Integrally stiffened bonded panel with vented pockets and methods of manufacture

US11685509B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11685509-B2
Application numberUS-202016882964-A
CountryUS
Kind codeB2
Filing dateMay 26, 2020
Priority dateOct 21, 2019
Publication dateJun 27, 2023
Grant dateJun 27, 2023

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Methods, systems, and apparatuses are disclosed for the manufacture of composite components having incorporated reinforcing structures machined into composite material substrates, and composite components manufactured according to disclosed methods, and assemblies and larger structures comprising the composite material components.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for forming a composite material component, said method comprising: orienting a plurality of composite material layers onto a tool to form a first composite material substrate, said first composite material substrate comprising a first composite material substrate thickness, said tool comprising a tooling surface, and said first composite material substrate further comprising: a first composite material substrate first surface, said first composite material substrate first surface positioned in contact with the tooling surface; a first composite material substrate second surface, said first composite material substrate second surface comprising an inner mold line; providing a second composite material substrate to the first composite material substrate second surface, said second composite material substrate comprising a second composite material substrate first surface and a second composite material substrate second surface, said second composite material substrate first surface configured to contact said first composite material substrate second surface; imparting said inner mold line from the first composite material substrate second surface to said second composite material substrate first surface; removing said second composite material substrate from said first composite material substrate second surface; at least partially curing the first composite material substrate; machining a plurality of recesses into the first composite material substrate second surface, said plurality of recesses configured to extend from the first composite material second surface to a predetermined distance into the first composite material substrate thickness to form a machined composite material substrate, said machined composite material substrate comprising a machined composite material substrate first surface and a machined composite material substrate second surface, said plurality of recesses each comprising a recess perimeter at the machined composite substrate material second surface; machining at least one channel into the first composite material substrate second surface, said at least one channel configured to intersect a plurality of recesses; orienting the second composite material substrate first surface onto the machined composite material substrate second surface; bonding the second composite material substrate first surface to the machined composite material substrate second surface to form a composite material component, said composite material component comprising at least one internal pathway; wherein said at least one internal pathway is bounded by the machined composite material substrate and the second composite material substrate first surface; and wherein said at least one internal pathway comprises a plurality of interconnected recesses. 2. The method of claim 1 , wherein the tooling surface comprises an outer mold line dimension, said method further comprising: forming the outer mold line dimension in the first composite material substrate first surface. 3. The method of claim 1 , wherein said at least one channel is configured to intersect more than two recesses. 4. The method of claim 1 , wherein at least one of the plurality of recesses comprises a geometric profile, said geometric profile comprising: at least one of a rectangle, a circle, an ellipse, a triangle, a polygon, an irregular shape, and combinations thereof. 5. The method of claim 1 , wherein the predetermined distance is equal to from about 10% to about 90% of the first composite material substrate thickness. 6. The method of claim 1 , wherein the predetermined distance is equal to from about 50% to about 80% of the first composite material substrate thickness. 7. The method of claim 1 , wherein the plurality of recesses are machined into the first composite material substrate in a predetermined pattern. 8. The method of claim 1 , wherein before the step of bonding the second composite material layer to the to the machined composite material substrate second surface to form a composite material component, the method further comprising: applying an adhesive material to at least one of the machined composite substrate material second surface, the recess perimeter, and the second composite material substrate first surface. 9. The method of claim 1 , wherein said at least one internal pathway comprises at least one channel intersecting the plurality of interconnected recesses. 10. The method of claim 1 , wherein said at least one internal pathway comprises a plurality of channels intersecting the plurality of interconnected recesses. 11. The method of claim 1 , wherein the at least one internal pathway comprises at least one sealed internal pathway. 12. The method of claim 9 , wherein said at least one internal pathway comprises a sealed internal pathway. 13. The method of claim 10 , wherein said at least one internal pathway comprises a sealed internal pathway.

Assignees

Inventors

Classifications

  • Fibrous or filamentary layer · CPC title

  • Carbon fibres, e.g. graphite fibres · CPC title

  • characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)} · CPC title

  • Wings · CPC title

  • Aircraft · CPC title

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Frequently asked questions

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What does patent US11685509B2 cover?
Methods, systems, and apparatuses are disclosed for the manufacture of composite components having incorporated reinforcing structures machined into composite material substrates, and composite components manufactured according to disclosed methods, and assemblies and larger structures comprising the composite material components.
Who is the assignee on this patent?
Boeing Co
What technology area does this patent fall under?
Primary CPC classification B64C3/26. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 27 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).