Thermal interface apparatus for PCI express M.2 printed circuit assemblies

Patent metadata

Field	Value
Publication number	US-11678465-B2
Application number	US-201817277772-A
Country	US
Kind code	B2
Filing date	Nov 8, 2018
Priority date	Nov 8, 2018
Publication date	Jun 13, 2023
Grant date	Jun 13, 2023

Abstract

In some embodiments, an apparatus comprises an integrated circuit module comprising two layers of thermal interface material, a printed circuit assembly disposed between the two layers of thermal interface material and comprising a plurality of integrated circuits disposed on both sides of a circuit board, wherein at least one of the integrated circuits is thermally coupled with one of the layers of thermal interface material, and two heat spreaders adapted to removably retain one another, and when retaining one another to enclose and become thermally coupled with the two layers of thermal interface material; and a printed circuit board having a connector disposed thereon, wherein a connector edge of the printed circuit assembly is disposed within the connector. In other embodiments, a frame is adapted to retain the two heat spreaders.

First claim

What is claimed is:

1. An apparatus comprising:
an integrated circuit module comprising
two layers of thermal interface material,
a printed circuit assembly disposed between the two layers of thermal interface material and comprising a plurality of integrated circuits disposed on both sides of a circuit board, wherein at least one of the integrated circuits is thermally coupled with one of the layers of thermal interface material,
two heat spreaders adapted to removably retain one another, and when retaining one another to enclose and become thermally coupled with the two layers of thermal interface material, and
a heat sink thermally coupled to a first one of the heat spreaders; and

a printed circuit board having a connector disposed thereon, wherein a connector edge of the printed circuit assembly is disposed within the connector.

2. The apparatus of claim 1 , wherein:
the printed circuit assembly is a PCI Express M.2 printed circuit assembly;
the connector is a PCI Express M.2 connector; and
the printed circuit board is a PCI printed circuit board.

3. The apparatus of claim 1 , wherein:
a first one of the heat spreaders is thermally coupled to the printed circuit board.

4. The apparatus of claim 1 , further comprising:
a further heat sink thermally coupled to a second one of the heat spreaders.

5. The apparatus of claim 4 , wherein:
the integrated circuit module is disposed in a through-hole of the printed circuit board;
the heat sink is mechanically attached to a first side of the printed circuit board; and
the further heat sink is mechanically attached to a second side of the printed circuit board.

6. The apparatus of claim 1 , wherein:
a first one of the heat spreaders includes at least one tab; and
a second one of the heat spreaders includes at least one void;
wherein the heat spreaders retain one another when the tab is disposed within the void.

7. An apparatus comprising:
an integrated circuit module comprising
two layers of thermal interface material,
a printed circuit assembly disposed between the two layers of thermal interface material and comprising a plurality of integrated circuits disposed on both sides of a circuit board, wherein at least one of the integrated circuits is thermally coupled with one of the layers of thermal interface material,
two heat spreaders, and
a frame to removably retain the two heat spreaders such that the two heat spreaders enclose and become thermally coupled with the two layers of thermal interface material, and
a heat sink thermally coupled to a first one of the heat spreaders; and

a printed circuit board having a connector disposed thereon, wherein a connector edge of the printed circuit assembly is disposed within the connector.

8. The apparatus of claim 7 , wherein:
the printed circuit assembly is a PCI Express M.2 printed circuit assembly;
the connector is a PCI Express M.2 connector; and
the printed circuit board is a PCI printed circuit board.

9. The apparatus of claim 7 , wherein:
a first one of the heat spreaders is thermally coupled to the printed circuit board.

10. The apparatus of claim 7 , further comprising:
a further heat sink thermally coupled to a second one of the heat spreaders.

11. The apparatus of claim 10 , wherein:
the integrated circuit module is disposed in a through-hole of the printed circuit board;
the heat sink is mechanically attached to a first side of the printed circuit board; and
the further heat sink is mechanically attached to a second side of the printed circuit board.

12. The apparatus of claim 7 , wherein:
each of the heat spreaders includes at least one tab; and
the frame includes at least one void;
wherein the frame retains the heat spreaders when the tab is disposed within the void.

13. A method comprising:
providing an integrated circuit module comprising
providing two layers of thermal interface material,
disposing a printed circuit assembly between the two layers of thermal interface material, such that at least one integrated circuit disposed upon the printed circuit assembly is thermally coupled with one of the layers of thermal interface material, and
removably enclosing the printed circuit assembly and the two layers of thermal interface material within two heat spreaders, such that the heat spreaders become thermally coupled with the two layers of thermal interface material;
thermally coupling a heat sink to a first one of the heat spreaders;
providing a printed circuit board having a connector disposed thereon; and
disposing a connector edge of the printed circuit assembly within the connector.

14. The method of claim 13 , wherein:
the printed circuit assembly is a PCI Express M.2 printed circuit assembly;
the connector is a PCI Express M.2 connector; and
the printed circuit board is a PCI printed circuit board.

15. The method of claim 13 , wherein:
thermally coupling a first one of the heat spreaders to the printed circuit board.

16. The method of claim 13 , further comprising:
thermally coupling a further heat sink to a second one of the heat spreaders.

17. The method of claim 16 , wherein:
disposing the integrated circuit module in a through-hole of the printed circuit board;
mechanically attaching the heat sink to a first side of the printed circuit board; and
mechanically attaching the further heat sink to a second side of the printed circuit board.

Assignees

• Hewlett Packard Entpr Dev Lp

Inventors

• Conn Kevin
• Tsai Pinche
• Sauer Keith

Classifications

• H05K7/20

  Modifications to facilitate cooling, ventilating, or heating · CPC title

• H05K7/2039 Primary

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H05K7/20454 Primary

  with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste · CPC title

• G06F1/20

  Cooling means · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title