Coldplate with heat transfer module

Patent metadata

Field	Value
Publication number	US-11686539-B2
Application number	US-202016813202-A
Country	US
Kind code	B2
Filing date	Mar 9, 2020
Priority date	Mar 9, 2020
Publication date	Jun 27, 2023
Grant date	Jun 27, 2023

Abstract

A coldplate assembly includes a plurality of leak-tight conduit modules provided between a base and a cover to couple a first manifold cavity to a second manifold cavity. Each leak-tight conduit module includes a heat conducting structure and is pre-constructed and pre-tested prior to integration into the coldplate assembly. Each leak-tight conduit module is sealed only near the ends of the module that are disposed in the respective manifold cavity.

First claim

What is claimed is:

1. A coldplate assembly, comprising:
a base;
a first conduit module of a first predetermined length having a first opening and a second opening;
a first heat conducting structure provided within the first conduit module;
a cover coupled to the base to capture the first conduit module between the base and the cover and to enclose and define a first manifold cavity between the base and the cover, wherein the cover and base include one or more interconnects linearly arranged between the cover and the base,
wherein the first opening of the first conduit module is disposed in the first manifold cavity, and
wherein the first opening of the first conduit module is sealed, about a portion of its periphery, a respective first sealing length, less than the first conduit module predetermined length, from the first opening toward the second opening.

2. The coldplate assembly of claim 1 , wherein the sealed portion of the periphery of the first conduit module is within the first manifold cavity.

3. The coldplate assembly of claim 1 , wherein the first conduit module is one of:
vacuum brazed about a portion of its periphery to the base and cover;
sealed about a portion of its periphery to the base and cover by an adhesive; or
welded about a portion of its periphery to the base and cover.

4. The coldplate assembly of claim 1 , wherein the first heat conducting structure comprises one of: finstock, diffusion bonded cooling channels, or extruded tubes.

5. The coldplate assembly of claim 1 , further comprising:
a first groove defined in the base,
wherein the first conduit module is provided in the first groove.

6. The coldplate assembly of claim 1 , wherein the first conduit module comprises a leak-tight tube.

7. The coldplate assembly of claim 1 , further comprising:
a second manifold cavity defined between the base and the cover,
wherein the second opening of the first conduit module is disposed in the second manifold cavity,
wherein the second opening of the first conduit module is sealed, about a portion of its periphery, a respective second sealing length, less than the first conduit module predetermined length, from the second opening toward the first opening, and
wherein the first and second manifold cavities are fluidly coupled by the first conduit module.

8. The coldplate assembly of claim 1 , further comprising:
a second conduit module of a second predetermined length having a first opening and a second opening, provided between the base and the cover, the second conduit module first opening provided in the first manifold cavity; and
a second heat conducting structure provided within the second conduit module,
wherein the first opening of the second conduit module is sealed, about a portion of its periphery, a respective sealing length, less than the second conduit module predetermined length, from the first opening toward the second opening.

9. The coldplate assembly of claim 8 , wherein the sealed portion of the periphery of the second conduit module is within the first manifold cavity.

10. The coldplate assembly of claim 8 , wherein:
the first and second conduit modules have a same length, and
wherein the first and second respective sealing lengths are the same.

11. The coldplate assembly of claim 8 , wherein the second conduit module is one of:
vacuum brazed about a portion of its periphery to the base and cover;
sealed about a portion of its periphery to the base and cover by an adhesive; or
welded about a portion of its periphery to the base and cover.

12. A coldplate assembly, comprising:
a base;
a cover;
a first conduit module of a first predetermined length comprising:
a first opening;
a second opening; and
a heat conducting structure provided within the first conduit module;

the cover coupled to the base to capture the first conduit module between the base and cover and to form first and second enclosed manifold cavities between the base and the cover, wherein the cover and base include one or more interconnects linearly arranged between the cover and the base,
wherein the first opening of the first conduit module is disposed within the first manifold cavity and the second opening of the first conduit module is disposed within the second manifold cavity,
wherein the first opening of the first conduit module is sealed, about a portion of its respective periphery within the first manifold cavity, a respective first sealing length, less than the first conduit module predetermined length, from the respective first opening toward the respective second opening,
wherein the respective second opening of the first conduit module is sealed, about a portion of its respective periphery within the second manifold cavity, a respective second sealing length, less than the first conduit module predetermined length, from the respective second opening toward the respective first opening, and
wherein the first and second manifold cavities are fluidly coupled to one another by the first conduit module.

13. The coldplate assembly of claim 12 , wherein:
the first opening of the first conduit module is positioned within the enclosed first manifold cavity, and
wherein the second opening of the first conduit module is positioned within the enclosed second manifold cavity.

14. The coldplate assembly of claim 12 , wherein the first conduit module is one of:
vacuum brazed about a portion of its respective periphery within the first or second manifold cavity to the base and cover;
sealed about a portion of its respective periphery within the first or second manifold cavity to the base and cover by an adhesive; or
welded about a portion of its respective periphery within the first or second manifold cavity to the base and cover.

15. The coldplate assembly of claim 12 , wherein the first conduit module heat conducting structure comprises one of: finstock or diffusion bonded cooling channels.

16. The coldplate assembly of claim 12 , further comprising:
a first groove defined in the base,
wherein the first conduit module is provided in the first groove.

17. The coldplate assembly of claim 12 , wherein the first conduit module comprises a leak-tight tube.

18. The coldplate assembly of claim 12 , further comprising:
a second conduit module, of a second predetermined length, provided between the base and the cover, comprising:
a first opening;
a second opening; and
a heat conducting structure provided within the second conduit module,

wherein the second conduit module first opening is provided in the first manifold cavity and the second conduit module second opening is provided in the second manifold cavity,
wherein the first opening of the second conduit module is sealed, about its periphery within the first manifold cavity, a respective sealing length, less than the second conduit module predetermined length, from the respective first opening toward the respective second opening, and
wherein the second opening of the second conduit module is sealed, about its periphery within the second manifold cavity, a respective sealing length, less than the second conduit module predetermined length, from the second opening toward the first opening.

19. The coldplate assembly of claim 18 , wherein:
the first and second conduit modules have a same length, and
wherein the respective sealing lengths are the same.

20. The coldplate assembly of claim 18 , wherein the second conduit module is one of:
vacuum brazed about its respective periphery within the firs

Assignees

• Raytheon Co

Inventors

• Wilson James S
• Giesey James

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• F28F1/022

  with multiple channels · CPC title

• F28F3/12

  Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)} · CPC title

• F28F3/025

  the means being corrugated, plate-like elements · CPC title

• F28F9/026 Primary

  with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits · CPC title