Dielectric resonator antenna modules

Patent metadata

Field	Value
Publication number	US-11700035-B2
Application number	US-202016920297-A
Country	US
Kind code	B2
Filing date	Jul 2, 2020
Priority date	Jul 2, 2020
Publication date	Jul 11, 2023
Grant date	Jul 11, 2023

Abstract

An electronic device may be provided with an antenna module having a substrate. A phased antenna array of dielectric resonator antennas and a radio-frequency integrated circuit for the array may be mounted to one or more surfaces of the substrate. The dielectric resonator antennas may include dielectric columns excited by feed probes. The feed probes may be printed onto sidewalls of the dielectric columns or may be pressed against the sidewalls by biasing structures. A plastic substrate may be molded over each dielectric column and each of the feed probes in the array. The feed probes may cover multiple polarizations. The array may include elements for covering multiple frequency bands. The dielectric columns may be aligned a longitudinal axis and may be rotated at a non-zero and non-perpendicular angle with respect to the longitudinal axis.

First claim

What is claimed is:

1. An electronic device comprising:
a substrate;
a phased antenna array having dielectric resonator antennas mounted to a surface of the substrate, wherein one of the dielectric resonator antennas comprises:
a dielectric resonating element,
a feed probe configured to excite a resonant mode of the dielectric resonating element, and
a biasing structure that presses the feed probe against the dielectric resonating element, the biasing structure being molded over the feed probe and at least some of the dielectric resonating element.

2. The electronic device defined in claim 1 , further comprising:
a radio-frequency integrated circuit (RFIC) mounted to the substrate, wherein the RFIC is configured to adjust a direction of a signal beam formed by the phased antenna array, the substrate comprises an additional surface opposite the surface, and the RFIC is mounted to the additional surface of the substrate.

3. The electronic device defined in claim 2 , further comprising:
a board-to-board connector mounted to the surface of the substrate; and
radio-frequency transceiver circuitry coupled to the RFIC via the board-to-board connector.

4. The electronic device defined in claim 2 , further comprising:
an over-mold structure on the additional surface, wherein the RFIC is embedded within the over-mold structure.

5. The electronic device defined in claim 2 , wherein the RFIC is soldered to the surface of the substrate.

6. The electronic device defined in claim 2 , further comprising:
an additional phased antenna array mounted to the additional surface of the substrate, wherein the additional phased antenna array is configured to convey radio-frequency signals at a frequency greater than 10 GHz within a signal beam, the RFIC being configured to adjust a direction of the signal beam.

7. The electronic device defined in claim 6 , further comprising:
peripheral conductive housing structures that run around a periphery of the electronic device;
a display having a display cover layer mounted to the peripheral conductive housing structures and having a display module configured to emit light through the display cover layer; and
a housing wall mounted to the peripheral conductive housing structures opposite the display cover layer, wherein the phased antenna array is configured to convey additional radio-frequency signals within an additional signal beam through the display cover layer and the additional phased antenna array is configured to convey the radio-frequency signals within the signal beam through the housing wall.

8. The electronic device defined in claim 6 , wherein the additional phased antenna array comprises antennas selected from the group consisting of: stacked patch antennas embedded within the substrate and dielectric resonator antennas mounted to the additional surface of the substrate.

9. The electronic device of claim 1 , wherein the feed probe biasing structure presses the feed probe against a sidewall of the dielectric resonating element.

10. The electronic device of claim 9 , further comprising:
a plastic substrate molded over the feed probe biasing structure and at least some of the dielectric resonating element.

11. The electronic device of claim 10 , wherein the dielectric resonator antennas comprise an additional dielectric resonator antenna, the additional dielectric resonator antenna comprising:
an additional dielectric resonating element mounted to the surface of the substrate;
an additional feed probe configured to excite a resonant mode of the additional dielectric resonating element; and
an additional feed probe biasing structure that presses the additional feed probe against the additional dielectric resonating element, wherein the additional feed probe biasing structure is molded over the additional feed probe and at least some of the additional dielectric resonating element, and the plastic substrate is molded over the additional feed probe biasing structure and at least some of the additional dielectric resonating element, wherein the substrate comprises a flexible printed circuit substrate.

12. The electronic device of claim 9 , wherein the dielectric resonating element has an additional sidewall oriented perpendicular to a sidewall of the dielectric resonating element contacting the feed probe, the dielectric resonator antenna comprises an additional feed probe coupled to the additional sidewall, the resonant mode is associated with a first linear polarization, the additional feed probe is configured to excite an additional resonant mode of the dielectric resonating element associated with a second linear polarization orthogonal to the first linear polarization, the feed probe biasing structure presses the additional feed probe against the additional sidewall, and the feed probe biasing structure is molded over the additional feed probe.

13. An electronic device comprising:
a substrate;
a phased antenna array having dielectric resonator antennas mounted to a surface of the substrate, wherein the dielectric resonator antennas are aligned along a longitudinal axis, comprise dielectric resonating elements having sidewalls that are oriented at a non-zero and non-perpendicular angle with respect to the longitudinal axis, and are fed by feed probes coupled to the sidewalls at the surface of the substrate; and
feed probe biasing structures molded over the feed probes and configured to hold the feed probes against the sidewalls.

14. The electronic device defined in claim 13 , further comprising:
a dielectric substrate molded over each of the feed probe biasing structures; and
openings in the dielectric substrate, wherein each of the openings is laterally interposed between a respective pair of dielectric resonating elements in the probe-fed dielectric resonator antennas, and wherein each of the dielectric resonating elements comprises first, second, third, and fourth sidewalls, a first feed probe pressed against the first sidewall by a respective one of the feed probe biasing structures, a second feed probe pressed against the second sidewall by the respective one of the feed probe biasing structures, a first parasitic element pressed against the third sidewall by the respective one of the feed probe biasing structures, and a second parasitic element pressed against the fourth sidewall by the respective one of the feed probe biasing structures.

15. The electronic device of claim 13 , further comprising a radio-frequency integrated circuit mounted to the substrate and configured to control the phased antenna array to form a signal beam in a first direction at a first time and configured to control the phased antenna array to form the signal beam in a second direction different from the first direction at a second time.

Assignees

• Apple Inc

Inventors

• Rajagopalan Harish
• Avser Bilgehan
• Garrido Lopez David
• Hasnat Forhad
• Pascolini Mattia
• Askarian Amiri Mikal
• Gomez Angulo Rodney A
• Yang Thomas W
• Wu Jiechen
• Nyland Eric N
• Paulotto Simone
• Edwards Jennifer M
• Hill Matthew D
• Chowdhury Ihtesham H
• Hurrell David A
• Yong Siwen
• Wu Jiangfeng
• Wagman Daniel C
• Akbarzadeh Soroush
• Scritzky Robert
• Ramalingam Subramanian

Classifications

• H01Q1/2283

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• G01R31/2822

  of microwave or radiofrequency circuits (of attenuation, gain, e.g. using network analyzers G01R27/28) · CPC title

• H01Q13/24

  constituted by a dielectric or ferromagnetic rod or pipe (H01Q13/28 takes precedence) · CPC title

• H04B3/52 Primary

  Systems for transmission between fixed stations via waveguides · CPC title

• H04B3/54

  Systems for transmission via power distribution lines · CPC title