary CPC classification B29C37/0028. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 18 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).