Memory device

Patent metadata

Field	Value
Publication number	US-11700707-B2
Application number	US-202117509358-A
Country	US
Kind code	B2
Filing date	Oct 25, 2021
Priority date	May 14, 2021
Publication date	Jul 11, 2023
Grant date	Jul 11, 2023

Abstract

A memory device includes a device housing, a memory module, and a cooling unit. The memory module is disposed in the device housing, wherein the memory module generates heat, and the heat is transmitted to the device housing. The cooling unit is thermally connected to the device housing to dissipate some of the heat. The cooling unit includes a unit housing and a working fluid. An interior space is formed in the unit housing. The working fluid is disposed in the interior space, wherein some of the heat travels from the device housing, passes through the unit housing, and is transmitted to the working fluid.

First claim

What is claimed is:

1. A memory device, comprising:
a device housing;
a memory module, disposed in the device housing, wherein the memory module generates heat, and the heat is transmitted to the device housing; and
a cooling unit, thermally connected to the device housing to dissipate a part of the heat, wherein the cooling unit comprises:
a unit housing, wherein an interior space is formed in the unit housing; and
a working fluid, disposed in the interior space, wherein a part of the heat travels from the device housing, passes through the unit housing, and is transmitted to the working fluid,
wherein the interior space comprises a flow path, the cooling unit comprises a fluid inlet and a fluid outlet, the fluid inlet is connected to one end of the flow path, the fluid outlet is connected to the other end of the flow path, and the working fluid enters the flow path via the fluid inlet and leaves the flow path via the fluid outlet to remove the heat from the cooling unit.

2. The memory device as claimed in claim 1 , wherein the interior space comprises a chamber, the working fluid is disposed in the chamber, a heat conductive structure is formed in the chamber, and the heat conductive structure contacts the working fluid.

3. The memory device as claimed in claim 2 , wherein the heat conductive structure comprises a plurality of heat conductive posts, and the plurality of heat conductive posts are arranged in a matrix.

4. The memory device as claimed in claim 1 , wherein the unit housing comprises a first unit housing member and a second unit housing member, the first unit housing member is combined with the second unit housing member, the interior space is formed between the first unit housing member and the second unit housing member, a plurality of first heat conductive posts are formed on an inner side of the first unit housing member, a plurality of second heat conductive posts are formed on an inner side of the second unit housing member, and the plurality of first heat conductive posts and the plurality of second heat conductive posts are formed in the interior space.

5. The memory device as claimed in claim 4 , wherein the cooling unit further comprises a waterproof ring, the waterproof ring is sandwiched between the first unit housing member and the second unit housing member, and the waterproof ring surrounds the interior space.

6. The memory device as claimed in claim 5 , wherein the first unit housing member comprises an annular rib, the second unit housing member comprises an annular groove, the waterproof ring is disposed in the annular groove, and the annular rib is inserted into the annular groove.

7. The memory device as claimed in claim 4 , wherein the unit housing comprises an infusion hole, and the working fluid is infused into the interior space via the infusion hole.

8. The memory device as claimed in claim 7 , wherein the cooling unit further comprises a sealing plug, and the sealing plug is connected to the infusion hole with thread to seal the infusion hole.

9. The memory device as claimed in claim 1 , wherein the unit housing further comprises a heat conductive rib, and the heat conductive rib is formed in the flow path.

10. The memory device as claimed in claim 9 , wherein the flow path is U-shaped, and the heat conductive rib extends along the flow path.

11. The memory device as claimed in claim 1 , wherein the device housing and at least a portion of the unit housing are integrally formed.

12. A memory device, comprising:
a device housing;
a memory module, disposed in the device housing, wherein the memory module generates heat, and the heat is transmitted to the device housing; and
a cooling unit, thermally connected to the device housing to dissipate a part of the heat, wherein the cooling unit comprises:
a unit housing, wherein an interior space is formed in the unit housing;
a working fluid, disposed in the interior space, wherein a part of the heat travels from the device housing, passes through the unit housing, and is transmitted to the working fluid; and
a heat conductive material, wherein the device housing is connected to the unit housing by wedging or screw, and the heat conductive material is disposed between the device housing and the unit housing.

13. A memory device, comprising:
a device housing;
a memory module, disposed in the device housing, wherein the memory module generates heat, and the heat is transmitted to the device housing; and
a cooling unit, thermally connected to the device housing to dissipate a part of the heat, wherein the cooling unit comprises:
a unit housing, wherein an interior space is formed in the unit housing;
a working fluid, disposed in the interior space, wherein a part of the heat travels from the device housing, passes through the unit housing, and is transmitted to the working fluid,
wherein a plurality of unit housing ribs are formed on a surface of the unit housing,
wherein the device housing further comprises an air inlet and an air outlet, air flow passes through the air inlet and the air outlet in a first direction, and the unit housing ribs extend in the first direction.

Assignees

• Shannon Systems Ltd

Inventors

• Li Jiangshan

Classifications

• G06F1/20 Primary

  Cooling means · CPC title

• H05K7/20154 Primary

  Heat dissipaters coupled to components · CPC title

• H05K7/20127

  Natural convection · CPC title

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• G06F1/187

  Mounting of fixed or removable disk drives · CPC title