Electronic component

Patent metadata

Field	Value
Publication number	US-11688540-B2
Application number	US-201916670916-A
Country	US
Kind code	B2
Filing date	Oct 31, 2019
Priority date	Nov 8, 2018
Publication date	Jun 27, 2023
Grant date	Jun 27, 2023

Abstract

An electronic component that has fewer cracks during production is provided. The electronic component includes an outer electrode on a multilayer body, which includes an inner glass layer, a magnetic material layer on top and bottom surfaces of the inner glass layer, and an outer glass layer on top and bottom surfaces of the magnetic material layer. The insulating layers of the inner glass layer and the outer glass layers contain a dielectric glass material that contains a glass material containing at least K, B, and Si, quartz, and alumina. The glass material content of each insulating layer of the inner glass layer ranges from approximately 60%-65% by weight, the quartz content of each insulating layer of the inner glass layer ranges from approximately 34%-37% by weight, and the alumina content of each insulating layer of the inner glass layer ranges from approximately 0.5%-4% by weight.

First claim

What is claimed is:

1. An electronic component comprising an outer electrode on a surface of a multilayer body, the multilayer body including an inner glass layer, a magnetic material layer on a top surface and a bottom surface of the inner glass layer, and an outer glass layer on a top surface and a bottom surface of the magnetic material layer,
wherein the inner glass layer includes a coil multilayer body, a top lead-out electrode layer on a top surface of the coil multilayer body, and a bottom lead-out electrode layer on a bottom surface of the coil multilayer body, the coil multilayer body including a plurality of coil conductor layers, each of the coil conductor layers including a coil conductor having a coil pattern on a surface of an insulating layer, the top lead-out electrode layer including a lead-out electrode on a surface of an insulating layer, the bottom lead-out electrode layer including a lead-out electrode on a surface of an insulating layer, and the coil multilayer body includes a primary coil conductor layer including a primary coil conductor, a secondary coil conductor layer including a secondary coil conductor, a tertiary coil conductor layer including a tertiary coil conductor, and a parallel primary coil conductor layer including a parallel primary coil conductor stacked in this order on the bottom surface thereof,
the outer electrode includes a first outer electrode, a second outer electrode, a third outer electrode, a fourth outer electrode, a fifth outer electrode, and a sixth outer electrode,
the primary coil conductor is coupled to the first outer electrode and the fourth outer electrode,
the secondary coil conductor is coupled to the second outer electrode and the fifth outer electrode,
the tertiary coil conductor is coupled to the third outer electrode and the sixth outer electrode,
the parallel primary coil conductor is coupled to the first outer electrode and the fourth outer electrode, the primary coil conductor is connected in parallel to the parallel primary coil conductor,
the insulating layers of the inner glass layer and the outer glass layers contain a dielectric glass material that contains a glass material containing at least K, B, and Si, quartz, and alumina,
the glass material content of each insulating layer of the inner glass layer ranges from approximately 60% to 65% by weight,
the quartz content of each insulating layer of the inner glass layer ranges from approximately 34% to 37% by weight, and
the alumina content of each insulating layer of the inner glass layer ranges from approximately 0.5% to 4% by weight.

2. The electronic component according to claim 1 , wherein
each of the primary coil conductor, the secondary coil conductor, the tertiary coil conductor, and the parallel primary coil conductor includes a coil pattern with two end portions, one end portion of the coil pattern being an inner end portion disposed inside the coil pattern, the other end portion of the coil pattern being an outer end portion disposed outside the coil pattern,
the inner end portions of the primary coil conductor and the secondary coil conductor are coupled to the bottom lead-out electrode layer through a first via-hole conductor and a second via-hole conductor disposed inside the coil pattern,
the inner end portions of the tertiary coil conductor and the parallel primary coil conductor are coupled to the top lead-out electrode layer through a third via-hole conductor and a fourth via-hole conductor disposed inside the coil pattern,
in a top view of the multilayer body, the first via-hole conductor and the second via-hole conductor at least partly overlap one of the third via-hole conductor and the fourth via-hole conductor, and
in all the coil conductor layers of the multilayer body, the number of via-hole conductors inside each coil pattern is two or less.

3. The electronic component according to claim 2 , wherein the coil patterns of the primary coil conductor layer and the parallel primary coil conductor layer almost overlap in a top view of the coil multilayer body.

4. The electronic component according to claim 2 , wherein the secondary coil conductor layer includes a plurality of secondary coil conductors having coil patterns that almost overlap in a top view of the coil multilayer body.

5. The electronic component according to claim 2 , wherein the tertiary coil conductor layer includes a plurality of tertiary coil conductors having coil patterns that almost overlap in a top view of the coil multilayer body.

6. The electronic component according to claim 2 , wherein the quartz content of each outer glass layer is lower than the quartz content of each insulating layer of the inner glass layer.

7. The electronic component according to claim 1 , wherein the coil patterns of the primary coil conductor layer and the parallel primary coil conductor layer almost overlap in a top view of the coil multilayer body.

8. The electronic component according to claim 1 , wherein the secondary coil conductor layer includes a plurality of secondary coil conductors having coil patterns that almost overlap in a top view of the coil multilayer body.

9. The electronic component according to claim 1 , wherein the tertiary coil conductor layer includes a plurality of tertiary coil conductors having coil patterns that almost overlap in a top view of the coil multilayer body.

10. The electronic component according to claim 1 , wherein the quartz content of each outer glass layer is lower than the quartz content of each insulating layer of the inner glass layer.

11. The electronic component according to claim 10 , wherein a difference between the quartz content of each outer glass layer and the quartz content of each insulating layer of the inner glass layer ranges from approximately 3% to 6% by weight.

12. The electronic component according to claim 1 , wherein the alumina content of each insulating layer of the inner glass layer ranges from approximately 0.6% to 1% by weight.

13. The electronic component according to claim 1 , wherein each of the outer glass layers has a thickness in the range of approximately 15 to 45 μm.

Assignees

• Murata Manufacturing Co

Inventors

• Matsuura Kouhei
• Hamano Morihiro
• Tsuduki Keiichi

Classifications

• H01F2017/0066

  with a magnetic layer · CPC title

• C04B35/00

  Shaped ceramic products characterised by their composition {(porous ceramic products C04B38/00; ceramic articles characterised by particular shape, see the relevant classes, e.g. linings for casting ladles, tundishes, cups or the like B22D41/02; ceramic substrates for microelectronic semi-conductors H10W70/692)}; Ceramics compositions ({shaping of ceramics B28B;} containing free metal bonded to carbides, diamond, oxides, borides, nitrides, silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides or sulfides other than as macroscopic reinforcing agents C22C); Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products {(infiltration of sintered ceramic preforms with molten metal C04B41/51; chemical preparation of powders of inorganic compounds C01)} · CPC title

• C03C3/04

  containing silica · CPC title

• C04B2235/365

  Borosilicate glass · CPC title

• H05K1/0306

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title