Opto electrical test measurement system for integrated photonic devices and circuits

US11680870B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11680870-B2
Application numberUS-202117516165-A
CountryUS
Kind codeB2
Filing dateNov 1, 2021
Priority dateApr 20, 2016
Publication dateJun 20, 2023
Grant dateJun 20, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An optical testing circuit on a wafer includes an optical input configured to receive an optical test signal and photodetectors configured to generate corresponding electrical signals in response to optical processing of the optical test signal through the optical testing circuit. The electrical signals are simultaneously sensed by a probe circuit and then processed. In one process, test data from the electrical signals is simultaneously generated at each step of a sweep in wavelength of the optical test signal and output in response to a step change. In another process, the electrical signals are sequentially selected and the sweep in wavelength of the optical test signal is performed for each selected electrical signal to generate the test data.

First claim

Opening claim text (preview).

The invention claimed is: 1. An integrated circuit including a testing circuit, said testing circuit comprising an optical test circuit having: an optical input configured to receive an optical test signal; a test channel configured to receive said optical test signal, split the optical test signal into a first optical signal and a second optical signal, and produce an optical test output signal in response to processing of the first optical signal through at least one optical device under test circuit, said test channel further including a first photodetector coupled to receive said optical test output signal and generate a first electrical signal and a second photodetector coupled to receive said second optical signal and generate a second electrical signal; and first and second electrical outputs for outputting said first and second electrical signals, respectively. 2. The integrated circuit of claim 1 , wherein the at least one optical device under test circuit comprises a plurality of series coupled optical device under test circuits. 3. The integrated circuit of claim 1 , wherein the test channel comprises a further photodetector coupled to receive the optical test signal and generate a further electrical signal, the optical test circuit further including a further electrical output for outputting said further electrical signal. 4. The integrated circuit of claim 1 , wherein the test channel comprises a further photodetector coupled to receive the optical test output signal and generate a further electrical signal, the optical test circuit further including a further electrical output for outputting said further electrical signal. 5. A wafer, comprising: a plurality of integrated circuits separated by a scribe line; a testing circuit; wherein said testing circuit comprises an optical test circuit having: an optical input located within the scribe line and configured to receive an optical test signal; a test channel located within the scribe line and configured to receive said optical test signal and produce an optical test output signal in response to processing of the optical test signal through at least one optical device under test circuit; a photodetector located within the scribe line and coupled to receive said optical test output signal and generate an electrical signal; and an electrical output for outputting said electrical signal. 6. The wafer of claim 5 , wherein the at least one optical device under test circuit comprises a plurality of series coupled optical device under test circuits located within the scribe line. 7. The wafer of claim 5 , wherein the test channel comprises a further photodetector located within the scribe line and coupled to receive the optical test signal and generate a further electrical signal, the optical test circuit further including a further electrical output for outputting said further electrical signal. 8. The wafer of claim 5 , wherein the test channel comprises a further photodetector located within the scribe line and coupled to receive the optical test output signal and generate a further electrical signal, the optical test circuit further including a further electrical output for outputting said further electrical signal.

Assignees

Inventors

Classifications

  • G01M11/02Primary

    Testing optical properties · CPC title

  • Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings · CPC title

  • of integrated circuits {(G01R31/31728 takes precedence)} · CPC title

  • utilising prism or grating {(G02B6/293 takes precedence)} · CPC title

  • G01M11/33Primary

    with a light emitter being disposed at one fibre or waveguide end-face, and a light receiver at the other end-face · CPC title

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What does patent US11680870B2 cover?
An optical testing circuit on a wafer includes an optical input configured to receive an optical test signal and photodetectors configured to generate corresponding electrical signals in response to optical processing of the optical test signal through the optical testing circuit. The electrical signals are simultaneously sensed by a probe circuit and then processed. In one process, test data f…
Who is the assignee on this patent?
St Microelectronics Crolles 2 Sas
What technology area does this patent fall under?
Primary CPC classification G01M11/02. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jun 20 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).