Systems and methods for saw tooth milling to prevent chip fraud

US11701725B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11701725-B2
Application numberUS-202017104912-A
CountryUS
Kind codeB2
Filing dateNov 25, 2020
Priority dateDec 20, 2019
Publication dateJul 18, 2023
Grant dateJul 18, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Example embodiments of systems and methods for milling patterns for a card are provided. A chip fraud prevention system include a device including a chip. The chip may be at least partially encompassed in a chip pocket. The chip pocket may include one or more shapes. The one or more shapes may include one or more peaks and one or more valleys. One or more connections may be communicatively coupled to at least one surface of the chip. The one or more connections may be placed between at least one of the one or more peaks or one or more valleys.

First claim

Opening claim text (preview).

What is claimed is: 1. A chip fraud prevention system, comprising: a housing comprising a chip pocket, the chip pocket configured to at least partially encompass an integrated circuit, the chip pocket comprising a peak and a valley; and a connection configured to communicatively couple to the integrated circuit, the connection placed between the peak and the valley, wherein the peak and the valley create an uneven surface within the housing chip pocket. 2. The chip fraud prevention system of claim 1 , wherein the integrated circuit is wholly encompassed in the chip pocket. 3. The chip fraud prevention system of claim 1 , wherein: the chip pocket comprises a plurality of peaks and a plurality of valleys, and the plurality of peaks and the plurality of valleys are formed in a saw tooth milling pattern. 4. The chip fraud prevention system of claim 3 , wherein the saw tooth milling pattern is associated with an entity. 5. The chip fraud prevention system of claim 1 , wherein: the chip pocket comprises a plurality of peaks and a plurality of valleys, and the plurality of peaks and the plurality of valleys are formed in a plurality of different shapes. 6. The chip fraud prevention system of claim 1 , wherein: the chip pocket comprises a plurality of peaks and a plurality of valleys, and the plurality of peaks and the plurality of valleys are formed in different shapes, lengths, or dimensions. 7. The chip fraud prevention system of claim 1 , wherein the fraud prevention system is a smartcard. 8. The chip fraud prevention system of claim 1 , wherein the fraud prevention system is a wearable device. 9. The chip fraud prevention system of claim 1 , wherein the fraud prevention system is a vehicle. 10. The chip fraud prevention system of claim 1 , wherein the fraud prevention system is an appliance. 11. The chip fraud prevention system of claim 1 , wherein the fraud prevention system is a smartphone. 12. The chip fraud prevention system of claim 1 , wherein the peak and the valley create an uneven cutting process for removal of the integrated circuit. 13. A fraud prevention method, comprising: positioning an integrated circuit at least partially within a chip pocket contained in a housing, the chip pocket comprising a peak and a valley creating an uneven surface within the chip pocket; communicatively coupling a connection to the integrated circuit; positioning the connection between the peak and the valley; and communicatively coupling the connection to the chip pocket. 14. The fraud prevention method of claim 13 , wherein the connection comprises at least one of a wire or a pin. 15. The fraud prevention method of claim 13 , wherein: the chip pocket comprises a plurality of peaks and a plurality of valleys, and the plurality of peaks and the plurality of valleys are formed in a saw tooth milling pattern. 16. The fraud prevention method of claim 13 , wherein: the chip pocket comprises a plurality of peaks and a plurality of valleys, and the plurality of peaks and the plurality of valleys are formed in a plurality of different shapes. 17. The fraud prevention method of claim 13 , wherein: the chip pocket comprises a plurality of peaks and a plurality of valleys, and the plurality of peaks and the plurality of valleys are formed in different shapes, lengths, or dimensions. 18. The chip fraud prevention method of claim 13 , wherein the peak and the valley are repeated after a predetermined interval. 19. The chip fraud prevention method of claim 13 , wherein the shape of the peak and the shape of the valley are randomly generated. 20. A card, comprising: a housing embedded in a substrate, the housing comprising a chip pocket, a peak, and a valley; an integrated circuit at least partially encompassed within the chip pocket; and a connection positioned between the peak and the valley, the connection configured to communicatively couple the integrated circuit to the chip pocket, wherein the peak and the valley form a saw tooth milling pattern within the chip pocket.

Assignees

Inventors

Classifications

  • for flat cards, e.g. credit cards · CPC title

  • Mounting details of integrated circuit chips · CPC title

  • B23D61/04Primary

    with inserted saw teeth {, i.e. the teeth being individually inserted} · CPC title

  • the circuit comprising an arrangement for avoiding intrusions and unwanted access to data inside of the connector · CPC title

  • the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface · CPC title

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What does patent US11701725B2 cover?
Example embodiments of systems and methods for milling patterns for a card are provided. A chip fraud prevention system include a device including a chip. The chip may be at least partially encompassed in a chip pocket. The chip pocket may include one or more shapes. The one or more shapes may include one or more peaks and one or more valleys. One or more connections may be communicatively coup…
Who is the assignee on this patent?
Capital One Services Llc
What technology area does this patent fall under?
Primary CPC classification G06K19/07745. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jul 18 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).