Three-dimensional shaping method

US11697158B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11697158-B2
Application numberUS-202017122430-A
CountryUS
Kind codeB2
Filing dateDec 15, 2020
Priority dateDec 18, 2019
Publication dateJul 11, 2023
Grant dateJul 11, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A three-dimensional shaping method includes a molded body forming step of forming a molded body having a plurality of projection portions using a material containing a powder and a binder, a supporting step of supporting the molded body by a support having groove portions at positions configured to insert each of the projection portions in a state where the plurality of projection portions are inserted into the groove portions, and a sintering step of sintering the powder by heating the molded body in a state of being supported by the support, wherein the groove portion is extended from an insertion position of the projection portion in a specified direction that specifies a direction of shrinkage of the molded body by performing the sintering step.

First claim

Opening claim text (preview).

What is claimed is: 1. A three-dimensional shaping method, comprising: a molded body forming step of forming a molded body having a plurality of projection portions using a material containing a powder and a binder, the plurality of projections extending in a first direction; a supporting step of supporting the molded body by a support having elongate groove portions at positions configured to insert each of the projection portions in a state where the plurality of projection portions are inserted into the elongate groove portions; and a sintering step of sintering the powder by heating the molded body in a state of being supported by the support, wherein the elongate groove portion extends from an insertion position of the projection portion in a specified direction towards a center of the molded body, the specified direction specifies a direction of shrinkage of the molded body to allow controlled shrinkage of the molded body in the specified direction that is transverse to the first direction and toward the center of the molded body, the projection portion moving longitudinally along the elongate groove portion in the direction of shrinkage of the molded body during the sintering step. 2. The three-dimensional shaping method according to claim 1 , wherein the specified direction is a direction along a direction of a straight line coupling at least two of the plurality of projection portions. 3. The three-dimensional shaping method according to claim 1 , wherein the specified direction is a direction along a longitudinal direction of the molded body. 4. The three-dimensional shaping method according to claim 1 , wherein the elongate groove portion has a width that becomes narrower toward a direction of being extended from the insertion position of the projection portion. 5. The three-dimensional shaping method according to claim 1 , wherein the projection portion is in a columnar shape, a cylindrical shape, or a conical shape. 6. The three-dimensional shaping method according to claim 1 , wherein the powder is a metal powder. 7. The three-dimensional shaping method according to claim 1 , wherein the support is made of a ceramic.

Assignees

Inventors

Classifications

  • B22F10/47Primary

    characterised by structural features · CPC title

  • Setting, e.g. drying, dehydrating or firing ceramic articles (B28B11/242 takes precedence) · CPC title

  • Processes of additive manufacturing · CPC title

  • characterised by material · CPC title

  • by jetting of binder onto a bed of metal powder · CPC title

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Frequently asked questions

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What does patent US11697158B2 cover?
A three-dimensional shaping method includes a molded body forming step of forming a molded body having a plurality of projection portions using a material containing a powder and a binder, a supporting step of supporting the molded body by a support having groove portions at positions configured to insert each of the projection portions in a state where the plurality of projection portions are …
Who is the assignee on this patent?
Seiko Epson Corp
What technology area does this patent fall under?
Primary CPC classification B22F10/47. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 11 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).