Inductor component and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-11682519-B2
Application number	US-201815888356-A
Country	US
Kind code	B2
Filing date	Feb 5, 2018
Priority date	Aug 5, 2015
Publication date	Jun 20, 2023
Grant date	Jun 20, 2023

Abstract

A coil electrode included in an inductor component includes a plurality of metal pins upper end surfaces of which are exposed to the upper surface of a resin layer and lower end surfaces of which are exposed to a lower surface of the resin layer, and a plurality of wiring patterns that connect the upper end surfaces or the lower end surfaces of the predetermined metal pins, wherein surface roughnesses of the upper surface and the lower surface of the resin layer are larger than surface roughnesses of the upper end surfaces and the lower end surfaces of the respective metal pins, and wiring patterns are respectively formed on the upper and lower surfaces of the resin layer by plating.

First claim

The invention claimed is:

1. An inductor component comprising a resin layer and an inductor electrode,
wherein the inductor electrode includes:
a first columnar conductor arranged in the resin layer so that an end surface of the first columnar conductor is exposed to a main surface of the resin layer; and
a plating layer having a portion making contact with the end surface of the first columnar conductor and a portion making contact with the main surface of the resin layer,

wherein surface roughness of the main surface of the resin layer is larger than surface roughness of the end surface of the first columnar conductor.

2. The inductor component according to claim 1 ,
wherein the plating layer includes a first metal film arranged on the main surface of the resin layer and a second metal film laminated on the first metal film.

3. The inductor component according to claim 2 ,
wherein the plating layer and the first columnar conductor contain the same metal as main components.

4. The inductor component according to claim 2 ,
wherein the inductor electrode further includes a second columnar conductor arranged in the resin layer so that an end surface is exposed to the main surface of the resin layer, and
wherein the plating layer further has a portion making contact with the end surface of the second columnar conductor and connects the first columnar conductor and the second columnar conductor.

5. The inductor component according to claim 2 ,
wherein the plating layer has a cross-sectional shape that becomes enlarged in a direction away from the main surface of the resin layer.

6. The inductor component according to claim 1 ,
wherein a main component of the plating layer is metal, and a main component of the first columnar conductor is the same metal.

7. The inductor component according to claim 6 ,
wherein the main component is copper.

8. The inductor component according to claim 7 ,
wherein the inductor electrode further includes a second columnar conductor arranged in the resin layer so that an end surface is exposed to the main surface of the resin layer, and
wherein the plating layer further has a portion making contact with the end surface of the second columnar conductor and connects the first columnar conductor and the second columnar conductor.

9. The inductor component according to claim 7 ,
wherein the plating layer has a cross-sectional shape that becomes enlarged in a direction away from the main surface of the resin layer.

10. The inductor component according to claim 6 ,
wherein the inductor electrode further includes a second columnar conductor arranged in the resin layer so that an end surface is exposed to the main surface of the resin layer, and
wherein the plating layer further has a portion making contact with the end surface of the second columnar conductor and connects the first columnar conductor and the second columnar conductor.

11. The inductor component according to claim 6 ,
wherein the plating layer has a cross-sectional shape that becomes enlarged in a direction away from the main surface of the resin layer.

12. The inductor component according to claim 1 ,
wherein the inductor electrode further includes a second columnar conductor arranged in the resin layer so that an end surface is exposed to the main surface of the resin layer, and
wherein the plating layer further has a portion making contact with the end surface of the second columnar conductor and connects the first columnar conductor and the second columnar conductor.

13. The inductor component according to claim 12 ,
wherein a coil core is arranged between the first columnar conductor and the second columnar conductor.

14. The inductor component according to claim 12 ,
wherein the plating layer has a cross-sectional shape that becomes enlarged in a direction away from the main surface of the resin layer.

15. The inductor component according to claim 1 ,
wherein the plating layer has a cross-sectional shape that becomes enlarged in a direction away from the main surface of the resin layer.

16. The inductor component according to claim 1 ,
wherein the first columnar conductor is a metal pin.

17. The inductor component according to claim 16 ,
wherein a resistance of the metal pin is lower than a resistance of a conductor formed by conductive paste.

18. The inductor component according to claim 16 ,
wherein a resistance of the inductor electrode is lower than a resistance of an inductor electrode having a conductor formed by conductive paste.

19. The inductor component according to claim 16 ,
wherein a Q value of the inductor electrode is higher than a Q value of an inductor electrode having a conductor formed by conductive paste.

20. A method for manufacturing an inductor component that includes a resin layer and an inductor electrode having a first columnar conductor arranged in the resin layer and a wiring electrode formed on a main surface of the resin layer, the method comprising:
arranging the first columnar conductor in the resin layer containing a filler;
polishing or grinding the main surface of the resin layer to expose an end surface of the first columnar conductor to the main surface; and
forming, on the main surface of the resin layer by plating, the wiring electrode having a portion making contact with the end surface of the first columnar conductor and a portion making contact with the main surface of the resin layer,
wherein in the polishing or grinding, the filler in the main surface of the resin layer is shed at the time of polishing or grinding to make surface roughness of the main surface of the resin layer be larger than surface roughness of the end surface of the first columnar conductor.

21. The method for manufacturing the inductor component according to claim 9 ,
wherein the forming of the wiring electrode includes:
forming a first metal film coating substantially all of the main surface of the resin layer by non-electrolytic plating;
laminating a second metal film on the first metal film by electrolytic plating;
coating, with a resist film, a region of the second metal film in which the wiring electrode is to be formed; and
removing a portion of the first metal film and the second metal film, which is not coated with the resist film, by etching.

22. The method for manufacturing the inductor component according to claim 9 ,
wherein the forming of the wiring electrode includes:
forming a first metal film coating substantially all of the main surface of the resin layer by non-electrolytic plating;
coating, with a resist film, a portion of the first metal film other than a portion in which the wiring electrode is to be formed;
laminating a second metal film on a portion of the first metal film, which is not coated with the resist film, by electrolytic plating;
removing the resist film; and
removing a portion of the first metal film, which has been coated with the resist film, by etching.

23. The method for manufacturing the inductor component according to claim 9 ,
wherein the forming of the wiring electrode includes:
forming a first metal film coating substantially all of the main surface of the resin layer by non-electrolytic plating;
coating, with a resist film, a portion of the first metal film in which the wiring electrode is to be formed;
removing a portion of the first metal film, which is not coated with the resist film, by etching;
removing the resist film;

Assignees

• Murata Manufacturing Co

Inventors

• Mizushiro Masaaki

Classifications

• H05K1/16

  incorporating printed electric components, e.g. printed resistors, capacitors or inductors · CPC title

• H01F41/041 Primary

  Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title

• H01F17/062

  Toroidal core with turns of coil around it · CPC title

• H01F27/24

  Magnetic cores · CPC title

• H01F2027/2809

  on stacked layers · CPC title