Polymer fine particle-containing curable resin composition having improved storage stability
US-2016244603-A1 · Aug 25, 2016 · US
Low-temperature heat-curable adhesive composition for structure
US11680193B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11680193-B2 |
| Application number | US-201816497552-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 23, 2018 |
| Priority date | Mar 27, 2017 |
| Publication date | Jun 20, 2023 |
| Grant date | Jun 20, 2023 |
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- Title
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Abstract
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Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.
First claim
Opening claim text (preview).
The invention claimed is: 1. A low-temperature heat-curable adhesive composition for structures, comprising: (A) an epoxy resin; (B) a micro-encapsulated curing agent; (C) a hygroscopic agent; (D) a viscosity modifier; and (E) a stabilizer, wherein the (C) hygroscopic agent comprises surface-treated calcium oxide and non-surface-treated calcium oxide. 2. The low-temperature heat-curable adhesive composition for structures according to claim 1 , wherein a minimum value of a complex viscosity during warming in dynamic viscoelasticity measurement with a strain of 1% or less after an open-state standing is 200 Pa·s or less.
Assignees
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Classifications
of metals · CPC title
involving heating of the applied adhesive · CPC title
Joining sub-units or components to, or positioning sub-units or components with respect to, body shell or other sub-units or components · CPC title
of calcium, strontium or barium · CPC title
Silica · CPC title
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- What does patent US11680193B2 cover?
- Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temper…
- Who is the assignee on this patent?
- Cemedine Co Ltd, Mazda Motor
- What technology area does this patent fall under?
- Primary CPC classification C09J163/00. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jun 20 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).