Assembling device

Patent metadata

Field	Value
Publication number	US-11679457-B2
Application number	US-202016947999-A
Country	US
Kind code	B2
Filing date	Aug 27, 2020
Priority date	Sep 30, 2019
Publication date	Jun 20, 2023
Grant date	Jun 20, 2023

Abstract

An assembling device includes a holding member and a processing device. The holding member is configured to hold a first assembly component and a second assembly component. The processing device is configured to process a first excess thickness portion and a second excess thickness portion. The first excess thickness portion is provided at the first assembly component and is configured to adjust a gap between the first assembly component and the second assembly component. The second excess thickness portion is provided at the second assembly component and is configured to adjust the gap.

First claim

The invention claimed is:

1. An assembling device comprising:
a holding member configured to hold a first assembly component and a second assembly component; and
an NC processing machine including a cutting tool or a grinding tool and configured to process a first excess thickness portion and a second excess thickness portion, the first excess thickness portion being provided at the first assembly component and being configured to adjust a gap between the first assembly component and the second assembly component, the second excess thickness portion being provided at the second assembly component and being configured to adjust the gap,
wherein the assembling device is configured to fasten the first assembly component and the second assembly component by a fastener with the first excess thickness portion and the second excess thickness portion being in direct contact,
wherein the NC processing machine is configured to form a first position aligner at the first excess thickness portion and to form a second position aligner at the second excess thickness portion, the first position aligner being configured to perform aligning of the first excess thickness portion and the second excess thickness portion in a direction orthogonal to a direction in which the first assembly component and the second assembly component face each other, the second position aligner being provided in correspondence with the first position aligner.

2. The assembling device according to claim 1 , wherein the NC processing machine is configured to process the first excess thickness portion and the second excess thickness portion with reference to a reference position existing on the holding member.

3. The assembling device according to claim 2 , wherein the NC processing machine is configured to process the first excess thickness portion and the second excess thickness portion on a basis of a design shape of the first assembly component and a design shape of the second assembly component.

4. The assembling device according to claim 2 , wherein the NC processing machine is configured to process a height of the first excess thickness portion in the vertical direction by adding a value that is greater than or equal to a deviation caused by effects of manufacturing errors or distortions of the first assembly component to a design shape of the first excess thickness.

5. The assembling device according to claim 4 , wherein the NC processing machine is configured to process a height of the second excess thickness portion in the vertical direction by adding a value that is greater than or equal to the deviation caused by effects of manufacturing errors or distortions of the second assembly component to a design shape of the second excess thickness.

6. The assembling device according to claim 1 , wherein the NC processing machine is configured to process the first excess thickness portion and the second excess thickness portion on a basis of a design shape of the first assembly component and a design shape of the second assembly component.

7. The assembling device according to claim 1 , wherein the NC processing machine is configured to process a height of the first excess thickness portion in the vertical direction by adding a value that is greater than or equal to a deviation caused by effects of manufacturing errors or distortions of the first assembly component to a design shape of the first excess thickness.

8. The assembling device according to claim 7 , wherein the NC processing machine is configured to process a height of the second excess thickness portion in the vertical direction by adding a value that is greater than or equal to the deviation caused by effects of manufacturing errors or distortions of the second assembly component to a design shape of the second excess thickness.

9. The assembling device according to claim 1 , wherein the holding member comprises a first holding member and a second holding member, the first holding member holding a panel, the first assembly component, and the second assembly component, the second holding member holding the second assembly component in an assembly orientation at a location above the second assembly component, the first holding member being disposed below the panel and the first assembly component in a vertical direction, the second holding member being disposed above the second assembly component in a vertical direction.

10. The assembling device according to claim 9 , wherein the NC processing machine is configured to process the first excess thickness portion and the second excess thickness portion with reference to a reference position existing on the second holding member.

11. The assembling device according to claim 1 , wherein the first position aligner includes a hollow portion and the second position aligner includes a protrusion, and
wherein in a state that the first member and the second member are fastened, the protrusion of the second position aligner is inserted into the hollow portion of the first position aligner.

Assignees

• Subaru Corp

Inventors

• Sato Yoichi
• Kikuchi Marosuke

Classifications

• Y10T29/49998

  Work holding · CPC title

• B23P13/00

  Making metal objects by operations essentially involving machining but not covered by a single other subclass (making specific objects B23P15/00) · CPC title

• Y10T29/49748

  by shaping, e.g., bending, extruding, turning, etc. · CPC title

• Y10T29/49996

  Successive distinct removal operations · CPC title

• Y10T29/49726

  Removing material · CPC title