Circuit board

US11696408B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11696408-B2
Application numberUS-202117450176-A
CountryUS
Kind codeB2
Filing dateOct 7, 2021
Priority dateOct 22, 2020
Publication dateJul 4, 2023
Grant dateJul 4, 2023

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  1. Title

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  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A circuit board includes a substrate having an end surface, and a principal surface on which an electronic component is mounted, a first region, provided on the principal surface, and coated with a moistureproof agent, a second region, provided on the principal surface, and prohibited from being coated with the moistureproof agent, and a groove having two ends, formed in the principal surface, between the first region and the second region. The two ends of the groove reach the end surface of the substrate. The groove includes a guiding part, configured to guide the moistureproof agent overflowing from the first region into the groove, provided at a portion of the groove farthest away from the end surface.

First claim

Opening claim text (preview).

What is claimed is: 1. A circuit board comprising: a substrate having an end surface, and a principal surface on which an electronic component is mounted; a first region, provided on the principal surface, and coated with a moistureproof agent; a second region, provided on the principal surface, and prohibited from being coated with the moistureproof agent; and a groove having two ends, formed in the principal surface, between the first region and the second region, wherein the two ends of the groove reach the end surface of the substrate, the groove includes a guiding part, configured to guide the moistureproof agent overflowing from the first region into the groove, provided at a portion of the groove farthest away from the end surface, and the guiding part, in a plan view, includes multiple protrusions formed on a sidewall surface of the groove closer to the first region and protruding in a direction inward of the groove. 2. The circuit board as claimed in claim 1 , wherein the guiding part includes a first storage part configured to store the moistureproof agent guided into the groove. 3. The circuit board as claimed in claim 1 , wherein the groove further includes two first parts extending from the end surface of the substrate, and a second part, including the guiding part, and connecting the two first parts, and the circuit board further comprising: a second storage part, provided at a connecting portion connecting the second part and each of the two first parts, and configured to store the moistureproof agent flowing from the guiding part toward each of the two first parts. 4. The circuit board as claimed in claim 3 , wherein the sidewall surface of the groove is curved at a boundary portion between the second storage part and each of the two first parts, and at a boundary portion between the second part and the second storage part. 5. The circuit board as claimed in claim 1 , wherein the groove further includes two first parts extending from the end surface of the substrate, and a second part, including the guiding part, and connecting the two first parts, wherein the sidewall surface of the groove between the second part and each of the two first parts is a curved surface curved in one direction in the plan view. 6. The circuit board as claimed in claim 1 , wherein the two ends of the groove reach the same end surface of the substrate. 7. The circuit board as claimed in claim 1 , wherein the two ends of the groove reach adjacent, mutually perpendicular end surfaces of the substrate, respectively.

Assignees

Inventors

Classifications

  • Permanent coating compositions · CPC title

  • Coating free areas, e.g. areas other than pads or lands free of solder resist · CPC title

  • H05K1/181Primary

    associated with surface mounted components · CPC title

  • H05K3/282Primary

    for inhibiting the corrosion of the circuit, e.g. for preserving the solderability · CPC title

  • Insulating conformal coating · CPC title

Patent family

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Frequently asked questions

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What does patent US11696408B2 cover?
A circuit board includes a substrate having an end surface, and a principal surface on which an electronic component is mounted, a first region, provided on the principal surface, and coated with a moistureproof agent, a second region, provided on the principal surface, and prohibited from being coated with the moistureproof agent, and a groove having two ends, formed in the principal surface, …
Who is the assignee on this patent?
Shinko Electric Ind Co
What technology area does this patent fall under?
Primary CPC classification H05K1/181. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 04 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).