Conductive member module, and production method therefor

Patent metadata

Field	Value
Publication number	US-11685087-B2
Application number	US-202016866373-A
Country	US
Kind code	B2
Filing date	May 4, 2020
Priority date	Nov 6, 2017
Publication date	Jun 27, 2023
Grant date	Jun 27, 2023

Abstract

A conductive member module has a pair of conductive members formed in a plate shape and facing each other, and a sealing part. The conductive member module is produced by performing an accommodation step, a sealing step, and an extraction step. In the accommodation step, the two individual conductive members are sandwiched in the facing orientation thereof by outer support members abutting outer surfaces of the conductive members, and inner support members abutting inner surfaces of the conductive members. Outer recesses are formed in the outer surfaces by the outer support members, and inner recesses are formed in the inner surfaces by the inner support members. The outer recesses are deeper in the Z direction than the inner recesses.

First claim

What is claimed is:

1. A method for producing a conductive member module having a pair of conductive members formed in a plate shape and facing each other, and a sealing part for sealing the pair of conductive members, the method comprising performing:
an accommodation step of accommodating the pair of conductive members in a molding die in a state of being separated from each other,
a sealing step of injecting a fluid resin into the die to seal the pair of conductive members, and
an extraction step of extracting the conductive member module from the die;
wherein in the accommodation step, the individual conductive members are held in the die while they are sandwiched in a facing orientation of the pair of conductive members by outer support members abutting outer surfaces of the conductive members in the facing orientation, and inner support members abutting inner surfaces of the conductive members in the facing orientation,
outer recesses are formed in the outer surfaces by the outer support members,
inner recesses are formed in the inner surfaces by the inner support members,
the outer recesses are deeper in the facing orientation than the inner recesses, and
the outer recesses have a smaller area when viewed from the facing orientation than that of the inner recesses.

2. The method for producing a conductive member module according to claim 1 , wherein the outer recesses each have an inner peripheral surface that is inclined so as to approach the center of the outer recess toward the inner surface side in the facing orientation.

3. The method for producing a conductive member module according to claim 1 , wherein the outer support members and the inner support members are formed separately from the die.

4. The method for producing a conductive member module according to claim 3 , wherein at least either the outer support members or the inner support members also serve as release pins for releasing the conductive member module from the die in the extraction step.

Assignees

• Denso Corp

Inventors

• Kurita Akifumi
• Yoshimura Yohei
• Tanabe Ryota

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W74/016

  using moulds · CPC title

• H10W70/479 Primary

  on or in insulating or insulated package substrates, interposers, or redistribution layers · CPC title

• H01L25/16

  Electricity · mapped topic